Patents by Inventor Hua Wang

Hua Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923315
    Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang
  • Publication number: 20240068917
    Abstract: An integrated acoustic detection and rock direct tensile test machine includes a support frame. A top of the support frame is provided with a top plate and a bearing plate is provided above the top plate. The bearing plate is provided with force transferring rods, lower ends of which are provided with a tensile base. A top of the tensile base is provided with a lower clamp holder and a bottom of the top plate is provided with an upper clamp holder. An upper channel is provided inside the upper clamp holder. The upper channel is provided with an acoustic transmitting probe. A lower channel is provided inside the lower clamp holder. One end of the lower channel is communicated with the outside, the other end is provided with an acoustic receiving probe. The lower channel extends to a bottom of a clamping chamber of the lower clamp holder.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 29, 2024
    Inventors: Huining XU, Tianqi LIU, Jianfeng LIU, Fujun XUE, Jingjing DAI, Lu WANG, Lina RAN, Yougang CAI, Jianliang PEI, Hua LI, Jinbing WEI, Jianhui DENG
  • Publication number: 20240065668
    Abstract: An ultrasound imaging system may analyze motion of landmarks in a temporal sequence of image frames to determine mobility of one or more landmarks. In some examples, the sequence of image frames may be analyzed by one or more artificial intelligence models to detect landmarks and generate flow fields for the detected landmarks. The flow fields may be analyzed to determine the isotropy of the movement of the landmarks. The isotropy analysis may be used to generate a quantitative mobility index.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 29, 2024
    Inventors: Claudia Errico, Hua Xie, Qianxi Li, Ramon Quido Erkamp, Shiying Wang, Elizabeth Brunelle
  • Publication number: 20240071825
    Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu
  • Publication number: 20240073721
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive multiple reference signals (RSs). The UE may measure the multiple RSs to generate measurements for the multiple RSs. The UE may encode the measurements using a machine learning model to generate codewords representing a quantized version of the measurements. The UE may transmit the codewords. Numerous other aspects are described.
    Type: Application
    Filed: July 25, 2023
    Publication date: February 29, 2024
    Inventors: Hua WANG, June NAMGOONG, Tianyang BAI, Tao LUO, Junyi LI
  • Publication number: 20240073725
    Abstract: Methods, systems, and devices for wireless communications are described. For example, the described techniques provide for performing and reporting suitable measurements, at a first user equipment (UE), on reference signals from relay UEs to determine which relay UEs to activate or deactivate for relaying communications for the first UE. The first UE may be configured to perform measurements on deactivated relay UEs, and the first UE may report these measurements (or other measurements) when one or more events are triggered. The events may depend on the measurements performed on the deactivated relay UEs. Once the events are triggered, the first UE may report the measurements, and a second UE or a network entity may use the measurements to efficiently determine which relay UEs to activate or deactivate for relaying communications for the first UE.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Hua Wang, Sony Akkarakaran, Jelena Damnjanovic, Tao Luo, Junyi Li, Konstantinos Dimou
  • Publication number: 20240068918
    Abstract: A direct tensile and acoustic testing machine under rock seepage includes a sample and a support frame. A top of the support frame is fixed with a top plate, a bearing plate is provided above the top plate, the bearing plate is provided with a plurality of vertical force transferring rods, the force transferring rods vertically penetrate through the top plate and sliding fit with the top plate, lower ends of the force transferring rods are provided with a tensile base, a top of the tensile base is provided with a lower clamp holder, a bottom of the top plate is provided with an upper clamp holder, and a clamp center of the upper clamp holder overlaps with a clamp center of the lower clamp holder. An acoustic component and a seepage component are provided in the upper clamp holder and the lower clamp holder.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Inventors: Jianfeng LIU, Heping XIE, Xin HE, Lu WANG, Lina RAN, Chunping WANG, Yougang CAI, Xiangchao SHI, Gan FENG, Hua LI, Xiaozhang LEI, Jianhui DENG
  • Publication number: 20240072115
    Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.
    Type: Application
    Filed: February 13, 2023
    Publication date: February 29, 2024
    Inventors: Wei-Xiang You, Wei-De Ho, Hsin Yang Hung, Meng-Yu Lin, Hsiang-Hung Huang, Chun-Fu Cheng, Kuan-Kan Hu, Szu-Hua Chen, Ting-Yun Wu, Wei-Cheng Tzeng, Wei-Cheng Lin, Cheng-Yin Wang, Jui-Chien Huang, Szuya Liao
  • Publication number: 20240068919
    Abstract: A rock direct tensile test platform suitable for all material test machines includes a support frame. A top of the support frame is fixed with a top plate, and a bearing plate is provided above the top plate. The bearing plate is provided with a plurality of vertical force transferring rods. The force transferring rods vertically penetrate through the top plate and have a sliding fit with the top plate. Lower ends of the force transferring rods are provided with a tensile base. A top of the tensile base is provided with a lower clamp holder. A bottom of the top plate is provided with an upper clamp holder, and a clamp center of the upper clamp holder coincides with a clamp center of the lower clamp holder.
