Abstract: A semiconductor structure includes a resistor on a substrate formed substantially simultaneously with other device elements, such as one or more transistors. A diffusion barrier layer deposited on a substrate is patterned to form a resistor and barrier layers under a transistor gate. A filler material, a first connector, and a second connector are formed on the resistor in a substantially similar manner as that used to form the gate of the transistor. The filler material is removed.

Abstract: A fan includes a first motor, a second motor, a rotating shaft and a fan blade. The first motor includes a first coil. A first current flows through the first coil when the fan is electrified. The second motor includes a second coil. A second current flows through the second coil when the fan is electrified. The fan blade is affixed to the rotating shaft. The first motor and the second motor drive the rotating shaft to rotate the fan blade when the fan is electrified.

Abstract: An electronic device includes a case, a control module, a plurality of heat sinks and at least one airflow guiding structure. The case includes a bottom plate, a top plate, and at least one side plate. The bottom plate has a plurality of bottom holes for guiding air into the case. The top plate has a plurality of top holes for exhausting air in the case. The side plate connects the top plate and the bottom plate and has a plurality of side holes for exhausting air in the case. The control module is disposed in the case. The heat sinks are thermally connected to the control module. The airflow guiding structure is disposed between the heat sinks for guiding a part of the air in the case to the exterior of the case through the side holes.

Abstract: A fan structure used for connecting with a plate body includes a main body, a fan blade, a sliding member and a locating member. The main body has an accommodating space and an adjustment slot. The fan blade is pivotally disposed on the main body and is located inside the accommodating space. The sliding member has a base and a joining portion. The base is accommodated in the adjustment slot. The sliding member is joined to the plate body through the joining portion. The locating member is used for joining the sliding member and the main body together, so as to fix the relative position of the sliding member and the main body.

Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.

Abstract: According to an exemplary embodiment, a serializer includes upper and lower shift registers configured to perform a load function where parallel input data is loaded from a parallel input bus and a shift function where the parallel input data is shifted to an output register. The upper shift register is configured to perform the load function while the lower shift register performs the shift function, and the lower shift register is configured to perform the load function while the upper shift register performs the shift function. An output register is configured to alternately receive the parallel input data from the upper shift register and the parallel input data from the lower shift register. The upper and lower shift registers and the output register can comprise scan flip-flops.

Abstract: An electronic device includes a case, a control module, a plurality of heat sinks and at least one airflow guiding structure. The case includes a bottom plate, a top plate, and at least one side plate. The bottom plate has a plurality of bottom holes for guiding air into the case. The top plate has a plurality of top holes for exhausting air in the case. The side plate connects the top plate and the bottom plate and has a plurality of side holes for exhausting air in the case. The control module is disposed in the case. The heat sinks are thermally connected to the control module. The airflow guiding structure is disposed between the heat sinks for guiding a part of the air in the case to the exterior of the case through the side holes.

Abstract: A method for fabricating a device is disclosed. An exemplary method includes providing a substrate and forming a plurality of fins over the substrate. The method further includes forming a first opening in the substrate in a first longitudinal direction. The method further includes forming a second opening in the substrate in a second longitudinal direction. The first and second longitudinal directions are different. The method further includes depositing a filling material in the first and second openings.

Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.

Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.

Abstract: A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

Abstract: A heat dissipation device includes a fan module, a first plate structure and a fin assembly. The fan module includes a fan outlet. The first plate structure is disposed at the fan outlet. The thermal conductance of the first plate structure is above 100 W/(m·K). The first plate structure includes a heat-absorbing and a heat-dissipation surface. The heat-absorbing surface includes a heat-absorbing region in thermal contact with a heat source. The heat-dissipation surface includes a heat-dissipation region. The fin assembly is disposed on the heat-dissipation surface and in thermal contact with the heat-dissipation surface. The fan module is adapted to exhaust an air flow flowing above the heat-dissipation surface via the fan outlet. The air flow flows through the heat-dissipation region before through the fin assembly. The distance between the fan outlet and the heat-dissipation region is greater than the distance between the fan outlet and the fin assembly.

Abstract: A fan structure used for connecting with a plate body includes a main body, a fan blade, a sliding member and a locating member. The main body has an accommodating space and an adjustment slot. The fan blade is pivotally disposed on the main body and is located inside the accommodating space. The sliding member has a base and a joining portion. The base is accommodated in the adjustment slot. The sliding member is joined to the plate body through the joining portion. The locating member is used for joining the sliding member and the main body together, so as to fix the relative position of the sliding member and the main body.

Abstract: A semiconductor structure can include a resistor on a substrate formed simultaneously with other devices, such as transistors. A diffusion barrier layer formed on a substrate is patterned to form a resistor and barrier layers under a transistor gate. A filler material, a first connector, and a second connector are formed on the resistor at the same manner and time as the gate of the transistor. The filler material is removed to form a resistor on a substrate.

Abstract: According to an exemplary embodiment, a serializer includes upper and lower shift registers configured to perform a load function where parallel input data is loaded from a parallel input bus and a shift function where the parallel input data is shifted to an output register. The upper shift register is configured to perform the load function while the lower shift register performs the shift function, and the lower shift register is configured to perform the load function while the upper shift register performs the shift function. An output register is configured to alternately receive the parallel input data from the upper shift register and the parallel input data from the lower shift register. The upper and lower shift registers and the output register can comprise scan flip-flops.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: According to an exemplary implementation, a transmitter includes a decoder circuit receiving a digital input from a digital back-end circuit. The decoder circuit includes a plurality of decoder cells. Each of the plurality of decoder cells is configured to drive a respective current source cell in a current source circuit so as to convert the digital input into an analog output. Each of the plurality of decoder cells has respective decoder logic. Furthermore, the digital input from the digital back-end circuit is respectively received by each of the plurality of decoder cells.

Abstract: A method for fabricating a device is disclosed. An exemplary method includes providing a substrate and forming a plurality of fins over the substrate. The method further includes forming a first opening in the substrate in a first longitudinal direction. The method further includes forming a second opening in the substrate in a second longitudinal direction. The first and second longitudinal directions are different. The method further includes depositing a filling material in the first and second openings.