Patents by Inventor Hua Wang

Hua Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151736
    Abstract: The disclosure provides an apparatus for high throughput analysis of samples and a method of making an assay card and performing an assay using the apparatus. The apparatus can include a transporter to position and advance a first plate of the QMAX card, a first dispenser to deposit a sample on the first plate, a second dispenser to dispense a reagent to contact the sample, a press to compress the sample between the first and second plates of the QMAX card into a uniformly thick layer, and an imager to image the uniformly thick layer.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: Essenlix Corporation
    Inventors: Stephen Y. CHOU, Hua TAN, Yanjun WANG, Wei DING
  • Publication number: 20240152880
    Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.
    Type: Application
    Filed: February 13, 2023
    Publication date: May 9, 2024
    Applicant: OBOOK INC.
    Inventors: Chun-Kai Wang, Chung-Han Hsieh, Chun-Jen Chen, Po-Hua Lin, Wei-Te Lin, Pei-Hsuan Weng, Mei-Su Wang, I-Cheng Lin, Cheng-Wei Chen
  • Publication number: 20240155699
    Abstract: Methods and apparatus for offloading wireless connections are disclosed. An example method includes configuring a wireless offload engine to maintain a wireless connection on behalf of one or more circuits coupled to the wireless offload engine, determining that the one or more circuits are to enter a low-power state, and maintaining the wireless connection after the one or more circuits have entered the low-power state based at least in part on the configuring.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: Shao-Hua FENG, Chun-Guang WANG
  • Publication number: 20240153840
    Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 9, 2024
    Inventors: Shin-Puu JENG, Po-Yao LIN, Feng-Cheng HSU, Shuo-Mao CHEN, Chin-Hua WANG
  • Publication number: 20240154629
    Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Publication number: 20240153839
    Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Shen YEH, Po-Yao LIN, Chin-Hua WANG, Yu-Sheng LIN, Shin-Puu JENG
  • Patent number: 11977850
    Abstract: A method for dialogue processing, an electronic device and a storage medium are provided. The specific technical solution includes: obtaining a dialogue history; selecting a target machine from a plurality of machines; inputting the dialogue history into a trained dialogue model in the target machine to generate a response to the dialogue history, in which the dialogue model comprises a common parameter and a specific parameter, and different machines correspond to the same common parameter.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 7, 2024
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Fan Wang, Siqi Bao, Huang He, Hua Wu, Jingzhou He, Haifeng Wang
  • Patent number: 11978678
    Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 7, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang
  • Patent number: 11978417
    Abstract: A pixel array substrate includes multiple data lines, multiple scan lines and multiple pixel structures. The scan lines include an m-th scan line and an (m+1)-th scan line arranged in sequence, and m is a positive integer. The pixel structures include first to twenty-fourth pixel structures. A control terminal of a transistor of the seventh pixel structure and a control terminal of a transistor of the eighth pixel structure are electrically connected to the (m+1)-th scan line and the m-th scan line respectively. A control terminal of a transistor of the thirteenth pixel structure and a control terminal of a transistor of the fourteenth pixel structure are electrically connected to the (m+1)-th scan line and the m-th scan line respectively.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: May 7, 2024
    Assignee: AUO Corporation
    Inventors: Shiuan-Hua Huang, Lin-Chieh Wei, Chun-Min Wang
  • Patent number: 11979903
    Abstract: A base station may instruct a UE to use at least one weighting factor associated with a CR for the UE, and the UE may apply the at least one weighting factor to the one or more resources scheduled for the PSSCH transmission to determine the CR. The UE may transmit the PSSCH in the one or more resources of the at least one slot based on the determined CR being less than or equal to a CR threshold value. The at least one weighting factor may be applied to the one or more resources in each of multiple slots scheduled for transmission of a PSSCH.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: May 7, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Hua Wang, Sony Akkarakaran, Jung Ho Ryu, Tao Luo, Junyi Li
  • Publication number: 20240142732
    Abstract: A method includes forming a first waveguide over a substrate; forming a first layer of low-dimensional material on the first waveguide; forming a first layer of dielectric material over the first layer of low-dimensional material; forming a second layer of low dimensional material on the first layer of dielectric material; and forming a first conductive contact that electrically contacts the first layer of low-dimensional material and a second conductive contact that electrically contacts the second layer of low-dimensional material.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 2, 2024
    Inventors: Chih-Hsin Lu, Chin-Her Chien, Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu
  • Publication number: 20240141786
    Abstract: An active control method and device for large deformation of a deep thin-bedded surrounding rock, the active control method includes: drill holes in the surrounding rock of a tunnel against a tunnel face, add the active control device containing a sleeve, a high-strength prestressed anchor bolt, a resin anchoring agent and a grouting device into drill holes, apply a preload to the anchor bolt when the resin anchoring agent has a certain strength, and carry out lag grouting in the surrounding rock through the grouting device after stress adjustment, and the high-strength prestressed anchor bolt and the grouting device are inserted in the sleeve with holes on the side. The active control device or method of the invention can effectively reduce the fracture depth and degree of a thin-bedded soft rock in deep engineering, and effectively inhibit the occurrence of large deformation disasters.
