Abstract: A projection exposure apparatus for microlithography has a light source, an illumination system, a mask-positioning system and a projection lens. The latter has a system aperture plane and an image plane and contains at least one lens that is made of a material which has a birefringence dependent on the transmission angle. The exposure apparatus further has an optical element, which has a position-dependent polarization-rotating effect or a position-dependent birefringence. This element, which is provided close to a pupil plane of the projection exposure apparatus, compensates at least partially for the birefringent effects produced in the image plane by the at least one lens.

Abstract: The invention relates to a device for manipulation of the angular position of an object relative to a fixed structure, into which the object, in particular an optical element of a lens group for microlithography, is introduced, about three rotational axes, intersecting at a point. The object can also be held in a support frame. The support frame, with the object is connected to the fixed structure by means of three connection limbs each with three rotational degrees of freedom and one translational degree of freedom. The angular position of the support frame is adjustable about each one of the three rotational axes by means of one of the connection limbs.

Abstract: A projection exposure apparatus for microlithography has a light source, an illumination system, a mask-positioning system and a projection lens. The latter has a system aperture plane and an image plane and contains at least one lens that is made of a material which has a birefringence dependent on the transmission angle. The exposure apparatus further has an optical element, which has a position-dependent polarization-rotating effect or a position-dependent birefringence. This element, which is provided close to a pupil plane of the projection exposure apparatus, compensates at least partially for the birefringent effects produced in the image plane by the at least one lens.

Abstract: Facet mirror having a number of mirror facets A facet mirror (10) is provided with a number of mirror facets (11), in which the mirror facets (11) respectively have a spherical or conical facet body (17) with a reflecting surface (12). The side of the facet body (17) averted from the reflecting surface (12) is mounted in a bearing device (15).

Abstract: In a facet mirror with a number of mirror facets, wherein the mirror facets are provided with reflecting surfaces, the mirror facets are mounted jointly in a basic body via bearing devices. The mirror facets comprise mirror bodies contacting at the periphery with the bearing devices via a surface, line or point contact. The preferred field of use of the facet mirrors is a projection objective of a projection exposure machine in microlithography for fabricating semiconductor elements.

Abstract: A catadioptric objective comprises a plurality of lenses and at least two deflecting mirrors that have reflecting surfaces that are at a specific angle, in particular of 90°, to one another. The two deflecting mirrors are arranged with their reflecting surfaces on a common base member whose position in the objective can be set.

Abstract: An imaging device (7) in a projection exposure machine (1) for microlithography has at least one optical element (10, 33, 34) and at least one manipulator (9, 36, 41), having a linear drive (11), for manipulating the position of the optical element (10, 33, 34). The linear drive (11) has a driven subregion (14) and a nondriven subregion (15), which are movable relative to one another in the direction of a movement axis (17). The subregions (14, 15) are interconnected at least temporarily via functional elements (18) with an active axis (17) [sic] and via functional elements (19) with an active direction at least approximately parallel to the movement axis (17).

Abstract: An optical measuring system is provided with a measuring machine that has at least one measuring element for determining locations and at least one measuring element for determining angles. At least one common reference surface is provided for the location-determining measuring element and the angle-determining measuring element.

Abstract: The invention relates to an objective, particularly a projection objective for use in semiconductor lithography, comprising optical elements such as lenses (16) and mirrors (11a). According to the invention, at least a portion of the optical elements (16, 11a) is provided with a reflective surface outside of the optically active area serving as the reference surface (12) for adjusting the optical element inside the objective (8).

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: A projection exposure system, in particular for microlithography, serves for the generation of an image in an image plane of an object arranged in an object plane. The system comprises a light source that emits a projection light bundle. The system also comprises a projection optics arranged in the optical path between the object plane and the image plane as well as at least one optical correction component arranged in the projection light optical path in front of the image plane. In order to change the optical image properties this component is coupled to at least one correction manipulator so that an optical surface of the optical correction component illuminated by the projection light bundle is moved at least regionally. In this connection the correction manipulator operates together with a correction sensor device. The correction sensor device comprises a light source that emits at least one measuring light bundle.

