Abstract: A battery box and a battery pack are provided. The battery box includes a bottom plate and a side wall. The side wall and the bottom plate enclose a space for accommodating a battery and/or an electrical component. The battery box further includes a lifting column integrally formed with the side wall and a fixed sealing block sleeved on the lifting column. The bottom plate is located between the side wall and the fixed sealing block. The side wall is fixedly connected to the bottom plate through the fixed sealing block. A first sealing member for sealing a gap between the fixed sealing block and the bottom plate is arranged between the fixed sealing block and the bottom plate. The fixed sealing block is sealingly connected to the lifting column.

Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.

Abstract: The disclosure provides IL-7 fusion proteins as well as compositions comprising them. The disclosure further provides methods of treating and/or preventing lymphopenia or immunodeficiency in a subject, wherein the method includes administering a fusion protein as described herein.

Abstract: A method for mobility enhancement in wireless communication systems is provided. The method is performed by a User Equipment (UE) configured with a first Small Data Transmission (SDT) configuration by a first cell. The method includes receiving a Radio Resource Control (RRC) release message including a suspend configuration from the first cell; transitioning to an RRC INACTIVE state in response to receiving the RRC release message; receiving, in the RRC INACTIVE state, a System Information Block Type 1 (SIB1) including a second SDT configuration from a second cell; camping on the second cell in response to receiving the SIB1 from the second cell; and while the UE is camping on the second cell, refraining from using the first SDT configuration to initiate an SDT procedure associated with the second cell in a case that the UE does not support performing the SDT procedure associated with the second cell.

Abstract: A multi-band filter includes a circuit board, a first resonator, a second resonator, and a coupling element configured to couple the first resonator with the second resonator. The coupling element includes a first coupling capacitor, a second coupling capacitor, a first short-circuited stub and a second short-circuited stub. The first coupling capacitor has two terminals electrically connected to the first portion of the first resonator and the first portion of the second resonator respectively. The second coupling capacitor has two terminals electrically connected to the second portion of the first resonator and the second portion of the second resonator respectively. The first short-circuited stub is electrically connected to the first coupling capacitor and a ground plane. The second short-circuited stub is electrically connected to the second coupling capacitor and a ground plane.

Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: Disclosed is a secret-key provisioning (SKP) method and device based on an optical line terminal (OLT), which can generate an SKP queue according to key requests received; generate at least one secret-key according to the SKP queue; and store the at least one secret-key in key pools (KPs) of corresponding ONUS. A non-transitory computer-readable storage medium is also disclosed.

Abstract: Methods, systems, and devices for wireless communications are described. In some examples, a user equipment (UE) may receive, from a base station, a configuration indicating a set of occasions configured for sidelink communications for the UE. The sidelink communications may include at least one of sidelink traffic, semi-persistent scheduling traffic, or a combination thereof. The UE may receive a control indication associated with a radio network temporary identifier. The control indication may include a downlink control information. In some examples, the UE may skip a first pre-scheduled occasion of the set of occasions configured for sidelink communications based on the control indication, and may perform sidelink communications during a second pre-scheduled occasion of the set of occasions after skipping the first pre-scheduled occasion.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: The present invention relates to an optical system for triglyceride inspection partially integrated into a toilet seat and comprising a plurality of optical sensor modules and a controlling and processing module, wherein each said optical sensor module comprises a first light source, a second light source and an optical sensor. The optical sensor receives light signals generated by the first and second light sources respectively on the skin of the person (especially the skin of the thighs) to be tested and thereby generates a sensing signal of an adaptive calibration function. The sensing signal is then converted by the controlling and processing module into an inspection value of triglyceride, which is transmitted to a display unit. With the above optical system for triglyceride inspection, triglycerides can be inspected automatically without invasive blood sampling, making the system a convenient home health monitoring device.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A vehicle window assembly and a vehicle are provided in the disclosure. The vehicle window assembly includes multiple light guide strips spaced apart from each other, a vehicle window glass sheet, and a sealing box. The multiple light guide strips are arranged on one side surface of the vehicle window glass sheet, the sealing box is disposed at one side of each of the multiple light guide strips away from the vehicle window glass sheet, the sealing box defines grooves at positions respectively corresponding to the multiple light guide strips, and each of the multiple light guide strips is received in one of the grooves. The multiple light guide strips are received in the sealing box, the sealing box is directly fixed to the vehicle window glass sheet by the fixing member.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may transmit, to a second UE, an indication of at least one sidelink unified transmission configuration indicator (TCI) state, wherein the at least one sidelink unified TCI state includes at least one of: a joint forward link and reverse link TCI state, a separate forward link TCI state, or a separate reverse link TCI state. The first UE may communicate with the second UE on at least one of the forward link or the reverse link based at least in part on the indication of the sidelink unified TCI state. Numerous other aspects are described.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: Methods, systems, and devices for wireless communications that support inter-user equipment (UE) coordination (IUC) for beamformed communications are described. A first UE may receive, using a first spatial filter, a first sidelink control message including a first sidelink resource reservation associated with a second UE. Additionally, or alternatively, the first UE may receive, using a second spatial filter, a second sidelink control message including a second sidelink resource reservation associated with a third UE. The first UE may transmit, to the second UE or the third UE, an IUC message that indicates a conflict between the first sidelink resource reservation and the second sidelink resource reservation. The IUC message that indicates a conflict may be based on a relationship between the first spatial filter used to receive the first sidelink resource reservation and the second spatial filter used to receive the second sidelink resource reservation.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.

Abstract: Methods, systems, and devices for wireless communications are described. A receiving user equipment (UE) may broadcast messages containing inter-UE cooperation (IUC) information using multiple beams. The IUC information transmitted on each beam may be different for each beam of the receiving UE. For example, each IUC information may contain different preferred resources or non-preferred resources for the receiving UE to receive a transmission from a transmitting UE. The transmitting UE may receive a message containing IUC information from one of the beams of the receiving UE and transmit a signal using resources based on the IUC information contained in the received message. In some examples, the transmitting UE may transmit a channel busy ratio (CBR) request to a receiving UE. The CBR request may specify a transmission configuration indicator (TCI) state, spatial relation, spatial domain filter, or beam according to which the receiving UE is to measure the CBR.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may transmit, to a network entity, a first message indicating data collected at the first UE and geo-location information of the first UE. The first UE may receive, from the network entity, a second message indicating a sidelink grant for transmitting a sidelink message on a set of resources and a source identifier and destination identifier associated with the sidelink message. The first UE may transmit the sidelink message on the set of resources to at least a second UE, the sidelink message including the source identifier and the destination identifier. The second UE may transmit, to the network entity, an indication of calculated geo-location information for the first UE and a received power measurement of the sidelink message based on the sidelink message.