Abstract: A firmware recovery method of a baseboard management controller (BMC) of a computing device detects whether a firmware of a default firmware memory of the BMC is damaged by sending a detection command to the BMC at a regular interval. When the firmware of the default firmware memory of the BMC is damaged, the method recovers the firmware according to firmware data of a backup firmware memory of the BMC.

Abstract: Equipment for making IC shielding coating layer and a metal shielding layer of IC. The equipment comprises a base, a work support, a plurality of medium frequency magnetron targets and a plurality of multi-arc ion targets. The base comprises a chamber. The work support is disposed in the chamber and movably connected with a plurality of rotation axes. Each rotation axes comprises at least one fixture. The fixture is used to put at least one IC. Each medium frequency magnetron target and each multi-arc ion target are disposed in the chamber. The medium frequency magnetron targets and the multi-arc ion targets are used to sputter a metal material over the IC to form at least one metal shielding layer on a surface of the IC.

Abstract: Disclosed are method and apparatus for allocating radio resources. The method for allocating radio resource includes: determining, by a base station, a group of downlink sub-channels and transmission parameters related to the group of downlink sub-channels according to downlink channel characteristics and downlink interference characteristics of each resource block and a downlink bandwidth requirement of a terminal reported by the terminal, and transmitting the group of downlink sub-channels and the related transmission parameters determined to the terminal. The method and apparatus are able to allocate radio resources and determine transmission parameters based on user service requirement and system channel conditions, which greatly optimizes the system performances and improves efficiency.

Abstract: A method for manufacturing shielding which uses multiple vacuum sputtering methods to produce shielding on single IC chip. The method comprises the following steps: using covering fixtures to cover a plurality of IC chips and fixing these IC chips on a work support; vacuumizing the chamber to a pretreatment vacuum level; keeping pumping an ionizable gas into the chamber and performing ion bombardment on the material for IC packaging on the surface of these IC chips in order to produce carbon dangling bond connection layer on the material when the vacuum level of the chamber reaches the work vacuum level; performing multiple vacuum sputtering method to sequentially form a first coating layer, a second coating layer and a third coating layer on the carbon dangling bond connection layer; and breaking the vacuum status of the chamber and taking out the coated IC chips.

Abstract: A server includes a Southbridge chipset, a USB port, a storage device, a baseboard management controller (BMC), and a switch. When the BMC is powered on and started, the BMC establishes communication between a USB device connected to the server and the BMC by uploading a driver of the USB device from the storage device to memory of the BMC. In response to receiving a firmware update command in relation to the BMC, the BMC disconnects an electrical connection between the USB port and the Southbridge chipset, and establishes an electrical connection between the USB port and the BMC using the switch. Then, the BMC reads updated firmware data from the USB device via the USB port, writes the updated firmware data into the memory, and updates the firmware of the BMC by writing the updated firmware data into the storage device.

Abstract: A chip card holder for holding a chip card is disclosed including a base member, a mounting frame and a holding member. The mounting frame is made of metal materials and secured to the base member. The holding member is used to hold the chip card and is slidably mounted within the mounting frame. When the holding member is completely received in the mounting frame, the mounting frame and the base member cooperatively enclose and preventing the chip card from electromagnetic interference.

Abstract: The present invention discloses a ceramic member and a manufacturing method thereof. The ceramic member comprises a ceramic substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the ceramic substrate by vacuum depositing, and the intermediate layer is a carbonized metal (MxCy), an oxidized metal (MxOy) or a nitride metal (MxNy). Preferably, the intermediate layer could have a concentration gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the ceramic substrate.

Abstract: The present invention discloses a method for electrical connection between two surfaces of a ceramic substrate, and the method includes the steps of forming a through hole between the two surfaces of the ceramic substrate corresponding to electrical connection points of a circuit on the ceramic substrate, and then mounting a conductive assembly inside the through hole to form a conduction path between the two surfaces of the ceramic substrate. By this means, time cost of manufacturing of ceramic substrate circuit board could be largely decreased, and the manufacturing procedures could be much simplified as well.

