Abstract: Semiconductor structures are provided. The semiconductor structure includes a substrate and nanostructures formed over the substrate. In addition, the nanostructures includes channel regions and source/drain regions. The semiconductor structure further includes a gate structure vertically sandwiched the channel regions of the nanostructures and a contact wrapping around and vertically sandwiched between the source/drain regions of the nanostructures.

Abstract: A photosensitive device includes a first photosensitive unit, a first collimator layer, a first lens, and a first dummy lens. The first photosensitive unit includes a first photosensitive component and a first control circuit. The first control circuit is electrically connected to the first photosensitive component. The first collimator layer is located above the first photosensitive component and has a first pinhole and a first dummy pinhole. The first lens is located above the first collimator layer and overlapping with the first photosensitive component and the first pinhole in a first direction. The first dummy lens is located above the first collimator layer and overlapping with the first dummy pinhole in the first direction.

Abstract: A wireless device determines a reference duration for contention window adjustment, wherein the reference duration is from a beginning of a channel occupancy and until an end of a first slot where at least one physical uplink shared channel (PUSCH) is transmitted. The wireless device performs a listen before talk (LBT) procedure with a contention window value associated with the reference duration. The wireless device transmits at least one uplink signal after the LBT procedure indicates a clear channel.

Abstract: A method of forming a semiconductor device includes depositing a p-type semiconductor layer over a portion of a semiconductor substrate, depositing a semiconductor layer over the p-type semiconductor layer, wherein the semiconductor layer is free from p-type impurities, forming a gate stack directly over a first portion of the semiconductor layer, and etching a second portion of the semiconductor layer to form a trench extending into the semiconductor layer. At least a surface of the p-type semiconductor layer is exposed to the trench. A source/drain region is formed in the trench. The source/drain region is of n-type.

Abstract: A heating system includes a conveying system configured to transport a plurality of vehicle body-in-whites (BIWs) sequentially through an oven room to cure paint applied in a paint room. A preheating system includes one or more robot arms. A heat source is connected to the one or more robot arms. A controller is configured to control the one or more robot arms based on a position of one of the vehicle BIWs on the conveying system and to position the heat source near or in direct contact with one or more inner components of the one of the vehicle BIWs to heat the one or more inner components prior to the one of the vehicle BIWs entering the oven room.

Abstract: The present disclosure relates to the field of biomedicine, and in particular, to an improved mutant of a respiratory syncytial virus (RSV) fusion (F) protein and uses thereof. The mutant can form a trimeric structure without introducing a heterologous trimerization domain. Meanwhile, through mutation designs such as releasing internal electrostatic repulsion, deleting the furin cleavage site, truncating the C-terminal domain, and introducing interchain disulfide bonds, the protein is stabilized in the pre-fusion conformation and exhibits enhanced stability. The mutant in the present disclosure is highly immunogenic when used as a vaccine or a vaccine component and can induce the production of a high level of neutralizing antibodies in the immunized animal, which can be used in the preparation of a vaccine for the prevention or treatment of RSV infection, and can also be used as a reagent for the detection of RSV.

Abstract: Disclosed is a figure skate, which includes a shell case, a toe cap, and an ice skate blade. The shell case and the toe cap are fixedly connected through rivets on both sides. An inner side of a front end at the bottom of the shell case has open butted front sole and front inner groove, an outer side of a back end of the toe cap has open butted inner sole and back outer groove, and rivet connecting holes are formed in the front inner groove and the back outer groove. The back outer groove and the front inner groove are in seamless connection. The front sole has an arc-shaped upper groove surface, and the inner sole has an arc-shaped lower groove surface. The inner sole and the front sole, as well as the lower groove surface and the upper groove surface all are in seamless connection.

Abstract: The present invention relates to a pyrimido[5,4-b]pyrrolizin compound represented by general formula I, an optical isomer thereof, a preparation method therefor, a pharmaceutical composition containing same, and a use thereof. The compound according to the present invention has good inhibitory activity on the kinase BTK at both the molecular level and the cellular level. Meanwhile, the compound also has good anti-tumor activity and pharmacokinetic properties in vivo.

Abstract: Example electronic devices are disclosed herein. In an example, the electronic device includes a housing including a plurality of portions that are pivotably coupled together. The plurality of portions including a first portion including a display panel, a second portion including a user input device, and a third portion including a touch sensitive surface. The second portion is pivotably coupled between the first portion and the third portion. The third portion is pivotable relative to the second portion to cover the user input device with the touch sensitive surface.

