Patents by Inventor Hua Wang

Hua Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250144231
    Abstract: Disclosed herein are compositions and methods for metabolically labeling cells using click chemistry reagents. The compositions and methods disclosed herein provide a specific and efficient means of localizing desired agents, such as anti-tumor cytokines, to a variety of cell types for adoptive cell therapy.
    Type: Application
    Filed: October 10, 2024
    Publication date: May 8, 2025
    Applicant: President and Fellows of Harvard College
    Inventors: David J. Mooney, Yutong Liu, Hua Wang
  • Patent number: 12289725
    Abstract: Methods, systems, and devices for identification reinterpretation in sidelink control information (SCI) are described. A first user equipment (UE) may transmit to a second UE or device, on a sidelink channel, SCI. The SCI may include a partial source and destination identifier fields and may indicate to the second UE to apply a first interpretation of multiple different interpretations for the partial source identifier field and the partial destination identifier field. For example, the SCI may indicate to interpret the partial source identifier field and the partial destination identifier field in combination as a source identifier field, as a destination identifier field, or as a partial source identifier and a partial destination identifier. The UE may transmit a medium access control (MAC) packet including a MAC header with identifier fields set to be complementary to the SCI.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: April 29, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Hua Wang, Sony Akkarakaran, Hong Cheng, Jung Ho Ryu, Jelena Damnjanovic, Tao Luo, Junyi Li
  • Publication number: 20250133360
    Abstract: A ribbon speaker includes a housing, first and second magnet assemblies, a ribbon diaphragm, a coil, and a flexible substrate. The first and second magnet assemblies is arranged in the housing. The same poles of the first magnet assembly and the second magnet assembly are arranged opposite to each other. The diaphragm is positioned between these magnet assemblies. The coil, placed on this diaphragm, includes two first connection portions. The flexible substrate includes a body, two connection portions, and two soldering portions. The body's first part is inside the housing, while the second part arranged outside. The second connections on the body's first part electrically connected to the coil's first connections. The externally positioned soldering portions facilitate easier assembly, significantly reducing soldering complexity. The soldering portions are respectively and electrically connected to the second connection portions.
    Type: Application
    Filed: March 18, 2024
    Publication date: April 24, 2025
    Inventors: HUI-CHENG CHEN, KUANG-YUN LI, PO-SHENG CHIU, KE-HUA WANG, PAI-LU HUANG, HAO-CHUN TENG
  • Publication number: 20250132216
    Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.
    Type: Application
    Filed: January 2, 2025
    Publication date: April 24, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 12283553
    Abstract: A chip package structure is provided. The chip package structure includes a first semiconductor die bonded over an interposer substrate and a warpage release layer structure. The chip package structure also includes a first organic material layer covering an upper surface of the first semiconductor die; and a first metal layer covering an upper surface of the first organic material layer. The first metal layer has a planar shape that is the same as a planar shape of the first semiconductor die, as viewed in a top-view perspective.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: April 22, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20250121251
    Abstract: An electric step, including a chassis, a housing, a motor, and two pedals. The housing is fixedly arranged on the chassis. A horizontal central shaft is fixedly arranged in the housing. Each of both ends of the central shaft is arranged with a turntable. An inner end of each pedal is arranged on a corresponding turntable. An axis of the pedal deviates from an axis of the central shaft. The motor is fixedly arranged in the housing and configured to drive the turntable to rotate via a transmission mechanism.
    Type: Application
    Filed: October 11, 2024
    Publication date: April 17, 2025
    Inventors: Xiong Wang, Jiawu Zhang, Hua Wang
  • Publication number: 20250122740
    Abstract: A water surface cleaning robot includes a machine body provided with a through groove, an accommodating member located at a front end of the through groove and two symmetrically arranged drivers arranged in the through groove, and the two drivers are both fixedly connected with two side walls of the through groove or a groove bottom of the through groove. In the water surface cleaning robot, a flow guide plate is covered below the driver at a rear end of the through groove, the flow guide plate cooperates with the accommodating member and the through groove to form a cavity penetrating through front and back portions, and a rear end of the flow guide plate is connected with the machine body through a partition plate located between the two drivers.
