Patents by Inventor Hua Wang

Hua Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230397029
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive control signaling identifying, for multiple beams, a set of quantized values for beam measurement reporting. The UE may receive a set of reference signals and each reference signal may be associated with a beam of the multiple beams. The UE may transmit a report indicating a set of power values that are based on the set of quantized values and the set of reference signals. Each power value of the set of power values may be associated with a respective beam of the multiple beams. The control signaling may also indicate a set of rules for vector-based beam management reporting for the multiple beams. The report may include a vector report and may indicate the set of power values based on the set of rules and the set of reference signals.
    Type: Application
    Filed: June 3, 2022
    Publication date: December 7, 2023
    Inventors: Tianyang Bai, Yan Zhou, Tao Luo, Hua Wang, Junyi Li
  • Publication number: 20230396218
    Abstract: An exemplary device with differential complex neutralization circuit and device structure are disclosed that can provide substantial device gain boosting over a wide bandwidth (BW) for an amplifier core, e.g., for low noise power amplifier, high frequency amplifier, power amplifier, and the like. The device structure includes neutralization capacitors with designed inductors for the collectors, bases, and capacitor feeding that substantially improve the device gain/stability over a wide bandwidth by absorbing the parasitic inductors of the routings/vias and the capacitors and minimizes the passive loss. At high mm-Wave, neutralization can be realized by overlapping metal traces in device layouts to achieve a device gain of greater than unity gain.
    Type: Application
    Filed: June 5, 2023
    Publication date: December 7, 2023
    Inventors: Hua Wang, Tzu-Yuan Huang, Mohamed Eleraky, Yuqi Liu
  • Publication number: 20230394438
    Abstract: Systems, methods and/or computer program products for automating evaluations of code deliveries for software projects. Automated evaluations are generated by selecting software projects and dividing a project into a plurality of code blocks by analyzing the code, build file and build log. Attributes of code blocks are extracted and correlations between code blocks are calculated. Dynamic distance between code blocks is calculated by the correlation and code delivery history, to create a Dynamic General Distance Map and Dynamic User Distance Map for the code blocks. Code delivery distance indicating the code delivery behavior is generated by the Dynamic User Distance Map while the delivery assessment criteria is generated to evaluate code delivery and assess levels of risk associated with delivery of the code. High-level risk indicates that a code delivery may not follow best practices and users are alerted to pay more attention to the code delivery during review.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 7, 2023
    Inventors: Bo Tong Liu, Qi Li, Cheng Fang Wang, Yan Wei Zhao, Cai Hua Zhao
  • Publication number: 20230391474
    Abstract: Disclosed are a self-positioning assembly system for rapid assembly of an aircraft and a method thereof. The self-positioning assembly system includes a mounting platform, a framework assembly, a hole positioner assembly, a strut positioner assembly and a pallet assembly. The framework assembly is mounted on the mounting platform and includes a hole positioner column and a pallet column, the hole positioner assembly is arranged on the hole positioner column, the pallet assembly is arranged on the pallet column, a plurality of the hole positioner columns are respectively arranged on both sides of the mounting platform, and a plurality of the pallet columns are arranged in a middle of the mounting platform.
    Type: Application
    Filed: August 16, 2023
    Publication date: December 7, 2023
    Applicant: CHENGDU AIRCRAFT INDUSTRIAL (GROUP) CO., LTD.
    Inventors: Shaochun SUI, Hua RAO, Ying ZHAO, Xiuwen BI, Zhenbo DENG, Shaojie LI, Shimao YOU, Ming WANG
  • Publication number: 20230395974
    Abstract: A beamforming cellular antenna includes a plurality of patch elements and a plurality of dipole elements. The plurality of patch elements and dipole elements are arranged on a planar array of said antenna into a plurality of rows and columns of elements. Each column of elements forms a sub-array connected to a plurality of signal input ports. Each column sub-array includes a plurality of both patch elements, and a plurality of dipole elements.
