Patents by Inventor Hua (Philip) Guo

Hua (Philip) Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250254946
    Abstract: Embodiments of the present disclosure relate to a semiconductor device with lowered source/drain regions to reduce channel resistance (Rch) and source/drain contact resistance loading.
    Type: Application
    Filed: February 3, 2024
    Publication date: August 7, 2025
    Inventors: Tien-Yu YI, Chien-I KUO, Ming-Hua YU, Chii-Horng LI
  • Publication number: 20250254122
    Abstract: An audio and video cloud network, an access method, a routing and forwarding method, and a readable storage medium. An audio and video cloud network which include: a control hub, which may include a dispatching center and a routing center; and a plurality of media nodes, which may include a transit node and an edge node, where the transit node is in communicative connection with the routing center, and the edge node is in communicative connection with the transit node and the dispatching center.
    Type: Application
    Filed: March 29, 2023
    Publication date: August 7, 2025
    Inventors: Xiyu WANG, Xinhai HUA, Tao JIANG, Junjiang CHEN, Jian LU
  • Publication number: 20250254942
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers connected to the source/drain feature, a gate structure between adjacent channel layers and wrapping the channel layers, and an inner spacer between the source/drain feature and the gate structure and between adjacent channel layers. The source/drain feature has a first interface with a first channel layer of the channel layer. The first interface has a convex profile protruding towards the first channel layer.
    Type: Application
    Filed: March 31, 2025
    Publication date: August 7, 2025
    Inventors: Po-Yu LIN, Tzu-Hua CHIU, Wei-Yang LEE, Chia-Pin LIN, Yuan-Ching PENG
  • Publication number: 20250251719
    Abstract: A manufacturing system for an electronic device is provided. The manufacturing system includes a manufacturing equipment, a calculation unit, and a comparison unit. The manufacturing equipment provides a previous data string and a real-time data string. The calculation unit receives the previous data string and outputs an upper control limit value and a lower control limit value accordingly. The comparison unit generates an exponentially weighted moving average (EWMA) slope value based on the real-time data string, and compares the EWMA slope value with the upper control limit value and the lower control limit value to generate a comparison result.
    Type: Application
    Filed: January 3, 2025
    Publication date: August 7, 2025
    Applicant: Innolux Corporation
    Inventors: Meng-Xue Wu, Yung-Hua Chang, Wen-Jie Tsai
  • Publication number: 20250252980
    Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.
    Type: Application
    Filed: February 7, 2025
    Publication date: August 7, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hua-Hsin YU, Hung-Jen LIAO, Cheng-Hung LEE, Hau-Tai SHIEH
  • Publication number: 20250253625
    Abstract: A high-voltage and high-current laminated bus line and a preparation method thereof are provided. The preparation method includes the following steps: winding a positive bus line and a negative bus line by using a glass cloth tape to form an insulated positive bus line and an insulated negative bus line, twining the insulated positive bus line, a metal isolation plate and the insulated negative bus line by using the glass cloth tape to form a laminated bus line sample, and heating and curing the laminated bus line sample to obtain the high-voltage and high-current laminated bus line. The laminated bus line has low self-generated impedance and small installation space requirement, and is suitable for high-power electrical equipment with a current exceeding 30 kA and a total voltage exceeding 20 kV.
    Type: Application
    Filed: September 25, 2024
    Publication date: August 7, 2025
    Applicant: HEFEI INSTITUTE OF PHYSICAL SCIENCE, CHINESE ACADEMY OF SCIENCES
    Inventors: Li JIANG, Hua CAO, Qiangjian CHEN
  • Publication number: 20250253222
    Abstract: A semiconductor device includes a first integrated circuit, a bridge die, and a redistribution layer (RDL) structure. The first integrated circuit includes a first interconnect structure, a first passivation layer and a first conductive connector electrically connected to the first interconnect structure and disposed on the first passivation layer. The bridge die bridge die includes a second interconnect structure, a second passivation layer and a second conductive connector electrically connected to the second interconnect structure. The RDL structure is disposed between and electrically connected to the first integrated circuit and the bridge die, wherein the first passivation layer is in direct contact with the first conductive connector, the first conductive connector is in direct contact with the RDL structure, and the first passivation layer is a single layer and includes a first inorganic material.