    Type: Application
    Filed: October 30, 2023
    Publication date: May 2, 2024
    Inventors: Hua Zhou, Yelin Feng, Fugang Zhao, Pengzhi Pan, Hailong Huang, Zhaofeng Wang, Xufeng Liu, Yangyi Zhou, Longhai Xi, Xuanjiao Zhen
  • Patent number: 11973001
    Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 11973067
    Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 30, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng, Hui-Chieh Wang, Shun-Yuan Hu
  • Patent number: 11973474
    Abstract: The disclosed technology includes device, systems, techniques, and methods for amplifying a complex modulated signal with a broadband power amplifier. A broadband power amplifier may include an input network connected a long an input signal path, a driver stage, an interstage matching network stage, a power amplification stage, and a broadband matching output network. The broadband matching output network may include two coupled transmission lines and a compensation line connected between the two coupled transmission lines. Further, the broadband matching output network may include a capacitor connected with a secondary winding and a capacitor connected to each of the primary windings. The disclosed technology further includes transmission systems incorporating the broadband power amplifier.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: April 30, 2024
    Assignee: Georgia Tech Research Corporation
    Inventors: Fei Wang, Hua Wang
  • Patent number: 11969097
    Abstract: An inflatable product includes an inflatable chamber and a supplemental layer. The supplemental layer is disposed on the inflatable chamber. Further, the supplemental layer is directly or indirectly fixed to the inflatable chamber by sewing. The inflatable chamber is made of plastic. The material of the supplemental layer is different from that of the inflatable chamber.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: April 30, 2024
    Assignee: INNOVATOR PLASTIC & ELECTRONICS (HUIZHOU) CO LTD
    Inventors: Cheng-Chung Wang, Chien-Hua Wang, Yao-Hua Wang
  • Patent number: 11969286
    Abstract: A system for visualization and quantification of ultrasound imaging data according to embodiments of the present disclosure may include a display unit, and a processor communicatively coupled to the display unit and to an ultrasound imaging apparatus for generating an image from ultrasound data representative of a bodily structure and fluid flowing within the bodily structure. The processor may be configured to estimate axial and lateral velocity components of the fluid flowing within the bodily structure, determine a plurality of flow directions within the image based on the axial and lateral velocity components, differentially encode the flow directions based on flow direction angle to generate a flow direction map, and cause the display unit to concurrently display the image including the bodily structure overlaid with the flow direction map.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: April 30, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Hua Xie, Shiying Wang, Sheng-Wen Huang, Francois Guy Gerard Marie Vignon, Keith William Johnson, Liang Zhang, David Hope Simpson
  • Publication number: 20240137884
    Abstract: Methods, systems, and devices for wireless communications at a user equipment (UE) are described. A UE may identify one or more measurement parameters to use for input in a machine learning (ML) model. In some cases, the measurement parameters may include reference signal received power measurements or a past set of timing advance (TA) values for a specific node. The UE may predict the TA based on inputting the measurement parameters into the ML model. The UE may transmit an uplink communication from the UE to a network entity using the TA predicted from the ML model. In some examples, the UE may transmit a capability report to indicate that the UE may support autonomous update of the TA based on the predictions of the TA values produced from the ML model.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Tianyang Bai, Hua Wang, Yan Zhou, Junyi Li, Tao Luo
  • Publication number: 20240132474
    Abstract: Provided are compounds useful for treating of cancer and methods for treating of cancer, comprising administering to a subject in need thereof a compound described therein.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 25, 2024
    Inventors: Samuel V. Agresta, Chong-Hui Gu, David Schenkein, Hua Yang, Liting Guo, Zhen Tang, Jianming Wang, Yanfeng Zhang, Yan Zhou
  • Publication number: 20240132631
    Abstract: The invention provides a preparation method of high-content Ganoderma lucidum ?-glucan and an efficient and rapid detection method thereof. The preparation method comprises ethanol-trypsin pretreatment of Ganoderma lucidum fruiting body in combination with ultrasonic-assisted alkaline hydrothermal extraction of ?-glucan from Ganoderma lucidum, and purifying ?-glucan by DEAE Sephadex A-25 Sephadex column chromatography using NAOH solution as a mobile phase, to obtain high purity (?90%) of Ganoderma lucidum ?-glucan. The detection method comprises placing the extracted ?-glucan in an autoclave and performing hydrolysis with ?-(1,3)-exo-glucanase and ?-glucosidase, and detecting and analyzing the content of the prepared ?-glucan by high pressure-acid enzymatic hydrolysis-HPLC method, using glucose as a standard. The preparation method of ?-glucan has high extraction ratio.
    Type: Application
    Filed: February 1, 2023
    Publication date: April 25, 2024
    Applicant: SHAANXI ANGSHENG BIO-PHARMACEUTICAL TECHNOLOGY CO., LTD.
    Inventors: Yinjun HOU, Hua Li, Qian Gao, Yongbo Wang, Xiuding Yang, Yue Gao, Yuqing Zhao, Jie Zhang, Chengyuan Liang