Abstract: A BBU balanced power supply control system, including: a control circuit, a gating circuit, a first comparison circuit, a second comparison circuit, and an output voltage stabilizing circuit. A power supply ratio of each BBU is obtained by the control circuit. The power supply ratio is a ratio of an output current to a remaining capacity percentage. An imbalance of the power supply ratio is converted by the first comparison circuit and the second comparison circuit into a corresponding adjustment signal. Finally, by negative feedback of the output voltage stabilizing circuit, the BBU having the highest power supply ratio is controlled to reduce the output current, and the remaining BBUs participating in redundant power supply are enabled to raise the output current. Also disclosed are a multi-BBU power supply system and a server.

Abstract: A method comprising: detecting a storage device failure in a storage array, the storage array including a plurality of storage devices, the storage device failure being a failure of one or more of the plurality of storage devices; wherein: the plurality of storage devices are configured to implement a supergroup including a plurality of subgroups; identifying ones of the plurality of subgroups that are affected by the storage device failure; and rebuilding the identified subgroups, wherein: (A) when a count of failed storage device is less than a first threshold, each of the identified subgroups is rebuilt based only on subgroup parity components for the subgroup without the use of supergroup parity components, and (B) when the count of failed storage devices is between the first threshold and the second threshold, each of the identified subgroups is rebuilt based on both subgroup and supergroup parity components.

Abstract: A method includes forming a composite material layer over a carrier, the composite material layer including particles of a filler material incorporated into a base material, forming a set of through vias over a first side of the composite material layer, attaching a die over the first side of the composite material layer, the die being spaced apart from the set of through vias, forming a molding material over the first side of the composite material layer, the molding material least laterally encapsulating the die and the through vias of the set of through vias, forming a redistribution structure over the die and the molding material, the redistribution structure electrically connected to the through vias, forming openings in a second side of the composite material layer opposite the first side, and forming conductive connectors in the openings, the conductive connectors electrically connected to the through vias.

Abstract: Wireless communications are described. A base station may send control information for scheduling data to be transmitted to the wireless device via a downlink. The control information may comprise one or more indications of wireless resources to be used by the wireless device to receive the data. The wireless device may receive the data based on one or more determinations/conditions, such as satisfying a time offset (e.g., between reception of the downlink information and a scheduled transmission of the data), whether a control resource set is configured to indicate a transmission configuration state, and/or whether the control information indicates a transmission configuration state.

Abstract: Systems, apparatuses, and methods are described for wireless communications. A base station may transmit parameters for a configured grant and a dynamic grant. The parameters may indicate numbers of transmissions of transport blocks within a bundle of a configured grant and within a bundle of a dynamic grant. A wireless device may transmit a first transport block, within a bundle of a configured grant, a first number of times. The wireless device may transmit a second transport block, within a bundle of a dynamic grant, a second number of times.

Abstract: A method for forming a chip package structure is provided. The method includes providing an electrical substrate and a photonic substrate over and bonded to the electrical substrate. The method includes partially removing the dielectric structure to form a first through hole and a second through hole in the dielectric structure. The first through hole passes through the dielectric structure and exposes the first wiring layer. The method includes forming a first conductive via structure and a second conductive via structure in the first through hole and the second through hole respectively. The first conductive via structure is in direct contact with the first wiring layer, and the second conductive via structure is spaced apart from the first wiring layer.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: Embodiments of the present disclosure relate to a semiconductor device with lowered source/drain regions to reduce channel resistance (Rch) and source/drain contact resistance loading.

Abstract: A method for forming a chip package structure. The method includes dicing a semiconductor wafer from a rear surface of the semiconductor wafer to form first and second semiconductor dies. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die after the semiconductor wafer. The method also includes mounting first and second semiconductor dies over an interposer substrate. The first sidewall faces the second sidewall. A lateral distance from a top end of the first sidewall to a top end of the second sidewall is greater than a lateral distance from a bottom end of the first sidewall to a bottom end of the second sidewall.

Abstract: A wireless device may request system information, such as a system information block, from a base station on demand. The base station may indicate to the wireless device a change in system information via a message, for example, during a time period that the base station is not sending system information to the wireless device. The wireless device may expect to receive updated system information, for example, based on receiving the message, without having to send a request to the base station for system information.

Abstract: A wireless device receives downlink control information (DCI) comprising: a cell index, wherein the cell index indicates one or more cells of a plurality of cells; and a channel state information (CSI) request. The wireless device determines a cell, of the one or more cells, to transmit a CSI based on the CSI request and the cell index of the DCI. The wireless device transmits, via the cell, the CSI.