    Type: Application
    Filed: February 1, 2024
    Publication date: August 7, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Yu Chen, Hsuan-Cheng Kuo, Wan-Yu Lee, Wei-Cheng Wu, Hua-Wei Tseng, Ta-Hsuan Lin, Chih-Chiang Chang
  • Publication number: 20250253288
    Abstract: A semiconductor device includes a first Chip-On-Wafer (CoW) device having a first interposer and a first die attached to a first side of the first interposer; a second CoW device having a second interposer and a second die attached to a first side of the second interposer, the second interposer being laterally spaced apart from the first interposer; and a redistribution structure extending along a second side of the first interposer opposing the first side of the first interposer and extending along a second side of the second interposer opposing the first side of the second interposer, the redistribution structure extending continuously from the first CoW device to the second CoW device.
    Type: Application
    Filed: April 22, 2025
    Publication date: August 7, 2025
    Inventors: Jiun Yi Wu, Chen-Hua Yu, Shang-Yun Hou
  • Publication number: 20250254813
    Abstract: The present disclosure discloses an ejector including a housing; a handle pivotally connected to the housing around a first pivot axis and having a first pivot position and a second pivot position; and a button pivotally connected to the housing around a second pivot axis and having a locking position and an unlocking position, wherein the handle is locked by the button when the button is in the locking position and the handle is in the first pivot position, wherein the first fixing element prevents the housing from moving in a first direction relative to the object and allows the housing to move in a second direction relative to the object, and the second fixing element prevents the housing from moving in the first direction and the second direction relative to the object. The ejector provided by the present disclosure is simple in structure and convenient to install.
    Type: Application
    Filed: February 4, 2025
    Publication date: August 7, 2025
    Applicant: Southco Manufacturing and Technology (Shenzhen) Co., Ltd.
    Inventors: Hung-Yuan HUANG, Bing-Hua CHIANG, Lei CAI
  • Publication number: 20250250634
    Abstract: Provided herein are compositions and methods for the multiplexed profiling of RNA and DNA modifications across transcriptomes and genomes, respectively. The methods combine molecular recognition of non-canonical features (e.g., base modifications, backbone modifications, lesions, and/or structural elements) of a target nucleic acid with a step of writing the information from this recognition event into the neighboring genetic sequence of the target nucleic acid using a barcode. The resultant barcoded nucleic acids are then converted into sequencing libraries and read by DNA/RNA sequencing methods. This step reveals the sequence of the barcode, which is correlated with the non-canonical feature in the target nucleic acid(s). The high throughput profiling methods described herein allow for identification and/or localization of one or more modifications in a target nucleic acid. The methods also allow for identification of the nature and location of several or all DNA/RNA modifications in parallel.
    Type: Application
    Filed: March 24, 2025
    Publication date: August 7, 2025
    Applicant: ALIDA BIOSCIENCES, INC.
    Inventors: Gudrun STENGEL, Hua YU, Andrew PRICE, Jerome SANTOS, Yu-Hsien HWANG-FU, Byron PURSE
  • Publication number: 20250251824
    Abstract: A touch panel, the touch panel includes a control substrate, a touch layer (202) and a piezoelectric layer (201) that are stacked; the control substrate includes a first substrate (10) and a control circuit layer (11) arranged on the first substrate (10), and the touch layer (202) and the piezoelectric layer (201) are located on the control substrate, the control circuit layer (11) comprises a control circuit (110), and the control circuit (110) is electrically connected with the touch layer (202) and the piezo electric layer (201) respectively, and is configured to apply electrical signals to the touch layer (202) and the piezoelectric layer (201) and/or receive electrical signals from the touch layer (202) and the piezoelectric layer (201) respectively. The touch panel can realize the global tactile feedback function, and has a simple structure and has the advantages of thinner, lighter, lower driving voltage, and lower power consumption.
