Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.

Abstract: A method for manufacturing a semiconductor device includes following operations. A first substrate with a conductive pad is received. A connector is disposed over the conductive pad. A second substrate including a conductive land is provided. A position of the first substrate or the second substrate is adjusted thereby a geometric center of the conductive land is deviated from a geometric center of the connector in a deviated distance. The connector is bonded with the conductive land. A temperature of the semiconductor device is adjusted so as to control elongation of the first substrate and the second substrate, thereby the geometric center of the connector is substantially aligned with the geometric center of the conductive land.

Abstract: An immersive headset system includes a headset device and a displaying device. The headset device includes a pupillary sensor for determining an interpupillary distance value. The displaying device is communicated with the headset device. The displaying device includes a display panel for displaying an immersive content. The immersive content includes a right visual window and a left visual window. The right visual window and the left visual window are displayed synchronously at different positions on the display panel. When the displaying device receives the interpupillary distance value from the headset device, the right visual window and the left visual window of the immersive content are allocated by the displaying device according to the interpupillary distance value.

Abstract: A package structure including a semiconductor die, an insulating encapsulant, a redistribution layer and a plurality of conductive terminals is provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads and a plurality of conductive strips. The conductive pads are disposed on and connected to the plurality of conductive pads, wherein each of the conductive strips is physically connected to at least two conductive pads. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is disposed on the insulating encapsulant and the semiconductor die, wherein the redistribution layer is electrically connected to the plurality of conductive strips. The plurality of conductive terminals is disposed on the redistribution layer.

Abstract: A redistribution structure includes a first dielectric layer and a first redistribution circuit layer. The first dielectric layer includes a first via opening. The first redistribution circuit layer is disposed on the first dielectric layer and includes a via portion filling the first via opening and a circuit portion connecting the via portion and extending over the first dielectric layer. A maximum vertical distance between an upper surface of the via portion and an upper surface of the circuit portion is substantially equal to or smaller than 0.5 ?m.

Abstract: Mixed halide scintillation materials of the general formula AB(1?y)MyX?wX?(3?w), where 0?y?1, 0.05?w?1, A may be an alkali metal, B may be an alkali earth metal, and X? and X? may be two different halogen atoms, and of the general formula A(1?y)BMyX?wX?(3?w), where 0?y?1, 0.05?w?1, A maybe an alkali metal, B may be an alkali earth metal, and X? and X? are two different halogen atoms. The scintillation materials of formula (1) include a divalent external activator, M, such as Eu2+ or Yb2+. The scintillation materials of formula (2) include a monovalent external activator, M, such as Tl+, Na+ and In+.

Abstract: Compositions and methods are provided for enzymes with altered properties that involve a systematic approach to mutagenesis and a screening assay that permits selection of the desired proteins. Embodiments of the method are particularly suited for modifying specific properties of restriction endonucleases such as star activity. The compositions includes restriction endonucleases with reduced star activity as defined by an overall fidelity index improvement factor.

Abstract: Mixed halide scintillation materials of the general formula AB(1-y)MyX?wX?(3-w), where 0?y?1, 0.05?w?1, A may be an alkali metal, B may be an alkali earth metal, and X? and X? may be two different halogen atoms, and of the general formula A(1-y)BMyX?wX?(3-w), where 0?y?1, 0.05?w?1, A maybe an alkali metal, B may be an alkali earth metal, and X? and X? are two different halogen atoms. The scintillation materials of formula (1) include a divalent external activator, M, such as Eu2+ or Yb2+. The scintillation materials of formula (2) include a monovalent external activator, M, such as Tl+, Na+ and In+.

Abstract: Disclosed are a lens driving device, a camera device and an electronic apparatus equipped with the lens driving device. When the lens driving device is mounted on the circuit board, the power supply terminal is less likely to fall off from the base. The lens driving device of the present disclosure includes a base, a lens support, and a driving mechanism that drives the lens support in the optical axial direction. The base is integrally provided with a power supply terminal mounted on an external circuit board and used for supplying power to the driving mechanism. A fall-off preventive portion is formed in at least a part of a contact portion that is in contact with the base on the power supply terminal.

Abstract: A lean burn fuel injector comprises a fuel feed arm and a fuel injector head. The fuel feed arm has a single pilot fuel supply passage and a single main fuel supply passage extending there-through. The fuel injector head has a coaxial arrangement of an inner pilot air-blast fuel injector and a coaxially arranged outer main air-blast fuel injector. The inner pilot air-blast fuel injector comprises a coaxial arrangement of a pilot inner air swirler passage and a pilot outer air swirler passage. The outer main air-blast fuel injector comprises a coaxial arrangement of a main inner air swirler passage and a main outer air swirler passage. The single main fuel supply passage is arranged to supply main fuel to the main inner air swirler passage. The single pilot fuel supply passage is arranged to supply pilot fuel onto the pre-filming surfaces in the pilot inner and outer air swirler passages.

Abstract: A PoP device includes a first package structure, a second package structure and an underfill layer is provided. The first package structure includes a die, a TIV and an encapsulant. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and a portion of sidewalls of the TIV. The second package structure is connected to the first package structure through a connector. The underfill layer is disposed to fill a space between the first package structure and the second package structure. A portion of the underfill layer is disposed between the encapsulant and the TIV to cover a portion of sidewalls of the TIV.

Abstract: A package structure has first and second dies, a molding compound, a first redistribution layer, at least one first through interlayer via (TIV), second through interlayer vias (TIVs), an electromagnetic interference shielding layer and conductive elements. The first die is molded in the molding compound. The second die is disposed on the molding compound. The first redistribution layer is located between the conductive elements and the molding compound and electrically connected to the first and second dies. The molding compound is located between the second die and the first redistribution layer. The first and second TIVs are molded in the molding compound and electrically connected to the first redistribution layer. The second TIVs are located between the first die and the first TIV. The electromagnetic interference shielding layer is in contact with the first TIV. The conductive elements are connected to the first redistribution layer.

Abstract: A fuel spray nozzle, for atomising liquid fuel in gas, including: an gas passage; a liquid fuel passage; a swirler provided in the gas passage and including vanes such that, when gas passes through the gas passage, the swirler produces a jet flow of gas from between adjacent vanes and a turbulent flow of gas in the wake of each vane; a prefilming surface for receiving liquid fuel from the liquid fuel passage, and gas from the gas passage, wherein the prefilming surface includes areas that receive jet flow of gas from the gas passage, in use; wherein the fuel spray nozzle is configured to direct the liquid fuel passing through the liquid fuel passage to the areas on the prefilming surface that receive a jet flow of gas from the gas passage.

Abstract: A PoP device includes a first package structure, a second package structure and an underfill layer is provided. The first package structure includes a die, a TIV and an encapsulant. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and a portion of sidewalls of the TIV. The second package structure is connected to the first package structure through a connector. The underfill layer is disposed to fill a space between the first package structure and the second package structure. A portion of the underfill layer is disposed between the encapsulant and the TIV to cover a portion of sidewalls of the TIV.

Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.

Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.

Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.