Patents by Inventor Huan Yang

Huan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7834274
    Abstract: A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: November 16, 2010
    Assignees: Industrial Technology Research Institute, Unimicron Technology Corp.
    Inventors: Ming-Huan Yang, Chung-Wei Wang, Chia-Chi Wu, Chao-Kai Cheng, Tzyy-Jang Tseng, Chang-Ming Lee, Cheng-Po Yu, Cheng-Hung Yu
  • Patent number: 7749959
    Abstract: Compositions and methods are disclosed for inhibiting the release of a proinflammatory cytokine from a vertebrate cell, and for inhibiting an inflammatory cytokine cascade in a patient. The compositions comprise a vertebrate HMGB A box, and an antibody preparation that specifically binds to a vertebrate HMGB B box. The methods comprise treating a cell or a patient with sufficient amounts of the composition to inhibit the release of the proinflammatory cytokine, or to inhibit the inflammatory cytokine cascade.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: July 6, 2010
    Assignees: The Feinstein Institute for Medical Research, The General Hospital Corporation, University of Pittsburgh-of the Commonwealth System of Higher Education
    Inventors: Kevin J. Tracey, Huan Yang, Howland Shaw Warren, Jr., Mitchell P. Fink
  • Patent number: 7696169
    Abstract: The invention features a method of treating an inflammatory condition in an individual, comprising administering an agent inhibits the interaction between a Toll-like receptor 2 (TLR2) and a high mobility group B (HMGB) polypeptide to the individual. The invention also features methods for identifying agents that inhibit the interaction between TLR2 and HMGB.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: April 13, 2010
    Assignee: The Feinstein Institute for Medical Research
    Inventors: Kevin J. Tracey, Huan Yang
  • Publication number: 20100045546
    Abstract: A UWB antenna for transportation means comprises a metallic screen, a dielectric substrate and a rectangular printed metallic patch. The dielectric substrate is disposed on the printed metallic patch. The printed metallic patch is disposed on the dielectric substrate, and has a horizontal trench gap and two vertical trench gaps. The horizontal trench gap is parallel to the long side of the rectangular printed metallic patch, and the vertical trench gaps respectively extend upward from each end of the horizontal trench gap to form two resonance contours.
    Type: Application
    Filed: August 17, 2009
    Publication date: February 25, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: TEH HO TAO, DENIS VLADIMIROVICH VLASOV, ALEXANDER NIKOLAYEVICH KHRIPKOV, KUANG I CHANG, ZU SHO CHOW, CHENG FOO CHEN, TZU MING CHANG, CHING HUAN YANG
  • Publication number: 20100040607
    Abstract: Compositions and methods are disclosed for treating a condition characterized by activation of an inflammatory cytokine cascade in a patient. The compositions comprise an agent that inhibits HMGB biological activity and a caspase inhibitor. The methods comprise treating a cell or a patient with sufficient amounts of the composition to inhibit the release of proinflammatory cytokine(s) and/or inhibit the inflammatory cytokine cascade.
    Type: Application
    Filed: May 11, 2006
    Publication date: February 18, 2010
    Inventors: Kevin J. Tracey, Huan Yang
  • Patent number: 7661186
    Abstract: A fabrication method of a radio frequency identification (RFID) antenna coil is provided. First, a substrate is processed by a surface modified procedure, to form a self-assembly membranes (SAMs) on a surface of the substrate. A catalyst is sprayed on the SAMs of the substrate according to patterning. After that, the first electroless plating procedure is first carried out for the substrate to generate a magnetic metal layer corresponding to the wiring pattern on the catalyst, and the second electroless plating procedure is then carried out for the substrate to generate the metal layer on the magnetic metal layer.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: February 16, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Wei Wang, Yung-Kuo Ho, Ming-Huan Yang, Chia-Chi Wu, Chao-Kai Cheng
  • Patent number: 7569281
    Abstract: What is claimed is a flexible packaging film having improved toughness without compromise of other physical properties. The flexible packaging film is a laminate of at least two film layers of a polyolefin and at least one film layer of a block copolymer. The block copolymer employed in the present invention is a selectively hydrogenated high vinyl block copolymer.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: August 4, 2009
    Assignee: Kraton Polymers U.S. LLC
    Inventors: Mario G. Umana, Huan Yang
  • Patent number: 7435139
    Abstract: An electrical connector (5) for receiving an electrical element (6) includes an insulative housing (51), a shield (53) enclosing the insulative housing and a number of terminals (52) received in the insulative housing. The insulative housing has a bottom wall (510), a number of periphery walls (511), and a receiving space (100) defined therebetween. The shield includes a number of separated side walls (530) each defining a pair of slots (5309), a connecting portion (5311) between the pair of slots, and a fixing portion (5306) extending inwardly from the connecting portion for guiding and fastening the electrical element.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: October 14, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Meng-Huan Yang
  • Publication number: 20080231905
    Abstract: A method for calculating ink-jet printing data is disclosed. A preset pattern is first obtained. Ink-jet points required for the preset pattern are calculated to select a filtering mode. A filtering operation is implemented on the preset pattern according to the filtering mode, resulting in an applicable number of ink-jet points for the preset pattern. The preset pattern is printed on a base board based on the resulting ink-jet points.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 25, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Hsuan Chiu, Chao-Kai Cheng, Wan-Wen Chiu, Ming-Huan Yang, Chih-Jian Lin
  • Publication number: 20080223820
    Abstract: A method for forming miniature wires by printing or dispensing a solution on a substrate, the solution comprising a solute being capable of being etched and forming an inner and outer region on the substrate, each region having a thickness. After an etching process is applied on the substrate, the region inner region is removed so the outer region remains as desired wires. A line width of thus formed wires is narrowed to reach micron-scale wires.
