Patents by Inventor Huan Yang

Huan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080119070
    Abstract: An electrical connector adapted for connecting a camera module to a printed circuit board, at least comprising: a lower shield having a bottom wall, a plurality of sidewalls extending from the bottom wall, and a receiving space defined between the bottom wall and the sidewalls, the receiving space has a supporting surface. A flexible printed circuit placed upon the supporting surface for electrically connecting the camera module. An upper shield secured to the lower shield and comprising a top wall, and a plurality of side walls extending from the top wall, said at least one of the side walls defining a second plate element horizontally extending from the bottom end of the side wall, and at least one assembling hole formed in the second plate element for assembling the electrical connector in the printed circuit board.
    Type: Application
    Filed: November 21, 2007
    Publication date: May 22, 2008
    Inventor: Meng-Huan Yang
  • Patent number: 7367118
    Abstract: A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: May 6, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Kevin Cheng, Ming-Huan Yang, Wan-Wen Chiu, Jane Chang
  • Patent number: 7358184
    Abstract: A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: April 15, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Hung Liu, Ming-Huan Yang, Jane Chang, Chun-Jung Chen, Chao-Kai Cheng, Kou-Chen Liu
  • Publication number: 20080014797
    Abstract: An electrical connector (100) comprises an insulative housing (1) defining an upper receiving cavity (13) for receiving a camera module (200) therein, a plurality of terminals (2) received in the housing, and a first and a second shielding members (3, 4) cooperative for enclosing the housing. Each terminal has a retaining portion (21) secured in the housing and a contact portion (22) extending into the receiving cavity for electrically engaging with the camera module. The first shielding member is assembled to the housing from a lower-to-upper direction for surrounding two opposite lateral sides (10, 11) of the housing and has a pair of opposite first walls (30) extending upwardly thereof. The first wall each defines a pair of retaining members (300), with S-shaped configuration, extending inwardly for reliably engaging with the camera module. The second shielding member is assembled to the housing from an upper-to-lower direction for surrounding the housing.
    Type: Application
    Filed: July 11, 2007
    Publication date: January 17, 2008
    Inventor: Meng-Huan Yang
  • Patent number: 7309238
    Abstract: An shielded electrical connector (100), to which an electrical element (5) is electrically connected, includes an insulative housing (1) defining a number of passageways (101), a number of terminals (2) retained in the passageways, a side shield (3) and a bottom shell (4). The insulative housing also has a bottom board (17) defining a number of grooves (170) communicating with the passageways. Each terminal includes a soldering portion (26) and a body portion (21) partially exposed to the groove and straddling over the groove.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: December 18, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Meng-Huan Yang
  • Patent number: 7304034
    Abstract: Compositions and methods are disclosed for inhibiting the release of a proinflammatory cytokine from a vertebrate cell, and for inhibiting an inflammatory cytokine cascade in a patient. The compositions comprise a vertebrate HMGB A box, and an antibody preparation that specifically binds to a vertebrate HMGB B box. The methods comprise treating a cell or a patient with sufficient amounts of the composition to inhibit the release of the proinflammatory cytokine, or to inhibit the inflammatory cytokine cascade.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: December 4, 2007
    Assignees: The Feinstein Institute for Medical Research, The General Hospital Corporation, University of Pittsburgh-Of the Commonwealth System of Higher Education
    Inventors: Kevin J. Tracey, Huan Yang, Howland Shaw Warren, Jr., Mitchell P. Fink
  • Publication number: 20070270546
    Abstract: A polymeric composition which includes a styrene polymer, at least one unsaturated block copolymer having a high monoalkenyl arene content, a modulus less than 100,000 psi, and comprising at least one A block and at least one B block, each A block independently selected from mono alkenyl arene polymer blocks and each B block independently selected from polymer blocks having at least one conjugated diene and at least one mono alkenyl arene and having a controlled distribution. A second polymeric composition which includes a styrene polymer, at least one unsaturated block copolymer as defined hereinbefore; and at least one additional unsaturated block copolymer having a moderate monoalkenyl arene content. The polymeric composition can be used to produce films that have improved impact resistance that can be thermoformed.
    Type: Application
    Filed: April 20, 2007
    Publication date: November 22, 2007
    Applicant: Kraton Polymers U.S. LLC
    Inventors: Huan Yang, Jeffrey Southwick
  • Publication number: 20070238640
    Abstract: The invention features a method of treating an inflammatory condition in an individual, comprising administering an agent inhibits the interaction between a Toll-like receptor 2 (TLR2) and a high mobility group B (HMGB) polypeptide to the individual. The invention also features methods for identifying agents that inhibit the interaction between TLR2 and HMGB.
    Type: Application
    Filed: April 13, 2007
    Publication date: October 11, 2007
    Inventors: Kevin Tracey, Huan Yang
  • Publication number: 20070232143
    Abstract: An electrical connector (5) for receiving an electrical element (6) includes an insulative housing (51), a shield (53) enclosing the insulative housing and a number of terminals (52) received in the insulative housing. The insulative housing has a bottom wall (510), a number of periphery walls (511), and a receiving space (100) defined therebetween. The shield includes a number of separated side walls (530) each defining a pair of slots (5309), a connecting portion (5311) between the pair of slots, and a fixing portion (5306) extending inwardly from the connecting portion for guiding and fastening the electrical element.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 4, 2007
    Inventor: Meng-Huan Yang
  • Patent number: 7273397
    Abstract: An electrical connector (100) adapted for connecting/disconnecting with/from a complementary connector in a front-to-back direction, includes a shell (1), an insulative housing (2) and a number of contacts (4) received in the housing. The shell includes a main body (111), a connecting tab (115) and a mating portion (112). The main body further includes a receiving space surrounded by a top surface (113), a bottom surface (117), and a pair of lateral surfaces (114). The connecting tab only connects with one edge of said surface of the main body. The mating portion extends from the connecting tab in the front-to-back direction. The insulative housing includes a base portion (21) received in the receiving space of the main body of the shell, and a tongue portion (22) extending from the base portion along the mating direction and received in the mating portion of the shell.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: September 25, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Patent number: 7241160
    Abstract: An electrical connector (100) adaptor for soldering on the printed circuit board and electrically connecting with a camera module (4), comprises an insulative housing (1), a plurality of terminals (2) received in the housing and a shield (3) enclosing the housing. The housing defines a receiving room (10) therein for receiving the camera module and a plurality of openings (130) thereon. Each terminal comprises a contacting portion (24) extending into the receiving room and a tail portion (22) electrically connecting with the printed circuit board. The shield comprises a plurality of surfaces (31, 32) enclosing the insulative housing, each surface forms a resilient tab (33) bent from an edge thereof and passing through the opening of the housing.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: July 10, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventor: Meng-Huan Yang
  • Publication number: 20070155243
    Abstract: An electrical connector (100) adapted for connecting/disconnecting with/from a complementary connector in a front-to-back direction, comprises a shell (1), an insulative housing (2), a pair of locking members (3) and a plurality of contacts (4) received in the insulative housing. The shell comprises top surface (113), a pair of lateral surfaces (114) and a bottom surface (117), said surfaces defines a receiving space, one of the surfaces forms a pair of resilient tabs (1170) bent into the receiving space. The insulative housing received in the receiving space. The locking members assembled on the longitudinal opposite ends of the insulative housing and received in the receiving space, each forms a stopping projection (37) projecting therefrom into the receiving space. The resilient tabs, respectively, resist with the stopping projections of the locking members to stop the locking member from moving.
    Type: Application
    Filed: December 28, 2006
    Publication date: July 5, 2007
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Publication number: 20070151845
    Abstract: An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes.
    Type: Application
    Filed: May 10, 2006
    Publication date: July 5, 2007
    Inventors: Chieh-Kai Chang, Chao-Kai Cheng, Ming-Huan Yang, Chung-Wei Wang, Fu-Kang Cheng, Tzyy-Jang Tseng, Chang-Ming Lee, Chih-Ming Chang, Cheng-Po Yu
  • Publication number: 20070153488
    Abstract: A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
    Type: Application
    Filed: October 31, 2006
    Publication date: July 5, 2007
    Applicants: Industrial Technology Research Institute, Unimicron Technology Corp.
    Inventors: Ming-Huan Yang, Chung-Wei Wang, Chia-Chi Wu, Chao-Kai Cheng, Tzyy-Jang Tseng, Chang-Ming Lee, Cheng-Po Yu, Cheng-Hung Yu
  • Publication number: 20070149009
    Abstract: An electrical connector (100) adapted to receive an electronic module (4) has a shield (1) with a number of resilient locking members (123). The resilient locking member (123) further has a cantilever (1232) abutting the electronic module (4). The locking member (123) holds the electrical module (4) firmly while allowing easy access to the module (4).
    Type: Application
    Filed: December 27, 2006
    Publication date: June 28, 2007
    Inventor: Meng-Huan Yang
  • Publication number: 20070149055
    Abstract: An electrical connector (100) adaptor for connecting with a complementary connector in a mating direction, comprises a shell (1), an insulative housing (2) received in the shell and a plurality of contacts (3) received in the housing. The shell comprises a top surface (11), a pair of lateral surfaces (13, 14), respectively, connecting with the top surface, and a rear surface (15), respectively, bent from the lateral surfaces. The two-part rear surface comprises a base plate (151) and a shielded plate (152) extending rearwardly from the base plate. Each contact comprises a tail portion (32) exposed out of the insulative housing. The shielded plate is above and covers the tail portions of the contacts.
    Type: Application
    Filed: December 26, 2006
    Publication date: June 28, 2007
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Publication number: 20070149054
    Abstract: An electrical connector (100) adapted for connecting/disconnecting with/from a complementary connector in a front-to-back direction, includes a shell (1), an insulative housing (2) and a number of contacts (4) received in the housing. The shell includes a main body (111), a connecting tab (115) and a mating portion (112). The main body further includes a receiving space surrounded by a top surface (113), a bottom surface (117), and a pair of lateral surfaces (114). The connecting tab only connects with one edge of said surface of the main body. The mating portion extends from the connecting tab in the front-to-back direction. The insulative housing includes a base portion (21) received in the receiving space of the main body of the shell, and a tongue portion (22) extending from the base portion along the mating direction and received in the mating portion of the shell.
    Type: Application
    Filed: December 26, 2006
    Publication date: June 28, 2007
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Patent number: 7235442
    Abstract: A method for fabricating a conductive line is provided. First, a substrate having at least two isolation structures already formed is provided. A first conductive layer is formed between every two isolation structures. Then, a dielectric layer is formed on the substrate. The dielectric layer is patterned to form an opening exposing the first conductive layer. After that, a second conductive layer is formed on the substrate. A portion of the second conductive layer outside the opening is removed to form a conductive line. As the size of the device is getting smaller, the size and the position accuracy of the conductive line would not be limited to the design rules of lithography if the present invention is applied. Therefore, a conductive line is formed to electrically connect semiconductor devices effectively.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: June 26, 2007
    Assignee: Powerchip Semiconductor Corp.
    Inventors: Pin-Yao Wang, Liang-Chuan Lai, Jeng-Huan Yang
  • Patent number: D548190
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: August 7, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Patent number: D562242
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: February 19, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Meng-Huan Yang