Patents by Inventor Hua Chen

Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240243114
    Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Mao-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Kuan-Lin Chen, Chun-Chieh Wang
  • Publication number: 20240244172
    Abstract: Techniques related to viewport selection in immersive video contexts are discussed. Such techniques include generating multiple viewport predictions each for a future time interval and based on different prediction models, ranking the viewport predictions using error descriptors of the prediction models, selecting a viewport prediction for the future time intervals using the ranking, and correcting the selected viewport predictions using the error descriptors.
    Type: Application
    Filed: March 18, 2021
    Publication date: July 18, 2024
    Applicant: Intel Corporation
    Inventors: Ying Luo, Hua Zhang, Xiaomin Chen, Xin Kang
  • Patent number: 12040309
    Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: July 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
  • Patent number: 12040234
    Abstract: A method for fabricating a semiconductor device includes the steps of forming a metal gate on a substrate, a spacer around the metal gate, and a first interlayer dielectric (ILD) layer around the spacer, performing a plasma treatment process to transform the spacer into a first bottom portion and a first top portion, performing a cleaning process to remove the first top portion, and forming a second ILD layer on the metal gate and the first ILD layer.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: July 16, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Fan Li, Po-Ching Su, Yu-Fu Wang, Min-Hua Tsai, Ti-Bin Chen, Chih-Chiang Wu, Tzu-Chin Wu
  • Patent number: 12040827
    Abstract: The present disclosure provides a case for an electronic device and a magnetic assembly. The case includes a side wall, a back wall connected with the side wall to define a receiving cavity for receiving the electronic device, and a magnetic assembly, the magnetic assembly includes a support member connected with the side wall or the back wall, and a magnetic alignment member, the support member is capable of moving relative to the side wall or the back wall, so as to support the case, the magnetic alignment member is detachably or fixedly connected with the support member connected with the back wall or the side wall. The case of the present disclosure is convenient to use.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: July 16, 2024
    Assignee: SHENZHEN LANHE TECHNOLOGIES CO., LTD.
    Inventors: Hua Yang, Yong Chen, Liren Luo, Jianhua Liu, Zhengfeng Yang, Zhijun Liang, Churong Tang, Haisong Qiu, Zhuoting Ye
  • Patent number: 12039966
    Abstract: Managing noise during an online conference session includes obtaining audio data from an endpoint participating in an online conference session. The audio data is derived from audio captured at the endpoint that includes musical sounds. The audio data is processed to identify a portion of the audio data in which a decibel level of the musical sounds is stable for a period of time. Non-musical noise present, if any, in the audio data with the musical sounds is identified and the non-musical noise is attenuated from the audio data to generate noise-reduced musical audio data. The noise-reduced musical audio data is transmitted for play out at one or more other endpoints participating in the online conference session.
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: July 16, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Bjørn Winsvold, Eric Yi-hua Chen, Wei-Lien Hsu, Pi-Hsin Liu
  • Patent number: 12033307
    Abstract: This disclosure provides for methods and a system for multiple instance segmentation and tracking. According to an aspect a method is provided. The method includes sending an image to a backbone network and generating image feature outputs. The method further includes sending the image feature outputs to a spatial attention module for generating a feature map associated with objects in the image. The method further includes sending the feature map to a category feature module for generating an instance category output indicating the objects. The method further includes sending the image feature outputs to a mask generating module for generating masks. The method further includes generating: the instance category output via the category feature module, and the masks via the mask generating module. In some embodiments, the method further includes generating re-identification embedding information associated with the objects based on image feature outputs.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: July 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Qiang Tang, Vishnu Sanjay Ramiya Srinivasan, Shao Hua Chen, Zhan Xu
  • Publication number: 20240216912
    Abstract: A microfluidic device is described. The microfluidic device comprises a reaction chamber and a temperature control module overlaying the reaction chamber. The temperature control module comprises a temperature regulating flow channel disposed between two layers and in thermal contact with the reaction chamber, and wherein at least a portion of each layer comprises an optically transparent material. Also described is a method of manufacturing a microfluidic device and a method of controlling temperature of a reaction in a microfluidic device.
    Type: Application
    Filed: April 30, 2021
    Publication date: July 4, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Cumbie, Viktor Shkolnikov, Chien-Hua Chen
  • Publication number: 20240218193
    Abstract: A conductive composite film has four layers: (A) a substrate, (B) a silicone based reactive layer, (C) at least one conductive layer and (D) a silicone encapsulant layer, and the silicone based reactive layer is formed from curable organosiloxane composition.
    Type: Application
    Filed: April 22, 2022
    Publication date: July 4, 2024
    Inventors: Chen-Yang SHIANG, I-Hua CHEN
  • Patent number: 12029007
    Abstract: A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: July 2, 2024
    Assignee: WISTRON CORPORATION
    Inventors: Hua Chen, Sheng-Yen Lin, Chuan-Yi Liang
  • Publication number: 20240214852
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus is a UE. The UE receives, from a base station, a measurement configuration for measuring cross-link interference (CLI) in a subband full-duplexing (SBFD) slot and a reporting configuration for reporting the CLI. The UE performs measurements of the CLI on measurement resources indicated by the measurement configuration. The UE reports an indication of the measured CLI to the base station according to the reporting configuration.
