Patents by Inventor Hugh E. Stroupe

Hugh E. Stroupe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6307254
    Abstract: A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: October 23, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Hugh E. Stroupe
  • Patent number: 6103636
    Abstract: A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon. The process comprising the steps of aligning said area of said wafer, such as an alignment mark on the wafer, to an etchant dispensing apparatus, placing the surface of the wafer adjacent at least a portion of an annular portion of the etchant dispensing apparatus, dispensing at least one etchant onto said area of said wafer, such as an alignment mark, and removing the at least one etching from the wafer.
    Type: Grant
    Filed: August 20, 1997
    Date of Patent: August 15, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Russell C. Zahorik, deceased, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon
  • Patent number: 6069028
    Abstract: A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extends across the semiconductor die and terminate over its respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
    Type: Grant
    Filed: March 24, 1998
    Date of Patent: May 30, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Hugh E. Stroupe
  • Patent number: 5945729
    Abstract: A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
    Type: Grant
    Filed: October 10, 1997
    Date of Patent: August 31, 1999
    Assignee: Micron Technology, Inc.
    Inventor: Hugh E. Stroupe
  • Patent number: 5807767
    Abstract: A semiconductor assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
    Type: Grant
    Filed: January 2, 1996
    Date of Patent: September 15, 1998
    Assignee: Micron Technology, Inc.
    Inventor: Hugh E. Stroupe
  • Patent number: 5232875
    Abstract: A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbital, fixed-direction vibratory, or random-direction vibratory motion. In one embodiment of the invention, pressure between the surface of the wafer to be polished and the moving polishing pad is generated by the force of gravity acting on at least the wafer and the carrier; in another it is provided by a mechanical force applied normal to the wafer surface. The polishing pad is wetted with a slurry having abrasive particles suspended in a liquid which may be chemically reactive with respect to at least one material on the wafer.
    Type: Grant
    Filed: October 15, 1992
    Date of Patent: August 3, 1993
    Assignee: Micron Technology, Inc.
    Inventors: Mark E. Tuttle, Trung T. Doan, Angus C. Fox, Gurtej S. Sandhu, Hugh E. Stroupe