Abstract: A radio frequency identification (RFID) antenna coil and fabricated method therefor are provided. One or more antennas are connected to be a plane or three-dimensional structure via substrate surface modified procedure, an inkjet-printing process for forming antenna patterning, and an electroless plating process, so that the RFID antenna coil can be flexibility and have higher inductance.

Abstract: The invention features a method of treating an inflammatory condition in an individual, comprising administering an agent that inhibits the interaction between a Toll-like receptor 2 (TLR2) and a high mobility group B (HMGB) polypeptide to the individual. The invention also features methods for identifying agents that inhibit the interaction between TLR2 and HMGB.

Abstract: An electrical connector (100) adaptor for soldering on the printed circuit board and electrically connecting with a camera module (4), comprises an insulative housing (1), a plurality of terminals (2) received in the housing and a shield (3) enclosing the housing. The housing defines a receiving room (10) therein for receiving the camera module and a plurality of openings (130) thereon. Each terminal comprises a contacting portion (24) extending into the receiving room and a tail portion (22) electrically connecting with the printed circuit board. The shield comprises a plurality of surfaces (31, 32) enclosing the insulative housing, each surface forms a resilient tab (33) bent from an edge thereof and passing through the opening of the housing.

Abstract: The present invention is directed to blends of ABS copolymer and aliphatic polymers, such as polyolefins, which blends include a compatibilizer. Such blends exhibit improved impact resistance over blends lacking the compatibilizer.

Abstract: What is claimed is a flexible packaging film having improved toughness without compromise of other physical properties. The flexible packaging film is a laminate of at least two film layers of a polyolefin and at least one film layer of a block copolymer. The block copolymer employed in the present invention is a selectively hydrogenated high vinyl block copolymer.

Abstract: A method for fabricating a conductive line is provided. First, a substrate having at least two isolation structures already formed is provided. A first conductive layer is formed between every two isolation structures. Then, a dielectric layer is formed on the substrate. The dielectric layer is patterned to form an opening exposing the first conductive layer. After that, a second conductive layer is formed on the substrate. A portion of the second conductive layer outside the opening is removed to form a conductive line. As the size of the device is getting smaller, the size and the position accuracy of the conductive line would not be limited to the design rules of lithography if the present invention is applied. Therefore, a conductive line is formed to electrically connect semiconductor devices effectively.

Abstract: A card connector (100) provided for interconnecting the card to an external circuit board includes an insulative housing (1), a number of terminals (2) retained in the housing for electrically connecting with the card, and first and second spring switch contacts (31, 32). The first and second spring switch contact respectively include a first and second lead (311, 312) secured in the housing and extending outwardly for electrical connection with an external circuit board, and a generally U-shaped first and second deflectable body portion (312, 322). The first deflectable body portion has a first free leg (314) defining a first spring contact portion (3140). The second deflectable body portion has a second free leg (324) having a deflecting portion (3241) adapted to be actuated by the card in direct response to insertion thereof and a second spring contact portion (3240) adapted for engaging with said first spring contact portion.

Abstract: A method of manufacturing self-aligned contact openings is provided. A substrate having a plurality of device structures is provided and the top of the device structures is higher than the surface of the substrate. A first dielectric layer and a conductive layer are sequentially formed on the surfaces of the substrate and the device structures. Next, a part of the conductive layers on the top and the sidewalls of the device structures is removed and a plurality of first spacers is formed on the exposed sidewalls of the device structures. The exposed conductive layer and the first dielectric layer are removed by using the first spacer as the mask to expose the substrate. Then, a plurality of conductive spacers is formed. A plurality of second spacers is formed on the sidewalls of the conductive spacers.

Abstract: An shielded electrical connector (100) for fastening therein an electrical element (5) witch is formed with a plurality of protrusions (5111, 5121, 5131, 5141), includes an insulatire housing (3), a number of terminals (2), a side shield (1) and a bottom shield (4). The side shield includes a number of separated shielding plates (11, 12, 13, 14) mounted around the insulative housing. Each shielding plate has a number of flexible plates (15) formed in U-shape with a free end extending downwardly and inwardly for pressing against the electrical element. The side shield further defines a plurality of engaging holes (123, 143) for insertion of soldering portions of the terminals. This arrangment of tabs (24) enables the connector to be either top or bottom loads through an opening in a printed circuit board. Some of the plates (15) include cutouts (151), which are to receive the protrusions (5111, etc) for locking and orientation purposes.

Abstract: A module connector (100), to which a module body is electrically connected, includes an insulating housing (1), a number of contacts (2) received in the insulating housing (1), a shell (3) and a holding member (4). The insulating housing (1) defines a chamber (14) for accommodating the module body. The shell (3) is assembled onto the insulating housing (1). The holding member (4) cooperates with the shell (3) to securely accommodate the module body in the insulating housing (1), thereby electrically connecting the contacting portions of the contacts (2) with the module body accommodated in the chamber (14) of the insulating housing (1).

Abstract: A method of manufacturing a shallow trench isolation structure adapted for a substrate, is provided. A dielectric film is formed on the substrate and then a buffer layer having a first thickness is formed on the dielectric film. Then, a hard mask layer having a second thickness is formed on the buffer layer. The hard mask layer, the buffer layer, the dielectric film and the substrate are patterned to form an opening in the hard mask layer, the buffer layer and the dielectric film and a trench in the substrate. An insulating layer is formed to fill up the opening and the trench. Thereafter, the hard mask layer, a portion of the insulating layer and the buffer layer are removed to form a shallow trench isolation structure that protrudes out of the substrate surface.

Abstract: A cable connector assembly (100) includes a first connector member (1) and a second connector member (2). The first connector member includes a first housing (13), a number of first contacts (14) received in the first housing and a first shell (11) enclosing the first housing. The first housing has a tongue plate (133). A grounding bar (12) attaches to the first housing and encloses the tongue plate. The second connector member includes a second housing (22), a number of second contacts (23) received in the second housing to electrically contacting with the first contacts and a second shell (21) enclosing the second housing. A room (24) is reserved between the second housing and the second shell adapted for receiving the tongue plate enclosed with the grounding bar of the first housing.

Abstract: An electrical connector (100) adapted for electrically connecting an electronic element (1) such as a camera module with a substrate (200) comprises a shielding member (2, 3), an insulated housing (5) and a number of contacts (4) retained in the housing. Each contact comprises a contact portion (41) for electrically contacting with the camera module and a solder portion (44) extending out the housing for being soldered on the substrate. The shielding member surrounds the housing to prevent the contact from unexpected Electro Magnetic Interference and comprises a plurality solder legs soldered on the substrate. The solder legs are arranged among the solder portions of the contacts. Typically, the distance between every two adjacent solder legs is not greater than 2.5 millimeters. Therefore, the shielding member can effectively prevents various unexpected interference affecting signal transmission of the camera module.