    Type: Application
    Filed: April 23, 2025
    Publication date: August 7, 2025
    Applicants: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hui HUA, Yuju CHEN, Yingzi WANG
  • Publication number: 20250251274
    Abstract: Optical devices and methods of manufacture are presented herein. In an embodiment, an apparatus is provided that includes a notch filter, an optical signal detector positioned adjacent to the notch filter, and a mirror positioned to adjacent to the notch filter.
    Type: Application
    Filed: April 22, 2025
    Publication date: August 7, 2025
    Inventors: Hua-Kung Chiu, Jia-Hong Wu, Hsing-Kuo Hsia, Chen-Hua Yu
  • Publication number: 20250250700
    Abstract: The present invention relates to metallic nanostructures (e.g., Cu) on unconventional-phase TMDs, and an electrochemical method for the controlled growth of various Cu nanostructures, including single-atomically dispersed Cu (s-Cu), amorphous Cu (a-Cu) nanoclusters, and crystalline Cu (c-Cu) nanoparticles on 1T? WS2 nanosheets. This method enhances the efficiency and selectivity of catalysts for the electrochemical upcycling of nitrate water into ammonia, achieving a Faradaic efficiency (FE) of at least 98% for ammonia at ?0.8 V vs. RHE. Investigations reveal that the high performance arises from the synergistic cooperation between Cu sites and 1T? WS2 supports, facilitating efficient hydrogenation and ammonia production. The Cu/1T? TMDs nanostructures are versatile and can be applied in various catalytic fields.
    Type: Application
    Filed: February 4, 2025
    Publication date: August 7, 2025
    Inventors: Hua ZHANG, An ZHANG, Li ZHAI, Zijian LI, Zhenyu SHI
  • Publication number: 20250253261
    Abstract: An electronic package and a manufacturing method thereof are provided, in which the electronic package includes: a first circuit module including a dielectric material, a first circuit layer, a second circuit layer, a third circuit layer and a fourth circuit layer; a first electronic element embedded in the first circuit module and electrically connected to the fourth circuit layer; a second circuit module electrically connected to the first circuit layer; and a second electronic element located between the first circuit layer and the second circuit module. Accordingly, the overall thickness of the electronic package can be greatly reduced to save space; the heat dissipation effect of the electronic elements can also be improved to extend their service life; and the manufacturing process can also be effectively simplified to improve yield and production rate and reduce manufacturing costs.
    Type: Application
    Filed: January 17, 2025
    Publication date: August 7, 2025
    Inventors: Yin-Ju CHEN, Jiun-Hua CHIUE, Min-Yao CHEN, De-Long LIU, Andrew C. CHANG, Chung-Hsien YANG, Zhen-Hu CHANG
  • Publication number: 20250253276
    Abstract: A package includes a redistribution structure that includes conductive features and first waveguides; first dies and second dies attached to the redistribution structure, wherein the first dies are different than the second dies, wherein the first dies are electrically connected to respectively corresponding second dies through the redistribution structure; and optical bridge structures attached to the redistribution structure, wherein the optical bridge structures are optically coupled to the first waveguides, wherein the optical bridge structures are electrically connected to respectively corresponding first dies and respectively corresponding second dies through the redistribution structure.
    Type: Application
    Filed: May 9, 2024
    Publication date: August 7, 2025
    Inventors: Chen-Hua Yu, Tung-Liang Shao, Yu-Sheng Huang
  • Publication number: 20250253893
    Abstract: A system and a method for automatically adjusting a beam direction of a reflector are provided. The system includes: a reflector for reflecting, refracting, or transmitting incident waves of network signals to a specified area; a database, storing optimized setting combinations for specified areas that include an altitude of the reflector and angles thereof with respect to the specified area, making signals of the specified area have maximum intensity; a communication module, receiving a trigger signal; a computing and processing module, retrieving from the optimized setting combination for the specified area according to the area name of the trigger signal; and a control module, adjusting the altitude and angles of the reflector according to the optimized setting combination. The disclosure can automatically detect a specified area needing network service and automatically adjust the reflector for signal intensity enhancement.
    Type: Application
    Filed: April 25, 2024
    Publication date: August 7, 2025
    Inventors: CHUN-CHIEH KUO, HUA-PEI CHIANG, CHYI-DAR JANG, CHI-HUNG LIN, TSUNG-JEN WANG, CHE-YU LIAO, CHI-EN CHIEN, HAO CHEN
  • Publication number: 20250254635
    Abstract: A wireless device receives one or more radio resource control (RRC) messages comprising one or more configuration parameters, wherein the one or more configuration parameters indicate: physical uplink shared channel (PUSCH) pathloss reference signals (RSs) for pathloss estimation; sounding RS resource indicator (SRI)-PUSCH power control sets; and a pathloss RS update parameter that enables pathloss RS update for PUSCH by a medium-access control control element (MAC-CE), wherein the MAC-CE updates mapping between the SRI-PUSCH power control sets and the PUSCH pathloss reference RSs. The wireless device computes, for a power headroom report and based on the one or more configuration parameters comprising the pathloss RS update parameter, a pathloss estimation of an RS associated with a PUSCH pathloss reference RS index mapped to an SRI-PUSCH power control set with an identifier equal to zero. The wireless device transmits the power headroom report.
    Type: Application
    Filed: February 24, 2025
    Publication date: August 7, 2025
    Applicant: Ofinno, LLC
    Inventors: Ali Cagatay Cirik, Yunjung Yi, Esmael Hejazi Dinan, Hua Zhou
  • Publication number: 20250248627
    Abstract: Provided is an implant apparatus for a continuous glucose monitor. The implant apparatus includes a housing assembly and a driving assembly disposed in the housing assembly. The housing assembly includes an outer housing. The outer housing has an opening at an end of the outer housing. The driving assembly has a locked state in which the driving assembly is fixed relative to the outer housing and a triggered state in which the driving assembly is movable towards the opening. The implant apparatus further includes a trigger. The outer housing includes a guiding channel located at a side wall of the outer housing and extending towards the opening. The trigger is movable along the guiding channel towards the opening and has a first position and a second position relative to the outer housing, to enable the driving assembly to switch from the locked state to the triggered state.
    Type: Application
    Filed: March 28, 2025
    Publication date: August 7, 2025
    Inventors: Kaihong YANG, Yanan ZHANG, Jiajia ZHI, Hualong ZHOU, Jirui PU, Feng CHEN, Bozhen SUN, Yiqi SHI, Hao HUA
  • Publication number: 20250249754
    Abstract: An energy conversion device comprises: an electric motor, an electronic control, a traction battery and a controller. The controller is configured to control all bridge arms corresponding to windings of the electric motor, so that the collaboration of driving and battery self-heating is achieved, and the crest and trough of an actual N line current flowing through an N line of the electric motor to counteract or are superposed with the crest and trough of an actual phase current flowing through each phase of winding of the electric motor, thus reducing or increasing the amplitudes of the actual phase current of each phase of winding at the crest and trough, and thereby providing a greater phase current for the electric motor so as to drive the electric motor. Thus, the torque output by the electric motor is greater.
    Type: Application
    Filed: April 28, 2025
    Publication date: August 7, 2025
    Inventors: Yubo LIAN, Heping LING, Hua PAN, Jicheng LI, Yuxin ZHANG
  • Publication number: 20250253260
    Abstract: A chip package includes a semiconductor die laterally encapsulating by an insulating encapsulant, a first dielectric portion, conductive vias, conductive traces and a second dielectric portion. The first dielectric portion covers the semiconductor die and the encapsulant. The conductive vias penetrate through the first dielectric portion and electrically connected to the semiconductor die. The conductive traces are disposed on the first dielectric portion. The second dielectric portion is disposed on the first dielectric portion and covering the conductive traces, wherein a first minimum lateral width of a conductive trace among the conductive traces is smaller than a second minimum lateral width of a conductive via among the conductive vias. A method of forming the chip package is also provided.
    Type: Application
    Filed: December 23, 2024
    Publication date: August 7, 2025
    Applicant: Parabellum Strategic Opportunities Fund LLC
    Inventors: Yu-Hsiang Hu, Chen-Hua Yu, Hung-Jui Kuo