Abstract: An optical arrangement, in particular a microlithographic projection printing installation, has in particular a slot-shaped image field or rotationally non-symmetrical illumination. An optical element (5) is therefore acted upon in a rotationally non-symmetrical manner by the radiation of a light source. To temper the optical element (5), a supply apparatus (11, 19 to 23) for gas is used. The latter having at least one supply line (21) and at least one gas directing device (11). The latter is aligned relative to the optical element (5) and controllable in such a way that the gas is directed by the gas directing device (11) towards the optical element (5). The volumetric flow of the exiting gas therefore has a magnitude and spatial distribution (17), which are adapted to the intensity distribution (6) of the radiation. By virtue of such tempering, rotationally non-symmetrical light-induced image defects in the optical element (5) are avoided or compensated.

Abstract: A projection exposure apparatus for microlithography has a light source, an illumination system, a mask-positioning system and a projection lens. The latter has a system aperture plane and an image plane and contains at least one lens that is made of a material which has a birefringence dependent on the transmission angle. The exposure apparatus further has an optical element, which has a position-dependent polarization-rotating effect or a position-dependent birefringence. This element, which is provided close to a pupil plane of the projection exposure apparatus, compensates at least partially for the birefringent effects produced in the image plane by the at least one lens.

Abstract: A mount for an optical element in an optical imaging device, in particular in a lens system (4) for semiconductor lithography, has at least one mounting ring (2) which bears the optical element (6). The mounting ring (2) is of at least partially hollow design in cross section.

Abstract: High precision optical components, for example CaF2 lenses in lithographic systems for the production of integrated circuits, often suffer from stress induced birefringence and other imperfections. For altering the optical properties in a confined region of the optical component, the latter is exposed to a beam of ions having an energy preferably in the order 100 MeV/u. This results in a modification of the optical properties due to an interaction of the ions with the surrounding medium the optical component consists of. By carefully choosing the parameters of the process, it is possible to alter the refractive index or the mechanical stress distribution or other optical properties within a confined region of this medium.

Abstract: In an apparatus for positioning an optical element in a structure, particularly in an objective housing of a projection objective for microlithography, the optical element is connected to the structure via fastening elements. The position of the optical element is set by means of adjusting fasteners.

Abstract: In a method for correcting oscillation-induced imaging errors in an objective, in particular a projection objective in microlithography for fabricating semiconductor elements, an at least first objective part and a second objective part are provided. In this case, the first objective part has a first optical axis and the second objective part has an optical axis which deviates from the first optical axis. Beam deflection takes place between the two objective parts via at least one optical beam deflection element. The oscillations occurring in the second objective part are measured and evaluated by means of a sensor system. The results are used as input data for a device, which adjusts the beam direction in the objective, in such a way that imaging errors occurring as a result of the oscillations of the second objective part are compensated for.

Abstract: An optical element (1) of an optical system has at least one chamber (5) that is sealed against atmospheric pressure and is enclosed by boundary surfaces and that has a fluid filling. At least one of the boundary surfaces of the chamber (5) is exposed at least partially to illumination light. It is configured so that a change in the fluid pressure inside the chamber (5) results in a change in non-rotational-symmetric imaging properties of the optical element (1) having n-fold symmetry. For this purpose, a fluid source has a fluid connection to the chamber via a fluid supply line (17). Furthermore, a control device is provided for the pressure in the fluid filling.

Abstract: A mount for an optical element in an optical imaging device, in particular in a lens system (4) for semiconductor lithography, has at least one mounting ring (2) which bears the optical element (6). The mounting ring (2) is of at least partially hollow design in cross section.

Abstract: An optical arrangement, in particular a microlithographic projection printing installation, has in particular a slot-shaped image field or rotationally non-symmetrical illumination. A refractive optical element, e.g. a lens (2), is heated by the rotationally non-symmetrical radiated impingement (3) of a light source. At least one electric heating element is coupled to the optical element. Said heating element comprises a resistance heating coating carried by the optical element. In the region of the surface (3) of the optical element acted upon by the radiation of the light source the resistance heating coating is substantially optically transparent. It comprises a plurality of parallel, electrically mutually insulated coating strips (5 to 10). A heating current source (17 to 19) is additionally part of the heating element.