    Type: Application
    Filed: September 11, 2023
    Publication date: February 29, 2024
    Inventors: Jianfeng LIU, Heping XIE, Lu WANG, Yougang CAI, Lina RAN, Chunping WANG, Gan FENG, Hua LI, Xiangchao SHI, Jianliang PEI, Huining XU, Xiaozhang LEI, Jianhui DENG
  • Publication number: 20240073900
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a transmitter user equipment (UE) may identify a plurality of beams that are configured for transmitting one or more sidelink communications via one or more sidelink resources. The UE may transmit sidelink control information that indicates to reserve the one or more sidelink resources and that includes an explicit beam indication or a beam hopping indication associated with the plurality of beams. Numerous other aspects are described.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Hua WANG, Sony AKKARAKARAN, Tianyang BAI, Yan ZHOU, Jung Ho RYU, Tao LUO, Junyi LI
  • Publication number: 20240073865
    Abstract: Method and apparatus for enhanced inter-UE coordination. The apparatus transmits, to a second UE, an IUC request for an IUC message indicating preferred resources or non-preferred resources for transmission of a signal by a third UE. The apparatus receives, from the second UE, the IUC message indicating the preferred resources or the non-preferred resources for the transmission of the signal by the third UE. The apparatus may select transmission resources for the third UE based at least on the IUC message from the second UE indicating the preferred resources or the non-preferred resources for transmission by the third UE.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 29, 2024
    Inventors: Jung Ho RYU, Sony AKKARAKARAN, Junyi LI, Jelena DAMNJANOVIC, Hua WANG, Tao LUO
  • Patent number: 11917582
    Abstract: This disclosure provides systems, devices, apparatus, and methods, including computer programs encoded on storage media, for a sidelink coverage extension using repeated transmission. A first UE may transmit a multiple slot SCI in a first slot of a group of multiple slots for reserving resources for the group of multiple slots and transmitting one or more sidelink transmissions in the reserved resources. A second UE may receive the multiple slot SCI in the first slot of the group of multiple slots for receiving the one or more sidelink transmissions in the reserved resources for the group of multiple slots. In aspects, a base station may receive configuration parameters for the multiple slot SCI and configure one or more UEs with a multiple slot configuration, based on the configuration parameters, for transmitting/receiving the multiple slot SCI associated with the reserved resources in the group of multiple slots.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: February 27, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Hua Wang, Sony Akkarakaran, Xiaojie Wang, Tao Luo, Junyi Li
  • Patent number: 11914964
    Abstract: The present application discloses a method and apparatus for training a semantic representation model, a device and a computer storage medium, which relates to the field of natural language processing technologies in artificial intelligence.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: February 27, 2024
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Shuohuan Wang, Jiaxiang Liu, Xuan Ouyang, Yu Sun, Hua Wu, Haifeng Wang
  • Patent number: 11915992
    Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
  • Patent number: 11914432
    Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Chuan-Hua Wang, Yi-Ta Huang
  • Patent number: 11916997
    Abstract: An offloading method, of a satellite-to-ground edge computing task, assisted by a satellite and a high-altitude platform can offload a computing task of a ground user equipment (GUE) to a low earth-orbit satellite (LEO SAT), to meet a computing requirement of the GUE and to reduce latency and energy consumption. The method includes four main steps: 1. The GUE selects an associated high-altitude platform. 2. The GUE uses multi-input and multi-output (MIMO) transmission to offload the computing task to the high-altitude platform. 3. The high-altitude platform may also use the MIMO transmission to offload the computing task of the GUE to the LEO SAT. 4. The high-altitude platform and the LEO SAT cooperate to process the computing task of GUE, and reasonably allocate a computing resource to reduce energy consumption; and in MIMO edge computing, the GUE or the high-altitude platform uses the same time-domain and frequency-domain resource.
    Type: Grant
    Filed: April 25, 2021
    Date of Patent: February 27, 2024
    Assignee: SOUTHEAST UNIVERSITY
    Inventors: Junbo Wang, Changfeng Ding, Hua Zhang
  • Patent number: 11912601
    Abstract: A method and system for water injection into an oil and/or gas containing subterranean formation is shown, the method comprising: arranging a submerged water filtration station with a pump feeding inlet seawater through at least one filtering membrane to a water injection pump, subjecting the water to ionizing irradiation at a location between the seawater inlet and the water injection pump, whereby at said location the water is guided past a submerged radiation source which is distributed for penetration of the body of injection water.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: February 27, 2024
    Assignee: Vetco Gray Scandinavia AS
    Inventors: Jose Luis Plasencia, Hua Wang
  • Patent number: 11917894
    Abstract: Provided are a method for preparing an organic electroluminescent device, an organic electroluminescent device and a display apparatus.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: February 27, 2024
    Assignee: GUANGZHOU NEW VISION OPTO-ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Jianhua Zou, Miao Xu, Hong Tao, Lei Wang, Hongmeng Li, Wencong Liu, Hua Xu, Min Li, Junbiao Peng
  • Patent number: 11916313
    Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 27, 2024
    Assignee: QuantumZ Inc.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung