Abstract: A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.

Abstract: A method of designing integrated circuits includes forming a restricted cell library from a first cell library by selecting only those cells in the first cell library that are most efficient according to predetermined efficiency criteria and executing an integrated circuit design operation in an electronic design automation program while directing the electronic design automation program to make cell selections exclusively from the restricted cell library. The integrated circuit design operation is one that can be directed to make cell selections from any of the cells in the first cell library without changing its essential purpose. The method improves QoR for the resulting circuit design.

Abstract: One or more techniques or systems for determining double patterning technology (DPT) layout routing compliance are provided herein. For example, a layout routing component of a system is configured to assign a pin loop value to a pin loop. In some embodiments, the pin loop value is assigned based on a mask assignment of a pin of the pin loop. In some embodiments, the pin loop value is assigned based on a number of nodes associated with the pin loop. DPT compliance or a DPT violation is determined for the pin loop based on the pin loop value. In this manner, odd loop detection associated with DPT layout routing is provided because a DPT violation results in generation of an additional instance of a net, for example. Detecting an odd loop allows a design to be redesigned before fabrication, where the odd loop would present undesired issues.

Abstract: A method for laying out a target pattern includes assigning a keep-out zone to an end of a first feature within a target pattern, and positioning other features such that ends of the other features of the target pattern do not have an end within the keep-out zone. The target pattern is to be formed with a corresponding main feature and cut pattern.

Abstract: A method identifies, as an independent node, any node representing a circuit pattern in any odd loop of a layout of a region of a layer of an IC that is not included in any other odd loop of the layout. The layer is to have a plurality of circuit patterns to be patterned using at least three photomasks. The method identifies, as a safe independent node, any independent node not closer than a threshold distance from any other independent nodes in another odd loop of the layout. The layout is modified, if the circuit patterns in the layout include any odd loop without any safe independent node, so that that after the modifying, each odd loop has at least one safe independent node.

Abstract: Among other things, one or more techniques and/or systems for performing design layout are provided. In an example, a design layout corresponds to a layout of a standard cell whose connectivity is described by a netlist. For example, the netlist specifies net types for respective vias of the standard cell. One or more connectivity rings are formed within the design layout to provide connectivity for one or more vias of the design layout. For example, a first connectivity ring is generated, such as from mandrel, to connect one or more ring one vias. A second connectivity ring is generated, such as from passive pattern, to connect one or more ring two vias. One or more cuts are generated within the design layout to isolate vias having different net types. In this way, the design layout is self-aligned double patterning (SADP) compliant.

Abstract: In some embodiments, a semiconductor arrangement comprises a stacked interconnect structure comprising a first interconnect structure and a second interconnect structure. The stacked interconnect structure has a relatively larger aspect ratio than the first interconnect structure or the second interconnect structure, which reduces resistivity and improves performance. In some embodiments, a duplicate interconnect path is inserted into a design layout for a semiconductor arrangement. The duplicated interconnect path provides an additional path between a first net and a second net connected by an interconnect path. Connecting the first net and the second net by the interconnect path and the duplicated interconnect path reduces resistivity and improves performance. In some embodiments, a semiconductor arrangement comprises cell pin operatively coupled to a duplicate cell pin. The cell pin and the duplicate cell pin are operatively coupled to a logic structure to reduce resistivity and improve performance.

Abstract: A method includes receiving a target pattern that is defined by a main pattern, a first cut pattern, and a second cut pattern, with a computing system, checking the target pattern for compliance with a first constraint, the first constraint associated with the first cut pattern, with the computing system, checking the target pattern for compliance with a second constraint, the second constraint associated with the second cut pattern, and with the computing system, modifying the pattern in response to determining that a violation of either the first constraint or the second constraint is found during the checking.

Abstract: A base assembly of an office chair includes a mounting member, multiple extensions and a bottom disk. The mounting member has multiple installation slots located evenly along the periphery of the mounting member. Each extension has a connection member at the first end thereof so as to be engaged with the installation slot corresponding thereto. The bottom disk is located at the underside of the first end of each of the extensions and has multiple holes and a central hole. Bolts extend through the holes and are connected to the underside of the mounting member to position the first ends of the extensions.

Abstract: A method of designing integrated circuits includes forming a restricted cell library from a first cell library by selecting only those cells in the first cell library that are most efficient according to predetermined efficiency criteria and executing an integrated circuit design operation in an electronic design automation program while directing the electronic design automation program to make cell selections exclusively from the restricted cell library. The integrated circuit design operation is one that can be directed to make cell selections from any of the cells in the first cell library without changing its essential purpose. The method improves QoR for the resulting circuit design.

Abstract: A method comprises (a) providing an integrated circuit (IC) layout comprising data representing a plurality of circuit patterns to be formed on or in a single layer of an IC by multi-patterning; (b) dividing the plurality of circuit patterns into two or more groups; (c) assigning the circuit patterns within each group to a respective mask to provide mask assignment data, for forming each group of circuit patterns on or in the single layer of the IC; (d) compressing the mask assignment data; and (e) storing the compressed mask assignment data to a non-transitory machine readable storage medium for use by an electronic design automation tool configured for reconstructing the mask assignment data from the compressed data.

Abstract: A semiconductor chip includes a row of cells, with each of the cells including a VDD line and a VSS line. All VDD lines of the cells are connected as a single VDD line, and all VSS lines of the cells are connected as a single VSS line. No double-patterning full trace having an even number of G0 paths exists in the row of cells, or no double-patterning full trace having an odd number of G0 paths exists in the row of cells.

Abstract: A method for laying out a target pattern includes assigning a keep-out zone to an end of a first feature within a target pattern, and positioning other features such that ends of the other features of the target pattern do not have an end within the keep-out zone. The target pattern is to be formed with a corresponding main feature and cut pattern.

Abstract: A received layout identifies a plurality of circuit components to be included in an integrated circuit (IC) layer for double patterning the layer using two photomasks, the layout including a plurality of first patterns to be included in the first photomask and at least one second pattern to be included in the second photomask. A selected one of the first patterns has first and second endpoints, to be replaced by a replacement pattern connecting the first endpoint to a third endpoint. At least one respective keep-out region is provided adjacent to each respective remaining first pattern except for the selected first pattern. Data are generated representing the replacement pattern, such that no part of the replacement pattern is formed in any of the keep-out regions. Data representing the remaining first patterns and the replacement pattern are output.

Abstract: A method includes (a) generating timing information of an integrated circuit (IC) floorplan by a processing unit, (b) displaying on a display device a representation of the IC floorplan according to the timing information, (c) receiving user input via an input device, the user input associated with an IC macro of the IC floorplan, (d) updating the timing information associated with the IC macro to generated updated timing information according to the user input, and (e) altering display of the representation according to the updated timing information.

Abstract: One or more techniques or systems for determining double patterning technology (DPT) layout routing compliance are provided herein. For example, a layout routing component of a system is configured to assign a pin loop value to a pin loop. In some embodiments, the pin loop value is assigned based on a mask assignment of a pin of the pin loop. In some embodiments, the pin loop value is assigned based on a number of nodes associated with the pin loop. DPT compliance or a DPT violation is determined for the pin loop based on the pin loop value. In this manner, odd loop detection associated with DPT layout routing is provided because a DPT violation results in generation of an additional instance of a net, for example. Detecting an odd loop allows a design to be redesigned before fabrication, where the odd loop would present undesired issues.

Abstract: Among other things, one or more techniques and systems for layout re-decomposition of a new layout corresponding to a change order to an original layout associated with an integrated circuit are provided. The change order is applied to the original layout to create the new layout. The original layout comprises one or more original pattern portions assigned pattern colors that correspond to pattern masks. One or more new pattern portions within the new layout are assigned pattern colors such that the new layout has a relatively high color similarity with respect to the original layout. In this way, changes to the pattern masks are reduced, thus mitigating fabrication delay or costs that would otherwise result from significant changes to the pattern masks.

Abstract: A semiconductor chip includes a row of cells, with each of the cells including a VDD line and a VSS line. All VDD lines of the cells are connected as a single VDD line, and all VSS lines of the cells are connected as a single VSS line. No double-patterning full trace having an even number of G0 paths exists in the row of cells, or no double-patterning full trace having an odd number of G0 paths exists in the row of cells.

Abstract: Among other things, one or more techniques and systems for layout re-decomposition of a new layout corresponding to a change order to an original layout associated with an integrated circuit are provided. The change order is applied to the original layout to create the new layout. The original layout comprises one or more original pattern portions assigned pattern colors that correspond to pattern masks. One or more new pattern portions within the new layout are assigned pattern colors such that the new layout has a relatively high color similarity with respect to the original layout. In this way, changes to the pattern masks are reduced, thus mitigating fabrication delay or costs that would otherwise result from significant changes to the pattern masks.

Abstract: A method includes (a) generating timing information of an integrated circuit (IC) floorplan by a processing unit, (b) displaying on a display device a representation of the IC floorplan according to the timing information, (c) receiving user input via an input device, the user input associated with an IC macro of the IC floorplan, (d) updating the timing information associated with the IC macro to generated updated timing information according to the user input, and (e) altering display of the representation according to the updated timing information.