    Type: Application
    Filed: June 3, 2022
    Publication date: December 7, 2023
    Inventors: Lin-Ping Shen, Nasrin Hojjat, Hua Wang, Erik Willis, Liviu Negru
  • Publication number: 20230393489
    Abstract: A method includes transferring an inner pod of a carrier out from an outer pod of the carrier into a lithography exposure apparatus, the inner pod containing a reticle including a reflective multilayer and a pellicle underlying the reflective multilayer; detecting a condition of the pellicle using a metrology device positioned on a base plate of the inner pod during transferring the inner pod in the lithography exposure apparatus; determining whether the condition of the pellicle is acceptable; issuing a warning when the condition of the pellicle is not acceptable.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Hao LIU, Shao-Hua WANG, Zheng-Hao ZHANG, Fan-Chi LIN, Chueh-Chi KUO, Li-Jui CHEN, Heng-Hsin LIU
  • Publication number: 20230395515
    Abstract: Methods and devices include a chip package structure, including a first semiconductor die, a second semiconductor die, a redistribution structure, and a first underfill material portion located between the redistribution structure and the first semiconductor die and the second semiconductor die. The redistribution structure includes a first redistribution structure portion physically and electrically connected to the first semiconductor die, a second redistribution structure portion physically and electrically connected to the second semiconductor die, and a dummy bump region positioned between and electrically isolated from the first redistribution structure portion and the second redistribution structure portion.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 7, 2023
    Inventors: Chia-Kuei Hsu, Ming-Chih Yew, Chin-Hua Wang, Li-Ling Liao, Shin-Puu Jeng
  • Patent number: 11838857
    Abstract: A method of wireless communication is performed by a user equipment (UE). The method receives, from a network, a configuration for a decision making module. The method also executes the decision making module to determine a selection parameter for a configuration of at least one machine learning module. The method selects the configuration of the at least one machine learning module based on the selection parameter. Further, the method reports, to the network, a decision resulting from executing the decision making module.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: December 5, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Tianyang Bai, Hua Wang, Junyi Li
  • Patent number: 11838080
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may receive a configuration that indicates multiple sidelink channel state information (CSI) reporting sets, wherein different sidelink CSI reporting sets include different combinations of CSI parameters; receive an indication of a sidelink CSI reporting set, of the multiple sidelink CSI reporting sets, to be reported in a sidelink CSI report; and transmit the sidelink CSI report, wherein the sidelink CSI report includes a set of values for one or more CSI parameters included in the indicated sidelink CSI reporting set. Numerous other aspects are provided.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: December 5, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Hua Wang, Sony Akkarakaran, Tao Luo, Junyi Li
  • Patent number: 11833502
    Abstract: A coke control reactor, and a device and method for preparing low-carbon olefins from an oxygen-containing compound are provided. The coke control reactor includes a coke control reactor shell, a reaction zone I, and a coke controlled catalyst settling zone; a cross-sectional area at any position of the reaction zone I is less than that of the coke controlled catalyst settling zone; n baffles are arranged in a vertical direction in the reaction zone I; the n baffles divide the reaction zone I into m reaction zone I subzones; and a catalyst circulation hole is formed in each of the baffles, such that a catalyst flows in the reaction zone I in a preset manner. A catalyst charge in the present coke control reactor can be automatically adjusted, and an average residence time of a catalyst in the coke control reactor can be controlled by changing process operating conditions.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: December 5, 2023
    Assignee: DALIAN INSTITUTE OF CHEMICAL PHYSICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Tao Zhang, Mao Ye, Jinling Zhang, Shuliang Xu, Hailong Tang, Xiangao Wang, Cheng Zhang, Jinming Jia, Jing Wang, Hua Li, Chenggong Li, Zhongmin Liu
  • Publication number: 20230388937
    Abstract: A method and an apparatus for controlling a transmission power, and a storage medium. The method includes: determining a target number of transmission cycles according to a service scenario of an electronic device, wherein a preset time window is divided into the target number of transmission cycles, and the preset time window is a test cycle used in a specific absorption rate (SAR) test of the electronic device; determining at least one of an upper limit value or a lower limit value of a transmission power corresponding to each transmission cycle, wherein an average value of transmission powers in the preset time window complies a SAR requirement; and controlling the electronic device to transmit and receive signals using a corresponding transmission power in each transmission cycle.
    Type: Application
    Filed: August 24, 2022
    Publication date: November 30, 2023
    Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Hua ZHANG, Deqian WANG, Jie ZHANG, Chao WU, Shui LIU, Xin LIU
  • Publication number: 20230386960
    Abstract: A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Yu-Sheng LIN, Shu-Shen YEH, Chin-Hua WANG, Po-Yao LIN, Shin-Puu JENG
  • Publication number: 20230384682
    Abstract: An apparatus and a method for effectively exhausting evaporated material are provided. In an embodiment the apparatus includes a hot plate and an exhaust hood assembly suspended over the hot plate. The exhaust hood assembly includes a trench plate, a cover plate over the trench plate and a single exhaust pipe header over and attached to a single exhaust opening of the cover plate. During operation, the exhaust hood assembly reduces the amount of condensation and also collects any remaining condensation in order to help prevent condensation from impacting further manufacturing steps.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu
  • Publication number: 20230389445
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method includes forming a memory cell stack over a substrate. The memory cell stack includes a top electrode. A sidewall spacer structure is formed around the memory cell stack. The sidewall spacer structure includes a first sidewall spacer layer, a second sidewall spacer layer, and a protective sidewall spacer layer sandwiched between the first and second sidewall spacer layers. A dielectric structure is formed over the sidewall spacer structure. A first etch process is performed on the dielectric structure and the second sidewall spacer layer to define an opening above the top electrode. The second sidewall spacer layer and the dielectric structure are etched at a higher rate than the protective sidewall spacer layer during the first etch process. A top electrode via is formed within the opening.