    Type: Application
    Filed: November 28, 2023
    Publication date: April 17, 2025
    Applicant: Taizhou Dibiao Technology Co., Ltd.
    Inventor: Hua WANG
  • Publication number: 20250123576
    Abstract: In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.
    Type: Application
    Filed: December 23, 2024
    Publication date: April 17, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yu TU, Shao-Hua WANG, Yen-Hao LIU, Chueh-Chi KUO, Li-Jui CHEN, Heng-Hsin LIU
  • Patent number: 12278156
    Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.
    Type: Grant
    Filed: November 29, 2023
    Date of Patent: April 15, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh
  • Patent number: 12276947
    Abstract: A method for time synchronization in a vehicle may include transmitting, by a satellite navigation device to a controller and at least one LiDAR device, a UTC and a PPS signal. The satellite navigation device may have a first clock. The method may include synchronizing, by the controller, a second clock of the controller with the first clock of the satellite navigation device based on the PPS signal and the UTC. The method may include synchronizing, by the at least one LiDAR device, a third clock of the at least one LiDAR device with the first clock of the satellite navigation device based on the PPS signal and the UTC. The method may include synchronizing, by at least one camera, a fourth clock of the at least one camera with the second clock of the controller.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: April 15, 2025
    Assignee: BEIJING VOYAGER TECHNOLOGY CO., LTD.
    Inventors: Hua Wang, Fenglei Wang, Zhenqiang Yan
  • Publication number: 20250113209
    Abstract: Wireless communications systems and methods related to sidelink communications between user equipments (UEs). A method of wireless communication performed by a first UE comprises establishing a connection with a second UE on a first frequency channel; transmitting, via the first frequency channel, an indication of resources on a second frequency channel; transmitting, via the second frequency channel using the indicated resources, one or more signals sweeping a plurality of beam directions; receiving, via the first frequency channel or the second frequency channel in response to transmitting the one or more signals, an index associated with a preferred beam direction; and communicating with the second UE in the second frequency channel using the preferred beam direction.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Hua WANG, Sony AKKARAKARAN, Kazuki TAKEDA, Jelena DAMNJANOVIC
  • Publication number: 20250112217
    Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first tier, a second tier, and a third tier. The first tier includes an interposer. The second tier is disposed on the first tier and includes a bottom die. The third tier is disposed on the second tier and includes a plurality of first dies and at least one second die. The at least one second die is disposed between the plurality of first dies. The plurality of first dies are electrically connected to the bottom die by a plurality of first connectors to form a signal path, the plurality of first dies are electrically connected to the interposer by a plurality of second connectors to form a power path, and the plurality of first connectors are closer to the at least one second die than the plurality of second connectors.
    Type: Application
    Filed: December 13, 2024
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng
  • Patent number: 12267715
    Abstract: Methods, systems, and devices for wireless communication are described. Generally, the described techniques provide for determining sidelink channel metrics using reference signal measurements of reference signals transmitted by other UEs. A first UE may receive a control message from a base station, and the control message may indicate a measurement threshold. The first UE may generate a reference signal measurement of a reference signal transmitted by a second UE via a sidelink channel between the first UE and the second UE. The UE may transmit a measurement report to the base station based at least in part on the measurement satisfying the threshold. The report may be a quantized value of the measurement or a bit indicating that the measurement satisfies the threshold. Based on receipt of the measurement report, the base station may determine to transmit data to the second UE via a transmission to the first UE.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: April 1, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Hua Wang, Piyush Gupta, Junyi Li, Xiaoxia Zhang, Jing Sun, Yisheng Xue, Seyed Ali Akbar Fakoorian
  • Publication number: 20250105191
    Abstract: A package structure including an organic interposer substrate, a semiconductor die, conductive bumps, an underfill, and an insulating encapsulation is provided. The organic interposer substrate includes stacked organic dielectric layers and conductive wirings embedded in the stacked organic dielectric layers. The semiconductor die is disposed over and electrically connected to the conductive wirings of the organic interposer substrate, and the semiconductor die includes chamfered edges. The conductive bumps are disposed between the semiconductor die and the organic interposer substrate, and the semiconductor die is electrically connected to the organic interposer substrate through the conductive bumps. The underfill is disposed between the semiconductor die and the organic interposer substrate, wherein the underfill encapsulates the conductive bumps and is in contact with the chamfered edges of the at least one semiconductor die.
