Patents by Inventor Hua Chen

Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240266316
    Abstract: An embodiment is a device including a substrate comprising conductive pads, a package component bonded to the conductive pads of the substrate with solder connectors, the package component comprising an integrated circuit die, the integrated circuit die comprising die connectors, one of the solder connectors coupled to each of the die connectors and a corresponding conductive pad of the substrate, a first dielectric layer laterally surrounding each of the die connectors and a portion of the solder connectors, and a second dielectric layer being between the first dielectric layer and the substrate, the second dielectric layer laterally surrounding each of the conductive pads of the substrate.
    Type: Application
    Filed: June 5, 2023
    Publication date: August 8, 2024
    Inventors: Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Chao-Wei Chiu, Hsin Liang Chen
  • Publication number: 20240262681
    Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
    Type: Application
    Filed: April 19, 2024
    Publication date: August 8, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yang-Che CHEN, Victor Chiang LIANG, Chen-Hua LIN, Chwen-Ming LIU, Huang-Wen TSENG, Yi-Chuan TENG
  • Publication number: 20240266166
    Abstract: A low thermal budget dielectric material treatment is provided. An example method of the present disclosure includes providing a semiconductor structure, depositing a dielectric material over the semiconductor structure, treating the dielectric material with a gaseous species carried in a supercritical fluid, and after the treating, reducing a thickness of the dielectric material.
    Type: Application
    Filed: July 6, 2023
    Publication date: August 8, 2024
    Inventors: Cheng-Ming Lin, Szu-Hua Chen, Kenichi Sano, Wei-Yen Woon, Szuya Liao
  • Patent number: 12057206
    Abstract: A method, a computer program product, and a computer system predict medication adherence of a patient. The method includes identifying risk factors associated with medication adherence of the patient. The method includes determining a likely behaviour for medication adherence of the patient based on the identified risk factors and a temporal causal model. The temporal causal model is based on features of a patient cluster to which the patient belongs. The features are nodes in the temporal causal model. The likely behaviour is based on causality measures for each identified risk factor to the nodes. The method includes determining a current medication adherence value of the patient. The current medication adherence value is indicative of a ratio between an actual medication regiment and an expected medication regiment. The method includes determining a future medication adherence value of the patient based on the current medication adherence value and the causality measures.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: August 6, 2024
    Assignee: International Business Machines Corporation
    Inventors: Zhiguo Li, Ching-Hua Chen, Chandramouli Maduri, Pei-Yun Hsueh
  • Patent number: 12057415
    Abstract: A semiconductor device including a chip package, a dielectric structure, and a first antenna pattern is provided. The dielectric structure is disposed on the chip package and includes a cavity and a vent in communication with the cavity. The first antenna pattern is disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern.
    Type: Grant
    Filed: May 29, 2023
    Date of Patent: August 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu
  • Patent number: 12058207
    Abstract: Methods, systems, and devices for using secured tunnels (e.g., SSH tunnels), for example with microservices-based architectures and/or operating-system level virtualization technologies, An example method may include receiving, by a secured tunnel server and via a secured tunnel, network traffic intended for a first original destination of the plurality of original destinations; selecting, using a plurality of override rules that indicate mappings between a plurality of original destinations and respective override destinations, an override destination for the network traffic intended for the first original destination; and forwarding, by the secured tunnel server, the network traffic to the override destination.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: August 6, 2024
    Assignee: Ruckus IP Holdings LLC
    Inventors: Yu-Cheng Kung, Chien-Hua Chen
  • Patent number: 12054930
    Abstract: A connection assembly for a toilet contains: a toilet flange, two positioning elements, two T-shaped screw nuts, two guiders, and two locking elements. The toilet flange is fixed on a floor of a building, and the toilet flange includes a hub, an annular fringe, two receiving grooves, two through orifices, and an elongated slot. A respective one positioning element includes a locating portion and two flexible wings. The locating portion has a passing orifice. A respective one T-shaped screw nut includes a head and a tubular. A respective one guider is removably fixed on the locating portion of to be received in a respective one fixing orifice of two fixing orifices of the toilet. A respective one locking element is screwed with the threaded orifice, after at least one part of the respective one guider is removed, and the toilet is locked on the toilet flange.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: August 6, 2024
    Assignee: Globe Union Industrial Corp.
    Inventors: Chia-Hua Yuan, His-Tsung Chen
  • Patent number: 12058101
    Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
  • Patent number: 12057469
    Abstract: A semiconductor device includes a substrate having a first conductivity type, a first well formed in the substrate and having a second conductivity type, a first diffusion region formed in the first well and having the first conductivity type, a first interlayer dielectric layer disposed over the first well and the first diffusion region, and a resistor wire formed of a conductive material and embedded in the first interlayer dielectric layer. The resistor wire overlaps the first diffusion region and at least partially overlaps the first well in plan view.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Chiun Lin, Po-Nien Chen, Chen Hua Tsai, Chih-Yung Lin
  • Patent number: 12057450
    Abstract: A method includes forming a gate stack on a first portion of a semiconductor fin, removing a second portion of the semiconductor fin to form a recess, and forming a source/drain region starting from the recess. The formation of the source/drain region includes performing a first epitaxy process to grow a first semiconductor layer, wherein the first semiconductor layer has straight-and-vertical edges, and performing a second epitaxy process to grow a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are of a same conductivity type.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jung-Chi Tai, Yi-Fang Pai, Tsz-Mei Kwok, Tsung-Hsi Yang, Jeng-Wei Yu, Cheng-Hsiung Yen, Jui-Hsuan Chen, Chii-Horng Li, Yee-Chia Yeo, Heng-Wen Ting, Ming-Hua Yu
  • Patent number: 12055591
    Abstract: In a battery management controller, analog-to-digital conversion circuitry converts analog signals, indicative of a battery voltage, a battery current, and a battery temperature, to digital signals. A memory stores a remaining-capacity lookup table that includes multiple groups of data. Each group of data includes a voltage, a current, a temperature, and a parameter associated with a remaining capacity corresponding to the voltage, the current and the temperature. A processor searches the lookup table for a current parameter value and an end-of-discharge parameter value based on the digital signals, and determines a full available charge capacity of the battery based on the current parameter value and the end-of-discharge parameter value. The processor also counts the number of charges flowing through the battery based on a battery current. The processor further determines an available state of charge of the battery according to the full available charge capacity and the number of charges.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: August 6, 2024
    Assignee: O2Micro Inc.
    Inventors: Chih-Chung Chou, Guoxing Li, Hua-Yi Wang, Fu-Jen Hsieh, Lian Chen
  • Publication number: 20240257365
    Abstract: In one embodiment, a device may obtain a user-free first image of a background portion of a physical environment including a deterministic object. The device may then locate the deterministic object in a second image of the physical environment. The device may then generate, based on the deterministic object, an alignment between the user-free first image and the second image. The device may then use the alignment for background removal in subsequent images of the physical environment.
    Type: Application
    Filed: January 30, 2023
    Publication date: August 1, 2024
    Inventors: Eric Yi-hua CHEN, Gregory Lee HEWETT, Scott HENNING, Shamim Sharifuddin PIRZADA
  • Publication number: 20240253438
    Abstract: A vehicle window assembly and an assembly method therefor, and a vehicle. The vehicle window assembly includes an exterior decorative member, an encapsulation assembly, and a guide rail. The encapsulation assembly is disposed around a periphery of the exterior decorative member and wraps at least part of the periphery of the exterior decorative member. The encapsulation assembly has a first end and a second end in a direction of an edge S of the exterior decorative member, and the second end is far away from the first end. A limiting groove is defined at the first end of the encapsulation assembly. The guide rail has one end inserted into the limiting groove to limit the guide rail from moving. The guide rail is connected to the second end of the encapsulation assembly to fix the guide rail to the encapsulation assembly.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 1, 2024
    Applicant: FUYAO GLASS INDUSTRY GROUP CO., LTD.
    Inventors: Qiming LIN, Lixing JIANG, Wenjuan YU, Qingtuan HU, Hua CHEN, Xiuyong OU, Ke ZHANG
  • Publication number: 20240254203
    Abstract: Provided herein are antibody-based antiviruses comprising a fusion protein that comprises a transmembrane polypeptide and an antibody which binds to a surface protein of a virus, wherein the fusion protein is expressed at a valency of at least about 10 copies on a surface of the antivirus, and wherein the antibody neutralizes the virus when expressed within the fusion protein on the surface of the antivirus but does not neutralize the virus when expressed as an isolated antibody. Further provided herein are antibody-based antiviruses for treating a viral infection (e.g., SARS-COV-2).
