Patents by Inventor Hua Wei

Hua Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11041626
    Abstract: A combustion chamber system has pilot and main fuel manifolds, and pilot and main fuel nozzles. Each pilot nozzle is connected to the pilot manifold. Each main nozzle is connected to the main manifold. A greater total amount of fuel is supplied to the pilot nozzles than to the main nozzles. A greater amount of fuel is supplied to pilot nozzles at, or in, a first region of the combustion chamber than to pilot fuel nozzles at, or in, a second region. A greater amount of fuel is supplied to the main nozzles at, or in, the first region than to the main nozzles at, or in, the second to improve combustion efficiency, weak extinction and relight of the combustion chamber in a first mode of operation. A greater total amount of fuel is supplied to the main nozzles than to the pilot nozzles in a second mode of operation.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: June 22, 2021
    Assignee: ROLLS-ROYCE plc
    Inventors: Hua Wei Huang, Jochen Rupp, Michael Whiteman
  • Publication number: 20210150317
    Abstract: A neuron circuit and an artificial neural network chip are provided. The neuron circuit includes a memristor and an integrator. The memristor generates a pulse train having an oscillation frequency when an applied voltage exceeds a predetermined threshold. The integrator is connected in parallel to the memristor for receiving and accumulating input pulses transmitted by a previous layer network at different times, and driving the memristor to transmit the pulse train to a next layer network when a voltage of the accumulated input pulses exceeds the predetermined threshold.
    Type: Application
    Filed: March 4, 2020
    Publication date: May 20, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Tuo-Hung Hou, Shyh-Shyuan Sheu, Jeng-Hua Wei, Heng-Yuan Lee, Ming-Hung Wu
  • Patent number: 10996749
    Abstract: An immersive headset system includes a headset device and a displaying device. The headset device includes a pupillary sensor for determining an interpupillary distance value. The displaying device is communicated with the headset device. The displaying device includes a display panel for displaying an immersive content. The immersive content includes a right visual window and a left visual window. The right visual window and the left visual window are displayed synchronously at different positions on the display panel. When the displaying device receives the interpupillary distance value from the headset device, the right visual window and the left visual window of the immersive content are allocated by the displaying device according to the interpupillary distance value.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 4, 2021
    Assignee: HTC Corporation
    Inventors: Sheng-Cherng Lin, Chang-Hua Wei
  • Patent number: 10996545
    Abstract: An aperture switching device is described that includes a base, a casing fitted to cover the base, and clamping parts fixed to the base. The clamping parts are driving power source input terminals and a shape memory alloy wire with two ends electrically connects the clamping parts. The base has a first light transmission hole, a rotary connecting part, a sliding groove, and a position regulating part. The casing has a second light transmission hole that corresponds to the first light transmission hole. A movable bump is connected to the shape memory alloy wire and slidably disposed within the sliding groove. An elastic member is disposed between the position regulating part and the movable bump. An optical aperture switching unit is positioned with one end portion mounted on the rotary connecting part and the end portion includes a switching slot mounted on the movable bump.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: May 4, 2021
    Assignee: NEW SHICOH MOTOR CO., LTD
    Inventors: Yingji Zhuo, Hua Wei, Wei Sun, Juhe Zhou
  • Patent number: 10950575
    Abstract: An embodiment is a structure including a first die, a molding compound at least laterally encapsulating the first die, a first redistribution structure including metallization patterns extending over the first die and the molding compound, a first conductive connector comprising a solder ball and an under bump metallization coupled to the first redistribution structure, and an integrated passive device bonded to a first metallization pattern in the first redistribution structure with a micro bump bonding joint, the integrated passive device being adjacent the first conductive connector.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Hua-Wei Tseng
  • Publication number: 20210020827
    Abstract: A magnetic memory structure is provided. The magnetic memory structure includes a magnetic tunneling junction (MTJ) layer and a heavy-metal layer. The MTJ layer includes a pinned-layer, a barrier-layer formed under the pinned-layer and a free-layer formed under the barrier-layer. The heavy-metal layer is formed under the free-layer. The barrier-layer has a first upper surface, the pinned-layer has a lower surface, and area of the first upper surface is larger than area of the lower surface.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 21, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ziaur Rahaman Shakh, I-Jung Wang, Jeng-Hua Wei
  • Patent number: 10879224
    Abstract: A package structure, a die and method of forming the same are provided. The package structure includes a die, an encapsulant, a RDL structure, and a conductive terminal. The die has a connector. The connector includes a seed layer and a conductive on the seed layer. The seed layer extends beyond a sidewall of the conductive pillar. The encapsulant is aside the die and encapsulates sidewalls of the die. The RDL structure is electrically connected to the die. The conductive terminal is electrically connected to the die through the RDL structure.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hsien Huang, Ming-Shih Yeh
  • Publication number: 20200381373
    Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 3, 2020
    Inventors: Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu
  • Patent number: 10784441