    Type: Application
    Filed: December 11, 2024
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20250105170
    Abstract: A semiconductor package includes: a package substrate including a horizontal top surface; an interposer bonded to the top surface of the package substrate; a semiconductor die bonded to a top surface of the interposer, the semiconductor die including a bottom surface that faces the top surface of the interposer, and chamfers formed in corners of the bottom surface of the semiconductor die; and a molding layer surrounding the semiconductor die and filling the chamfers.
    Type: Application
    Filed: September 27, 2023
    Publication date: March 27, 2025
    Inventors: Tsung-Yen Lee, Ming-Chih Yew, Chin-Hua Wang, Shin-Puu Jeng
  • Publication number: 20250101743
    Abstract: The present disclosure relates generally to roofing systems. for example. suitable for covering the roof of a house or other building. The present disclosure relates more particularly to a roofing panel support including a bracket with a support platform configured to receive a roofing panel. a first leg extending rearward from a first side of the support platform, and a second leg extending rearward from a second side of the support platform. A hook for holding the roofing panel is coupled to the bracket and disposed below the support platform. Insulation may surround the hook. Additionally. a conductive malleable strip may be positioned between the bracket and a support structure.
    Type: Application
    Filed: January 18, 2023
    Publication date: March 27, 2025
    Inventors: Michael J. LEMBO, Sahas RATHI, Yi JIANG, Alex C. NASH, Hua WANG, Olivier ROSSELER
  • Patent number: 12262418
    Abstract: Methods, systems, and devices for wireless communication are described. A first user equipment (UE) may receive, from a second UE, an indication of a first uplink timing advance for communications from the second UE to a base station. The UE may estimate, based at least in part on the first uplink timing advance received from the second UE, a second uplink timing advance for transmission of a random access message from the first UE to the base station. The UE may transmit, to the base station, the random access message using the second uplink timing advance.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: March 25, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Hua Wang, Sony Akkarakaran, Tao Luo, Junyi Li, Jung Ho Ryu
  • Patent number: 12258430
    Abstract: Disclosed herein are compositions and methods for labeling cells using click chemistry reagents. The compositions and methods disclosed herein provide a specific and efficient means of localizing desired agents to a variety of cell types in vivo and in vitro.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: March 25, 2025
    Assignee: President and Fellows of Harvard College
    Inventors: Hua Wang, David J. Mooney
  • Publication number: 20250092623
    Abstract: A water surface cleaning robot includes a robot shell provided with a roller brush, two ends of the roller brush being connected with the robot shell, and a storage basket is arranged inside the robot shell. One side of the storage basket is provided with a baffle, a top portion of the storage basket is provided with an opening extending to the baffle, the roller brush is arranged above the baffle, the roller brush includes a plurality of blades, one end of the blade is provided with a hook, and the hook is oriented to one side entering water. Because the blade is provided with the hook, when the blade rotates to enter water, a contact area between the blade and a water surface is reduced, so that a resistance of the water surface to the blade is reduced, and a shoveling force generated by rotation is stronger.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 20, 2025
    Applicant: Taizhou Dibiao Technology Co., Ltd.
    Inventor: Hua WANG
  • Patent number: D1069256
    Type: Grant
    Filed: September 26, 2024
    Date of Patent: April 1, 2025
    Assignee: Jiangsu Great Mansion Artware Co., LTD.
    Inventor: Hua Wang