Abstract: A package structure is provided. The package structure includes a die, an encapsulant, a first redistribution line (RDL) structure, a second RDL structure, and a through via. The encapsulant laterally encapsulates the die. The first redistribution line (RDL) structure on a first side of the die and the encapsulant, wherein the first RDL structure comprises a dielectric layer and a redistribution layer in the dielectric layer. The second RDL structure is located on a second side of the die and the encapsulant. The through via extends through the encapsulant and the first redistribution line structure and connecting the second RDL structure. The through via is laterally separated from the redistribution layer by the dielectric layer therebetween.

Abstract: The invention relates to the technical field of camera, in particular, to a hand-held binocular fisheye 3D VR camera, which includes a housing and a lens assembly mounted on the housing. A bottom surface inside the housing is mounted with an MIC board, and a main bracket is mounted inside the housing. A rear surface of the main bracket is provided with a structural port plate, a sensor body and a sensor board bracket. A front surface of the main bracket is mounted with a cooling bracket and a main board, and one end of the rear surface of the main bracket is mounted with a speaker. The invention is provided with the MIC board and the speaker, supporting three recording modes of photographing, video recording and live broadcast.

Abstract: A method of detecting defects revealed in images of finished products includes importing flawless images into an autoencoder for model training and obtaining reconstructed images from them. The reconstructed images are compared with the flawless images to obtain groups of test errors. An error threshold is selected from the groups of the test errors according to preset rules. In practice, obtaining an image to be tested, and a reconstructed image to be tested, and an error to be tested; determining detection of the image to be tested according to the error and the error threshold; and importing the image into a classifier for defect classification if the image is found to reveal a defect. An electronic device and a non-volatile storage medium for performing the above-described method, are also disclosed.

Abstract: A power over Ethernet (PoE) power supplying method where power sourcing equipment (PSE) and a powered device exchange link layer discovery protocol data units (LLDPDUs). Each of the LLDPDUs includes two power values. Each of the power values indicates requested or allocated power for one of two sets of cable pairs of the Ethernet twisted pair connecting the PSE and the powered device. Accordingly, the supplied powers to the powered device at sets of cable pairs are independent from each other.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: A stacked channel structure includes a first channel structure having a first gate dielectric thereon, an isolation structure over the first channel structure, and a second channel structure over the isolation structure. The second channel structure has a second gate dielectric thereon. A method may include forming a dummy layer that has a top surface below the second channel structure, selectively depositing a hard mask over the second gate dielectric, selectively removing the dummy layer, and selectively removing the hard mask after the dummy layer. Deposition parameters and a composition of the dummy layer are configured to inhibit deposition of the hard mask on the dummy layer. A first gate electrode and a second gate electrode may be formed over the first gate dielectric and the second gate dielectric, respectively. The hard mask may be selectively removed before or after forming the first gate electrode.

Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: A test fixture configured to support a DUT (device under test) and including a bottom base, two mounting bases, a rotatable base and a supporting base. The two mounting bases stand on a side of the bottom base and are spaced apart from each other. The rotatable base is rotatably disposed on the two mounting bases. At least a part of the rotatable base is located between the two mounting bases. The supporting base is fixed on a side of the rotatable base and configured to support the DUT. When the supporting base is parallel to the bottom base, the supporting base is located on a side of the rotatable base located farthest away from the bottom base.

Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: A SAR ADC includes: a sample-hold (S/H) circuit sampling an input voltage to generate a S/H output signal; a DAC generating a DAC output signal; a comparator comparing the DAC output signal with the S/H output signal to generate a comparison output signal; a SAR combinational digital circuit group; a multiplexer circuit; and a plurality of registers for registering the comparison output signal as register output signals and outputting as an output signal of the SAR ADC. The SAR combinational digital circuit group generates a plurality of first and second SAR output signals based on the register output signals. The multiplexer circuit is controlled by on the register output signals to select among the first and the second SAR output signals as a plurality of multiplexer output signals for sending to the DAC. A capacitor coupling relationship of the DAC is controlled by the multiplexer output signals.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The method may be performed by a UE. In certain configurations, the UE receives, from a base station, a configuration instruction for enabling a subband full duplex (SBFD) timing alignment (TA) mechanism and a constant c. The UE enables the SBFD TA mechanism according to the configuration instruction. The UE receives, from the base station, a timing adjustment command, which includes a propagation delay ?i for the UE. The UE determines whether an uplink (UL) transmission is to be performed in a SBFD slot. In response to determining the UL transmission to be performed in the SBFD slot, the UE applies a timing alignment delay to the UL transmission with respect to the SBFD slot start boundary. The timing alignment delay is determined by both the constant c and the propagation delay ?i.

Abstract: A method is described. The method includes obtaining a relationship between a thickness of a contamination layer formed on a mask and an amount of compensation energy to remove the contamination layer, obtaining a first thickness of a first contamination layer formed on the mask from a thickness measuring device, and applying first compensation energy calculated from the relationship to a light directed to the mask.

Abstract: An example security gate can include: an outer frame; an outer gate disposed within the outer frame, the outer gate defining a plane and having a plurality of outer gate vertical members, and the outer gate defining an inner gate opening; an inner gate disposed within the outer gate, the inner gate defining a plurality of inner gate vertical members, wherein the inner gate is configured to move vertically within the plane to control access through the inner gate opening, and wherein the plurality of inner gate vertical members are sized to telescope within the plurality of outer gate vertical members as the inner gate is moved; and a locking mechanism to lock the inner gate at a vertical position relative to the outer gate to define an accessible size of the inner gate opening.

Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: A slide structure of a chair back adjusting device is disclosed. The chair back adjusting device includes a support plate, an adjustor assembly arranged on the support plate, and a slide slidably sleeved on the support plate. The slide includes a through opening. At least one slide resisting rib is arranged, in a manner of being integrally formed therewith, at one side of interior of the through opening. As such, operation of assembling the slide is simplified to thereby reduce the cost of the chair back adjusting device.

Abstract: A positioner of a chair adjusting device is disclosed. The positioner is formed by stacking a plurality of positioning plates together. Each of the positioning plates is formed with a positioning section, a combination section, and a penetration section. The combination section is formed of a recessed cavity recessed from one surface and a projecting peg projecting from an opposite surface, and an outside diameter of the projecting peg corresponds to an inside diameter of the recessed cavity, so that for two of the positioning plates that are stacked together to be respectively on an upper side and a lower side, the projecting peg of the positioning plate on the upper side is receivable into and fit in the recessed cavity of the positioning plate on the lower side to have the two positioning plates that are stacked together on the upper and lower sides combined together through tight fitting.