    Type: Application
    Filed: August 3, 2023
    Publication date: November 30, 2023
    Inventors: Yao-Wen Chang, Chung-Chiang Min, Harry-Hak-Lay Chuang, Hung Cho Wang, Tsung-Hsueh Yang, Yuan-Tai Tseng, Sheng-Huang Huang, Chia-Hua Lin
  • Publication number: 20230382871
    Abstract: Provided is the use of a CSF1R kinase inhibitor compound or a pharmaceutically acceptable salt thereof in the preparation of drugs for treating diseases related to the CSF1R kinase signal transduction pathway or drugs for regulating immunization.
    Type: Application
    Filed: September 22, 2021
    Publication date: November 30, 2023
    Inventors: Jian DING, Wenhu DUAN, Hua XIE, Meiyu GENG, Caixia WANG, Zhengsheng ZHAN, Na GAO, Yang ZHANG
  • Publication number: 20230383435
    Abstract: In an embodiment, an apparatus includes a first pyrometer and a second pyrometer configured to monitor thermal radiation from a first point and a second point on a backside of a wafer, respectively, a first heating source in a first region and a second heating source in a second region of an epitaxial growth chamber, respectively, where a first controller adjusts an output of the first heating source and the second heating source based upon the monitored thermal radiation from the first point and the second point, respectively, a third pyrometer and a fourth pyrometer configured to monitor thermal radiation from a third point and a fourth point on a frontside of the wafer, respectively, where a second controller adjusts a flow rate of one or more precursors injected into the epitaxial growth chamber based upon the monitored thermal radiation from the first, second, third, and fourth points.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Li-Ting Wang, Jung-Jen Chen, Ming-Hua Yu, Yee-Chia Yeo
  • Publication number: 20230387063
    Abstract: A package includes a package substrate, the package substrate having a first side and a second side opposite to the first side, a package component bonded to the first side of the package substrate, a front-side warpage control structure attached to the first side of the package substrate, and a backside warpage control structure embedded in the package substrate from the second side of the package substrate. The front-side warpage control structure includes a first disconnected structure and a second disconnected structure laterally separated from each other by a gap. The backside warpage control structure includes a third disconnected structure and a fourth disconnected structure laterally separated from each other.
    Type: Application
    Filed: May 24, 2022
    Publication date: November 30, 2023
    Inventors: Yu-Sheng Lin, Shu-Shen Yeh, Ming-Chih Yew, Chin-Hua Wang, Shin-Puu Jeng
  • Publication number: 20230388970
    Abstract: This disclosure provides systems, devices, apparatus, and methods, including computer programs encoded on storage media, for retransmission and selection of HARQ and MCS based on partial sensing. A UE may perform a partial sensing procedure to identify one or more available resources for a sidelink transmission of the UE and transmit the sidelink transmission on a resource selected from the one or more available resources. The sidelink transmission may include at least one of a HARQ retransmission parameter or an MCS selected for the sidelink transmission based on at least one of a number of candidate slots for the partial sensing procedure, a quantity of the one or more available resources within the number of candidate slots, or a number of times that a threshold for a minimum amount of the one or more available resources is increased.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Inventors: Jung Ho RYU, Sony AKKARAKARAN, Gabi SARKIS, Tao LUO, Junyi LI, Hua WANG, Jelena DAMNJANOVIC
  • Publication number: 20230386951
    Abstract: In an embodiment, a package including: a redistribution structure including a first dielectric layer and a first conductive element disposed in the first dielectric layer; a first semiconductor device bonded to the redistribution structure, wherein the first semiconductor device includes a first corner; and an underfill disposed over the redistribution structure and including a first protrusion extending into the first dielectric layer of the redistribution structure, wherein the first protrusion of the underfill overlaps the first corner of the first semiconductor device in a plan view.
    Type: Application
    Filed: May 31, 2022
    Publication date: November 30, 2023
    Inventors: Yu-Sheng Lin, Chien-Tung Yu, Chia-Hsiang Lin, Chin-Hua Wang, Shin-Puu Jeng
  • Patent number: 11829539
    Abstract: A touch sensor having a visible area and a peripheral area includes a substrate, a metal nanowire layer, and a silver layer. The metal nanowire layer is disposed on a main surface of the substrate and defines an electrode portion and first and second wirings, in which the first wiring includes a lead-out portion connected to the electrode portion and a lead portion connected to the lead-out portion, and the second wiring is disposed on a side of the first wiring relatively away from the visible area and adjacent to an edge of the main surface. The silver layer is stacked on the first and second wirings and has a first side facing toward the visible area and a second side facing away from the visible area, and an edge roughness on the first side is greater than an edge roughness on the second side.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: November 28, 2023
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Shao Jie Liu, Chia Jui Lin, Chien Hsien Yu, Jian Zhang, Si Qiang Xu, Jun Hua Huang, Mei Fen Bai, Song Xin Wang, Long Yun Zhan, Bo Huang