    Type: Application
    Filed: December 19, 2023
    Publication date: June 27, 2024
    Inventors: Rama Kiran, Chandrasekaran Mohandoss, Jinesh Parameshwaran Nair, Chien-Hua Chen, Yih-Shen Chen
  • Patent number: 12017342
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: June 25, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien-Fa Lee, Feng-Kuang Wu, Fu-Cheng Hung, Chi-Wei Chen, Chih-Hua Chen
  • Publication number: 20240202964
    Abstract: A set of unordered points associated with road markings is received. The unordered points are inputted to a trained artificial neural network. Using the artificial neural network, an output is generated by applying non-linear regression to the unordered points. Based on the output, a pose of a vehicle is determined.
    Type: Application
    Filed: December 16, 2022
    Publication date: June 20, 2024
    Inventors: James Gregson, Shao Hua Chen
  • Publication number: 20240196564
    Abstract: An immersion cooling device includes a housing, at least one heating component, at least one heat dissipation component, and at least one fluid-driving unit. The housing includes a tank and at least one cover and has a containing structure. The heating component is located in the containing structure. The immersion cooling device is adapted to cool the heating component in a single phase. The heat dissipation component is disposed on the heating component. The cover has a flow-guiding structure and covers the heat dissipation component, such that the heat dissipation component is located in the flow-guiding structure. The fluid-driving unit is connected to the cover. The flow-guiding structure communicates between the fluid-driving unit and the containing structure. Additionally, an active heat dissipation module and an active flow-guiding module are also provided.
    Type: Application
    Filed: March 8, 2023
    Publication date: June 13, 2024
    Applicant: Wistron Corporation
    Inventors: Shao-Jen Chu, Yu Chuan Wu, Hua Chen, Chuan-Yi Liang
  • Publication number: 20240192599
    Abstract: A photo-definable hydrophobic composition (“composition”) is presented. The composition can include from about 0.01 wt % to about 20 wt % of a polyether modified siloxane and from about 80 wt % to about 99.99 wt % of a polymeric photoresist. The polymeric photoresist can be selected from an epoxy-based photoresist, a bisbenzocyclobutene-based photoresist, a polyimide-based photoresist, a polybenzoxazole-based photoresist, a polyimide-polybenzoxazole-based photoresist, an admixture, or a combination thereof.
    Type: Application
    Filed: April 15, 2021
    Publication date: June 13, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Bo Song, Chien-Hua Chen, Michael G. Groh
  • Patent number: 12009322
    Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.
    Type: Grant
    Filed: February 13, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen, Ming-Da Cheng, Ching-Hua Hsieh, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 12008091
    Abstract: A system and method for authenticating a user via a single voice audio input is disclosed. The method includes obtaining voice audio from a user, converting the voice audio to text, comparing at least a portion of the text to a database, determining whether a user profile exists in the database based on the comparing, the user profile including a voiceprint, in response to determining that the user profile exists in the database, analyzing the voice audio against the voiceprint of the user profile; and authenticating the user based on the voice audio substantially matching the voiceprint of the user profile.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: June 11, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventor: Eric Yi-Hua Chen
  • Publication number: 20240186724
    Abstract: An antenna module includes an antenna box and a first connection wire. The antenna box can include a first antenna, a second antenna, a first connection terminal, a second connection terminal and a housing. The first and second antennas are located in the housing and the housing has a first opening collectively exposing a portion of the first connection terminal and a portion of the second connection terminal. Each of the first and second antennas is adapted to receive or transmit wireless signals according to one of a plurality of wireless communication standards and the first and second antennas are electrically connected to the first and second connection terminals, respectively. The wireless communication standards can be different from each other.
    Type: Application
    Filed: November 6, 2023
    Publication date: June 6, 2024
    Inventors: Tsai-Yi Yang, Yung-Sheng Tseng, Bo-Yuan Chang, Sheng-Shen Chang, Yu-Hua Chen, Shih-Shih Chien, En-Chin Wei
  • Publication number: 20240173438
    Abstract: Disclosed herein are second near-infrared (NIR-II) fluorescent composite and its production method. The method mainly includes the steps of, mixing a gold nanocluster having a plurality of a thiol-based compound on its outer surface and alpha-glycerylphosphorylcholine (alpha-GPC) in a solvent to form a mixture; replacing the solvent with an inert gas; and heating the mixture at a temperature about 100-200° C. in the presence of the inert gas until at least a portion of the gold nanocluster is encapsulated by a capping layer consisting of alpha-GPC, thereby producing the NIR-II fluorescent composite. The thus-produced NIR-II fluorescent composite is characterized by having an emission wavelength covering NIR-II region detectable by specialized camera. Also encompassed in the present disclosure is a method for conducting in vivo bioimaging of a target area in a subject.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: Chung Yuan Christian University
    Inventors: Cheng-An LIN, Yi-Tang SUN, Min-Hua CHEN
  • Publication number: 20240178967
    Abstract: Apparatus and methods are provided downlink and uplink CSI and power control for subband full duplex (SBFD) system. In one novel aspect, two CSI-RS configurations are configured for DL CSI, one for the DL-only slots and one for the SBFD slots. In one embodiment, the UE performs channel estimation individually using the CSI-RS configured for the DL-only slots and the SBFD slots. In another embodiment, the CSI-RS signals are periodic or aperiodic. The periodicity of CSI-RS for SBFD slots and DL-only slots are different. In one embodiment, the UE receives a first SRS configuration for UL-only slots and a second SRS configuration for the SBFD slots, transmits the SRS signals on UL-only slots and SBFD slots based on the first SRS configuration and the second SRS configuration. In another novel aspect, the UE receives two different sets of power control parameters for UL-only slots and the SBFD slots.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 30, 2024
    Inventors: Chandrasekaran Mohandoss, Chien-Hua Chen, Yih-Shen Chen