Abstract: The invention discloses an interpenetrating biopolymers network (IPN) hydrogel loaded with herbal extracts, preparation and application thereof. The IPN hydrogel can increase the preservation time of herbal extracts and achieve a long-term release mechanism of herbal extracts. The interpenetrating biopolymers network (IPN) hydrogel makes itself have microporous and macroporous network structure and reinforced gel structure. The gel itself has good hydrophilicity and high biocompatibility. In addition, the present invention will be subsequently applied to the development of hydrogel patches and preparation methods, which are composed of bidirectional elastic non-woven fabrics, hydrogels containing extracts and a cover film layer, and solve the common the problem of allergies caused by patches.

Abstract: The present disclosure provides a fluorescent nitrogen-vacancy diamond (FNVD) having a plurality of nitrogen-vacancy centers with a concentration about 1 ppm to 10,000 ppm. The FNVD as built-in fluorophores exhibit a nearly constant emission profile over 540 nm to 850 nm upon excitation by vacuum ultraviolet (VUV), extreme ultraviolet (EUV) and X-rays for the energy larger than 6.2 eV. Applying the FNVD sensor can measure VUV/EUV/X-rays as a sensing sheet, manufacturing method and uses thereof, sensor and lithography apparatus. The superb photostability and broad applicability of FNVDs offer a promising solution for the long-standing problem of lacking robust and reliable detectors for VUV, EUV, and X-rays.

Abstract: A method of defining ATtention (AT) commands for supporting Service and Session Continuity (SSC) mode 2 and SSC mode 3 of 5G Protocol Data Unit (PDU) session operations is proposed. The AT command can be a notification of an unsolicited result code +CGEV: NW PDN DEACT, +CGEV: NW MODIFY, or +CGEV: ME PDN ACT, or a configuration command +CGDCONT with additional 5G parameters. Additional 5G parameters include an SSC, an old CID, a change reason and a PDU lifetime for the purpose of communicating information regarding the request of PDU session anchor relocation.

Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.

Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.

Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including: forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.

Abstract: A mobile communication device including a Radio Frequency (RF) device and a controller is provided. The controller is coupled to the RF device and configured to allocate the RF device to selectively communicate with a Packet Switched (PS)-based network using a first subscriber identity or with a service network using a second subscriber identity, and ignore a paging message associated with the first subscriber identity during an ongoing on-demand service associated with the second subscriber identity.

Abstract: A living organism image monitoring system is provided, relating to the technical field of medical equipment. The living organism image monitoring system comprises a display module, a processor and a CIGS chip, the CIGS chip, the processor and the display module being electrically connected, the CIGS chip being used for detecting a near infrared light signal of a living organism and generating a current signal after having detected the near infrared light signal, the processor being used for generating a first pulse signal according to the current signal, and the display module being used for displaying an image according to the first pulse signal. The living organism image monitoring system provided by the present disclosure has the advantages of being capable of synchronously transmitting the images of a living organism to the display module for display and enabling the images to be clearer.

Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.

Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including : forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.

Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.

Abstract: A sound-absorbing mask is configured for covering a mouth. The sound-absorbing mask includes a covering body, a ventilation structure and a sound-absorbing portion. The covering body has a first chamber, a first and a second openings. The first chamber communicates with the first and the second openings. The first opening corresponds to the mouth. The ventilation structure is disposed at the second opening and has a second chamber, a third and a fourth openings. The second chamber communicates with the third and the fourth openings. The fourth opening is away from the first opening. The ventilation structure includes a plate disposed in the second chamber. The plate has a functioning surface facing the third opening. An edge of the plate and an inner wall of the ventilation structure have a gap in between. The sound-absorbing portion is disposed between the ventilation structure and the first opening.

Abstract: This invention is a functionalized diamond crystal with high dispersibility in high ionic strength solution and/or with specific targeting ability, which comprise a diamond crystal and a fatty acid layer. The fatty acid layer works a surfactant and provides a specific targeting feature for the diamond crystal. The feature of the surfactant makes the diamond crystal being easily dispersed in biological surrounding (e.g., phosphate saline buffer) and the feature of specific targeting ability provides the diamond crystal with specific recognizing specific targets. This invention allows researchers to use diamond crystal as a marker for specific labelling.

Abstract: A timing control method for a user equipment (UE) in a wireless communications system, including: obtaining a starting time of a data transmission period from information of a data transmission timing received from a base station of a wireless network; obtaining a starting time of a current data processing period; and adjusting a data processing timing so that the adjusted starting time of the current data processing period is ahead of the starting time of the data transmission period by a predetermined time.

Abstract: A solar module includes a solar panel and a wireless power transmission module coupled to the solar panel for transmitting power generated by the solar panel wirelessly.

Abstract: A sound-absorbing mask is configured for covering a mouth. The sound-absorbing mask includes a covering body, a ventilation structure and a sound-absorbing portion. The covering body has a first chamber, a first and a second openings. The first chamber communicates with the first and the second openings. The first opening corresponds to the mouth. The ventilation structure is disposed at the second opening and has a second chamber, a third and a fourth openings. The second chamber communicates with the third and the fourth openings. The fourth opening is away from the first opening. The ventilation structure includes a plate disposed in the second chamber. The plate has a functioning surface facing the third opening. An edge of the plate and an inner wall of the ventilation structure have a gap in between. The sound-absorbing portion is disposed between the ventilation structure and the first opening.

Abstract: A method includes depositing spacers at a plurality of locations directly on a back contact layer over a solar cell substrate. An absorber layer is formed over the back contact layer and the spacers. The absorber layer is partially in contact with the spacers and partially in direct contact with the back contact layer. The solar cell substrate is heated to form voids between the absorber layer and the back contact layer at the locations of the spacers.

Abstract: A method and apparatus for measuring thickness of a film in a solar cell provides for directing light emitted at multiple emission wavelengths, to a surface of the solar cell. Each emission results in the generation of a responsive photo current. The photo currents are read by a current meter having one contact coupled to a surface of the solar cell and another contact coupled to another surface. The currents associated with each of the different light emissions are identified and the thickness of a film in the solar cell is calculated based on the two currents or associated quantum efficiencies, and associated absorption coefficients. In one embodiment, the film thickness is the thickness of a CdS or other buffer film in a thin film solar cell.

Abstract: A method of fabricating a photovoltaic device includes forming an absorber layer comprising an absorber material above a substrate, forming a buffer layer over the absorber layer, forming a front transparent layer over the buffer layer, and exposing the photovoltaic device to heat or radiation at a temperature from about 80° C. to about 500° C. for a period of time, subsequent to the step of forming a buffer layer over the absorber layer.

Abstract: A method includes depositing spacers at a plurality of locations directly on a back contact layer over a solar cell substrate. An absorber layer is formed over the back contact layer and the spacers. The absorber layer is partially in contact with the spacers and partially in direct contact with the back contact layer. The solar cell substrate is heated to form voids between the absorber layer and the back contact layer at the locations of the spacers.