    Type: Application
    Filed: May 19, 2022
    Publication date: August 1, 2024
    Inventors: Michael CHEN, Chang-Zheng CHEN, Yiling LUO, Hua ZHOU
  • Publication number: 20240253680
    Abstract: A positioning apparatus for a mobile apparatus and a battery production line are provided. The positioning apparatus for a mobile apparatus includes: a locking rod arranged on the mobile apparatus, the locking rod being provided with an accommodating region; a bracket arranged at a preset place; and a locking block arranged on the bracket and having a first end that moves vertically in a gravity direction (y); wherein the locking block is configured to: when the mobile apparatus moves toward the bracket in a horizontal direction (x), the first end of the locking block is pushed by the locking rod to move upward, and when the locking rod moves to a preset position, the first end of the locking block falls into the accommodating region of the locking rod under the action of gravity to lock the locking rod.
    Type: Application
    Filed: April 10, 2024
    Publication date: August 1, 2024
    Inventors: Hua Huang, Fanke Chen, Zhiqiang Sun, Yang Li, Yang Li
  • Publication number: 20240254173
    Abstract: The present disclosure provides a method for sericin removal. Since sodium borohydride has a high hydrogen storage performance, a convenient hydrogen release, and relatively-stable chemical properties, the sodium borohydride in a sodium borohydride aqueous solution reacts with water slowly to release hydrogen. A large number of accumulated hydrogen bubbles pass through silk fibers, and produce an upward pulling force to the sericin on a fiber surface along the silk fibers under the action of inertial force and surface tension, thereby achieving the sericin removal at room temperature. Moreover, the method for sericin removal has a simple process, a complete sericin removal effect, and no damage to the structure of silk fibroin fibers, and can prepare the silk fibroin fibers with high flexibility and bright color.
    Type: Application
    Filed: October 11, 2022
    Publication date: August 1, 2024
    Applicant: WENZHOU MUQING BIOTECHNOLOGY CO., LTD
    Inventors: Shixuan Chen, Hua Xu, Hao Pan
  • Patent number: 12051655
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: July 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao, Chao-Wei Chiu
  • Patent number: 12051646
    Abstract: A method comprises forming a first conductive line and a second conductive line in a first dielectric layer over a substrate, each having a planar top surface, applying an etch-back process to the first dielectric layer until a dielectric portion between the first conductive line and the second conductive line has been removed, and the first conductive line and the second conductive line have respective cross sectional shapes including a rounded surface and two rounded corners and depositing a second dielectric layer over the substrate, while leaving a first air gap between the first conductive line and the second conductive line.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang, Tien-Lu Lin
  • Publication number: 20240247052
    Abstract: The present invention relates to monoclonal antibodies which have high anti-RSV neutralizing titers. The invention further provides for isolated nucleic acids encoding the antibodies of the invention and host cells transformed therewith. The invention yet further provides for diagnostic, prophylactic and therapeutic methods employing the antibodies and nucleic acids of the invention, particularly as a passive immunotherapy agent in infants and the elderly.
    Type: Application
    Filed: April 9, 2024
    Publication date: July 25, 2024
    Applicant: Merck Sharp & Dohme LLC
    Inventors: Kalpit A. Vora, Kara S. Cox, Aimin Tang, Zhifeng Chen, Daniel DiStefano, Lan Zhang, Hua-Poo Su
  • Patent number: 12044868
    Abstract: The invention relates to a wavelength conversion device and a manufacturing method thereof. The manufacturing method includes: mixing a fluorescent material, a binding material, and a solvent to form a mixed solution. The volume percentage concentration of the fluorescent material is about 50% to 80%, the volume percentage concentration of the binding material is 10% to 40%, and the volume percentage concentration of the solvent is 10% to 30%. The mixed solution is coated on the substrate. A heat treatment is performed on the mixed solution at a first temperature to form a wavelength conversion layer. The first temperature is higher than the boiling point of the solvent, and the wavelength conversion layer has a porosity of 10% to 30%. The wavelength conversion device manufactured by the manufacturing method of the invention has better toughness, and may provide stable optical quality and improve image brightness.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: July 23, 2024
    Assignee: Coretronic Corporation
    Inventors: I-Hua Chen, Chi-Tang Hsieh