Abstract: A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.

Abstract: A semiconductor device structure includes a first substrate having a first surface and a second surface opposite to the first surface, a conductive pad at the first surface of the first substrate, and a connector overlying the conductive pad, wherein the connector is configured for electrically connecting with a conductive land of a second substrate, wherein a geometric center of the connector is deviated from a geometric center of the conductive pad and a geometric center of the conductive land.