    Type: Application
    Filed: February 20, 2008
    Publication date: September 18, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yung-Hsiang WU, Je-Ping HU, Ming-Huan YANG, Chun-Jung CHEN, Chien-Hung LIU
  • Patent number: 7422465
    Abstract: An electrical connector (100) adapted for connecting/disconnecting with/from a complementary connector in a front-to-back direction, comprises a shell (1), an insulative housing (2), a pair of locking members (3) and a plurality of contacts (4) received in the insulative housing. The shell comprises top surface (113), a pair of lateral surfaces (114) and a bottom surface (117), said surfaces defines a receiving space, one of the surfaces forms a pair of resilient tabs (1170) bent into the receiving space. The insulative housing received in the receiving space. The locking members assembled on the longitudinal opposite ends of the insulative housing and received in the receiving space, each forms a stopping projection (37) projecting therefrom into the receiving space. The resilient tabs, respectively, resist with the stopping projections of the locking members to stop the locking member from moving.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: September 9, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Publication number: 20080214454
    Abstract: Compositions and methods are disclosed for inhibiting the release of a proinflammatory cytokine from a vertebrate cell, and for inhibiting an inflammatory cytokine cascade in a patient. The compositions comprise a vertebrate HMGB A box, and an antibody preparation that specifically binds to a vertebrate HMGB B box. The methods comprise treating a cell or a patient with sufficient amounts of the composition to inhibit the release of the proinflammatory cytokine, or to inhibit the inflammatory cytokine cascade.
    Type: Application
    Filed: September 19, 2007
    Publication date: September 4, 2008
    Inventors: Kevin J. Tracey, Huan Yang, Howland Shaw Warren, Mitchell P. Fink
  • Patent number: 7410390
    Abstract: An electrical connector (100) adaptor for connecting with a complementary connector in a mating direction, comprises a shell (1), an insulative housing (2) received in the shell and a plurality of contacts (3) received in the housing. The shell comprises a top surface (11), a pair of lateral surfaces (13, 14), respectively, connecting with the top surface, and a rear surface (15), respectively, bent from the lateral surfaces. The two-part rear surface comprises a base plate (151) and a shielded plate (152) extending rearwardly from the base plate. Each contact comprises a tail portion (32) exposed out of the insulative housing. The shielded plate is above and covers the tail portions of the contacts.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: August 12, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Tsuneki Watanabe, Gwou-Jong Tseng, Meng-Huan Yang
  • Patent number: 7402079
    Abstract: An electrical connector (100) adapted to receive an electronic module (4) has a shield (1) with a number of resilient locking members (123). The resilient locking member (123) further has a cantilever (1232) abutting the electronic module (4). The locking member (123) holds the electrical module (4) firmly while allowing easy access to the module (4).
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: July 22, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Meng-Huan Yang
  • Publication number: 20080167234
    Abstract: Compositions and methods are disclosed for inhibiting the release of a proinflammatory cytokine from a vertebrate cell, and for inhibiting an inflammatory cytokine cascade in a patient. The compositions comprise a vertebrate HMGB A box, and an antibody preparation that specifically binds to a vertebrate HMGB B box. The methods comprise treating a cell or a patient with sufficient amounts of the composition to inhibit the release of the proinflammatory cytokine, or to inhibit the inflammatory cytokine cascade.
    Type: Application
    Filed: September 19, 2007
    Publication date: July 10, 2008
    Inventors: Kevin J. Tracey, Huan Yang, Howland Shaw Warren, Mitchell P. Fink
  • Publication number: 20080119070
    Abstract: An electrical connector adapted for connecting a camera module to a printed circuit board, at least comprising: a lower shield having a bottom wall, a plurality of sidewalls extending from the bottom wall, and a receiving space defined between the bottom wall and the sidewalls, the receiving space has a supporting surface. A flexible printed circuit placed upon the supporting surface for electrically connecting the camera module. An upper shield secured to the lower shield and comprising a top wall, and a plurality of side walls extending from the top wall, said at least one of the side walls defining a second plate element horizontally extending from the bottom end of the side wall, and at least one assembling hole formed in the second plate element for assembling the electrical connector in the printed circuit board.
    Type: Application
    Filed: November 21, 2007
    Publication date: May 22, 2008
    Inventor: Meng-Huan Yang
  • Patent number: 7367118
    Abstract: A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: May 6, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Kevin Cheng, Ming-Huan Yang, Wan-Wen Chiu, Jane Chang
  • Patent number: 7358184
    Abstract: A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: April 15, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Hung Liu, Ming-Huan Yang, Jane Chang, Chun-Jung Chen, Chao-Kai Cheng, Kou-Chen Liu
  • Patent number: D591241
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: April 28, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Meng-Huan Yang
  • Patent number: D596123
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: July 14, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Meng-Huan Yang