    Abstract: A perpendicularly magnetized spin-orbit magnetic device including a heavy metal layer, a magnetic tunnel junction, a first antiferromagnetic layer, a first block layer and a first stray field applying layer is provided. The magnetic tunnel junction is disposed on the heavy metal layer. The first block layer is disposed between the magnetic tunnel junction and the first antiferromagnetic layer. The first stray field applying layer is disposed between the first antiferromagnetic layer and the first block layer. The magnetic tunnel junction comprises a free layer, a tunneling barrier layer, and pinned layer. The tunneling barrier layer is disposed on the free layer. The pinned layer is disposed on the tunneling barrier layer. A film plane area of the free layer is greater than a film plane area of the tunneling barrier layer and a film plane area of the pinned layer.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: September 22, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Han Lee, Shan-Yi Yang, Yao-Jen Chang, I-Jung Wang, Jeng-Hua Wei
  • Patent number: 10759994
    Abstract: The present invention provides a luminogenic, in particular a phosphorogenic transition metal-based pyridyl complex containing a nitrone moiety, which nitrone moiety acts as a bioorthogonal functional group and an emission quencher, and can undergo cycloaddition reaction with a complementary bioorthogonal functional group coupled to a substrate. The transition metal is can be selected from iridium or ruthenium. Also disclosed is a method for preparing the transition metal-based pyridyl complex and a pharmaceutical composition comprising it. Still further provided is a method for bioorthogonal labeling of a biomolecule, a method for staining of a cell structure, a method for in vivo imaging of an organism, and a kit for in vivo imaging of an organism. The luminogenic properties and high reactivity of the complexes are highly advantageous for bioorthogonal labeling and imaging of biomolecules in their native biological environments at much lower costs than those of the existing commercial products.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: September 1, 2020
    Assignee: City University of Hong Kong
    Inventors: Kam Wing Kenneth Lo, Hua Wei Liu, Cho Cheung Lee, Siu Ming Tang
  • Patent number: 10762317
    Abstract: Examples of techniques for quick response (QR) code deformation are described herein. An aspect includes receiving a first QR code, wherein the first QR code is scannable by a QR code scanner at a first range of angles. Another aspect includes determining a scanner angle, the scanner angle being outside of the first range of angles. Another aspect includes generating a second QR code based on the first QR code and the scanner angle, wherein the second QR code comprises a deformed QR code that is scannable by the QR code scanner at a second range of angles that is distinct from the first range of angles.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: September 1, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hua Wei Fan, Lei Wang, Zheng Lei An, Xin Zhao, Hong Wei Sun, Ting Yin
  • Publication number: 20200274831
    Abstract: A data transmission method includes obtaining dequeue information that indicates a queue which requests to output data in a communications device and a target data volume that is output from each queue at a time, and the communications device manages the target data volume based on a burst value, reading, based on the queue, a sub-packet descriptor (PD) that is obtained by segmenting the first PD. the sub-PD includes target description information indicating a target data packet, the first PD includes first description information indicating a first data packet set including the target data packet, the first data packet set and the sub-PD are stored in a packet cache including a dynamic random access memory (DRAM), the first PD is stored in a control cache including a static random access memory (SRAM), and determining, the target data packet based on the sub-PD, and sending the target data packet.
    Type: Application
    Filed: May 14, 2020
    Publication date: August 27, 2020
    Inventors: Hua Wei, Qin Zheng, Wenhua Du
  • Patent number: 10756037
    Abstract: A package structure including a semiconductor die, an insulating encapsulant, a redistribution layer and a plurality of conductive terminals is provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads and a plurality of conductive strips. The conductive pads are disposed on and connected to the plurality of conductive pads, wherein each of the conductive strips is physically connected to at least two conductive pads. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is disposed on the insulating encapsulant and the semiconductor die, wherein the redistribution layer is electrically connected to the plurality of conductive strips. The plurality of conductive terminals is disposed on the redistribution layer.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: August 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Yueh-Ting Lin, Ming-Shih Yeh
  • Publication number: 20200264495
    Abstract: An aperture switching device is described that includes a base, a casing fitted to cover the base, and clamping parts fixed to the base. The clamping parts are driving power source input terminals and a shape memory alloy wire with two ends electrically connects the clamping parts. The base has a first light transmission hole, a rotary connecting part, a sliding groove, and a position regulating part. The casing has a second light transmission hole that corresponds to the first light transmission hole. A movable bump is connected to the shape memory alloy wire and slidably disposed within the sliding groove. An elastic member is disposed between the position regulating part and the movable bump. An optical aperture switching unit is positioned with one end portion mounted on the rotary connecting part and the end portion includes a switching slot mounted on the movable bump.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Inventors: Yingji Zhuo, Hua Wei, Wei Sun, Juhe Zhou
  • Patent number: D894897
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 1, 2020
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D903667
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 1, 2020
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Hsiao-Ling Chan, Pei-Pin Huang
  • Patent number: D904406
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: December 8, 2020
    Assignee: HTC Corporation
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee
  • Patent number: D912048
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 2, 2021
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D914020
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: March 23, 2021
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D916087
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: April 13, 2021
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang