Abstract: A hand strap and a hand controller assembly are provided. Two ends of the hand strap are respectively used for connecting a hand controller. The hand strap includes an elastic strap, a belt body, and a locking mechanism. The locking mechanism includes a fixed assembly and a sliding assembly. When a relative position of the fixed assembly and the sliding assembly is in a locked state, the fixed assembly and the sliding assembly clamp and fix the elastic strap. When the relative position of the fixed assembly and the sliding assembly is in an unlocked state, the fixed assembly and the sliding assembly release the elastic strap. When the elastic strap is not subjected to an external force, an elastic force of the elastic strap drives the relative position of the fixed assembly and the sliding assembly to be maintained in the locked state.

Abstract: An in-plane magnetized spin-orbit magnetic device is provided. The in-plane magnetized spin-orbit magnetic device includes a heavy metal layer, an upper electrode and a magnetic tunnel junction. The magnetic tunnel junction is disposed between the heavy metal layer and the upper electrode. The magnetic tunnel junction includes a free layer and a pinned layer. The free layer is disposed on the heavy metal layer, and the free layer has a first film plane area. The pinned layer is disposed on the free layer, and the pinned layer has a second film plane area. There is a preset angle between a long axis direction of a film plane shape of the free layer and a long axis direction of a film plane shape of the pinned layer, and the first film plane area is larger than the second film plane area.

Abstract: A data transmission method includes obtaining dequeue information that indicates a queue which requests to output data in a communications device and a target data volume that is output from each queue at a time, and the communications device manages the target data volume based on a burst value, reading, based on the queue, a sub-packet descriptor (PD) that is obtained by segmenting the first PD, the sub-PD includes target description information indicating a target data packet, the first PD includes first description information indicating a first data packet set including the target data packet, the first data packet set and the sub-PD are stored in a packet cache including a dynamic random access memory (DRAM), the first PD is stored in a control cache including a static random access memory (SRAM), and determining, the target data packet based on the sub-PD, and sending the target data packet.

Abstract: A magnetic memory structure includes a heavy-metal layer, a plurality of magnetic tunneling junction (MTJ) layer, a conductive layer and an insulation layer. In an example, the pinned-layer of the MTJ layers are arranged in a string form and disposed over the barrier-layer. In an example also disclosed, the pinned-layer, the free-layer of the MTJ layers are arranged in a string form. Whereas the pinned-layers are disposed over the barrier-layer and the free-layers are disposed over the heavy-metal layer. The conductive layer is formed under the heavy-metal layer and includes a first conductive portion and a second conductive portion separated from each other and connected with two end of the heavy-metal layer respectively. The insulation layer fills up an interval between the first conductive portion and the second conductive portion. The conductive layer has an electric conductivity higher than that of the heavy-metal layer.

Abstract: A management method for multiple communication devices, wherein the multiple communication devices include a host device and a first peripheral device configured to electrically connect to a device platform, and the management method includes: by the host device, detecting a connection of the first peripheral device through the device platform; by the host device, receiving a first device identifier provided by the first peripheral device through the device platform; by the host device, storing the first device identifier in the host device; and by the host device, wirelessly pairing the host device with the first peripheral device, according to the first device identifier stored in the host device, to enable a first wireless communication between the host device and the first peripheral device.

Abstract: A magnetic memory structure is provided. The magnetic memory structure includes a magnetic tunneling junction (MTJ) layer and a heavy-metal layer. The MTJ layer includes a pinned-layer, a barrier-layer formed under the pinned-layer and a free-layer formed under the barrier-layer. The heavy-metal layer is formed under the free-layer. The barrier-layer has a first upper surface, the pinned-layer has a lower surface, and area of the first upper surface is larger than area of the lower surface.

Abstract: A semiconductor package includes a die, an insulation layer, a plurality of first electrical conductive vias, a plurality of second electrical conductive vias, a plurality of thermal conductive vias and a connecting pattern. The die includes a plurality of first pads and a plurality of second pads. The insulation layer is disposed on the die and includes a plurality of openings exposing the first pads and the second pads. The first electrical conductive vias and the second electrical conductive vias are disposed in the openings and contact the first pads and the second pads respectively. The thermal conductive vias are disposed on the insulation layer. The connecting pattern is disposed on the insulation layer and connects the first electrical conductive vias and the thermal conductive vias. The thermal conductive vias are connected to the first pads through the connecting pattern and the first electrical conductive vias.

Abstract: The present disclosure relates to a spring winder having a winder base, pulleys disposed at one end of the winder base, at least one constant force spring disposed on the winder base, each constant force spring having an extension end, and a guard plate is disposed at one side of the extension end of each constant force spring. A curtain using the spring winder is also described having an upper beam; a lower beam; and a curtain disposed between the upper beam and the lower beam, the upper beam having a spring winder disposed therein; a fixed plug head disposed at one end of the upper beam, a fixed pulley plug head disposed at the other end of the upper beam, each constant force spring of the spring winder being connected to the fixed plug head, a cord winding around the pulleys, the cord being connected to the pulleys at the fixed pulley plug head after being connected to the curtain.

Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.

Abstract: A fuel spray nozzle, for atomising liquid fuel in gas, including: an gas passage; a liquid fuel passage; a swirler provided in the gas passage and including vanes such that, when gas passes through the gas passage, the swirler produces a jet flow of gas from between adjacent vanes and a turbulent flow of gas in the wake of each vane; a prefilming surface for receiving liquid fuel from the liquid fuel passage, and gas from the gas passage, wherein the prefilming surface includes areas that receive jet flow of gas from the gas passage, in use; wherein the fuel spray nozzle is configured to direct the liquid fuel passing through the liquid fuel passage to the areas on the prefilming surface that receive a jet flow of gas from the gas passage.

Abstract: A method of manufacturing a semiconductor package includes forming an encapsulated semiconductor device and forming a redistribution structure over the encapsulated semiconductor device, where the encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulating material. Forming the redistribution structure includes forming a first dielectric layer on the encapsulated semiconductor device, and forming a first redistribution circuit layer on the first dielectric layer by a plating process carried out at a current density of substantially 4˜6 amperes per square decimeter, where the first dielectric layer comprises a first via opening. An upper surface of the first redistribution circuit layer filling the first via opening is substantially coplanar with an upper surface of the rest of the first redistribution circuit layer.

Abstract: A lean burn fuel injector has a head which has a coaxial arrangement of an inner pilot air-blast fuel injector and an outer main air-blast fuel injector. The pilot fuel injector comprises coaxially arranged inner and outer air swirler passages. The main fuel injector comprises coaxially arranged inner and outer air swirler passages. A first splitter is arranged between the passages. The first splitter has a conical divergent downstream portion. A second splitter is arranged radially within and spaced from the first splitter. The second splitter has a conical convergent portion and a conical divergent downstream portion. The downstream end of the second splitter is upstream of the downstream end of the first splitter. A connecting member connects the downstream end of the second splitter and the downstream portion of the first splitter upstream of the downstream end of the first splitter to form a sharp edge.

Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.

Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.

Abstract: Compositions and methods are provided for enzymes with altered properties that involve a systematic approach to mutagenesis and a screening assay that permits selection of the desired proteins. Embodiments of the method are particularly suited for modifying specific properties of restriction endonucleases such as star activity. The compositions includes restriction endonucleases with reduced star activity as defined by an overall fidelity index improvement factor.

Abstract: A redistribution structure includes a first dielectric layer and a first redistribution circuit layer. The first dielectric layer includes a first via opening. The first redistribution circuit layer is disposed on the first dielectric layer and includes a via portion filling the first via opening and a circuit portion connecting the via portion and extending over the first dielectric layer. A maximum vertical distance between an upper surface of the via portion and an upper surface of the circuit portion is substantially equal to or smaller than 0.5 ?m.

Abstract: An aperture switching device is described that includes a base, a casing fitted to cover the base, and clamping parts fixed to the base. The clamping parts are driving power source input terminals and a shape memory alloy wire with two ends electrically connects the clamping parts. The base has a first light transmission hole, a rotary connecting part, a sliding groove, and a position regulating part. The casing has a second light transmission hole that corresponds to the first light transmission hole. A movable bump is connected to the shape memory alloy wire and slidably disposed within the sliding groove. An elastic member is disposed between the position regulating part and the movable bump. An optical aperture switching unit is positioned with one end portion mounted on the rotary connecting part and the end portion includes a switching slot mounted on the movable bump.

Abstract: Mixed halide scintillation materials of the general formula AB(1?y)MyX?wX?(3?w), where 0?y?1, 0.05?w?1, A may be an alkali metal, B may be an alkali earth metal, and X? and X? may be two different halogen atoms, and of the general formula A(1?y)BMyX?wX?(3?w), where 0?y?1, 0.05?w?1, A maybe an alkali metal, B may be an alkali earth metal, and X? and X? are two different halogen atoms. The scintillation materials of formula (1) include a divalent external activator, M, such as Eu2+ or Yb2+. The scintillation materials of formula (2) include a monovalent external activator, M, such as Tl+, Na+ and In+.