Abstract: The present invention discloses a metal member and a manufacturing method thereof. The metal member comprises a metal substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the metal substrate by vacuum depositing, and the intermediate layer is a carbonized metal. Preferably, the intermediate layer could have a composition gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the metal substrate.

Abstract: A method for detecting peripheral component interconnect (PCI) system errors is applied in a computing device. The computing device includes a north bridge, a baseboard management controller (BMC) connected to the north bridge, and a PCI bus connected to the north bridge. The north bridge detects a PCI system error of the PCI bus, and notifies the BMC of the PCI system error. In response to notification of the PCI system error, the BMC records error information of the PCI system error in a storage system of the computing device.

Abstract: A firmware recovery method of a baseboard management controller (BMC) of a computing device detects whether a firmware of a default firmware memory of the BMC is damaged by sending a detection command to the BMC at a regular interval. When the firmware of the default firmware memory of the BMC is damaged, the method recovers the firmware according to firmware data of a backup firmware memory of the BMC.

Abstract: A BIOS circuit for a computer includes a baseboard management controller (BMC), a central processing unit (CPU), a main basic input-output system (BIOS) storage, and a subsidiary BIOS storage. Both the main BIOS storage and the subsidiary BIOS storage store programs for controlling the computer. The CPU executes the programs stored in the main BIOS storage to control the computer. When data of the programs stored in the main BIOS storage is missing or corrupted, the BMC copies data of the programs stored in the subsidiary BIOS storage to the main BIOS storage to recover the missing or corrupted data in the main BIOS storage.

Abstract: A security-enhanced login technique that provides a convenient and easy-to-use two factor technique to enhance the security of passwords without requiring any changes on the server side of a client-server network. The technique employs a convenient and easy-to-use two-factor technique to generate strong passwords for Web and other applications. In this technique, a convenient or personal device such as a mouse is used as the other factor besides a user password. A secret stored in the mouse or other personal device is hashed together with the password entered by a user and the server ID, to generate a strong, server-specific password which is used to authenticate the user to the server. This password enhancement operation is carried out inside the personal device.

Abstract: An automatic voltage-identifying power supply device has a control module, a voltage regulation circuit, a current load measuring circuit electrically connected with an external post-stage power-receiving device, a power supply circuit and a pre-stage power supply device. After the post-stage power-receiving device is electrically connected with the current load measuring circuit, the control module can control the voltage regulation circuit to output a test voltage signal to the post-stage power-receiving device so that the test voltage signal is altered according to a preset sequence (e.g. progressively increasing) and the current load measuring circuit measures a response current signal of the post-stage power-receiving device corresponding to the test voltage signal. When a variation of the response current signal or a power variation is stable, the control module sets up the stable test voltage signal as an input voltage to the post-stage power-receiving device.

Abstract: A mobile communication device includes a main body, a cover, a slide enabling assembly. The cover is attached to the cover. The slide enabling assembly is mounted between the base and the cover, the slide enabling assembly includes a retaining board mounted to the main body, a sliding board mounted to the cover, a bracket assembly and a button. The sliding board is slidably mounted to the retaining board by the bracket assembly; when the button is pushed, the bracket assembly impels the sliding board to slide and tilt relative to the retaining board so that the cover slides and tilts relative to the main body.

Abstract: A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.

Abstract: A testing device for testing functions of a printed circuit board (PCB) includes a transfer board electrically coupled to the PCB, and a controller board electrically coupled to the transfer board and the PCB. The transfer board includes a signal bus and a controller bus. The PCB is capable of running a test program stored therein to transmit instructions to the controller board; and the controller board is capable of transmitting control signals to the transfer board according to the instructions. The transfer board is capable of switching the PCB corresponding ports on/off; and the PCB information is capable of being transmitted to the controller board via the signal bus. The controller board is capable of converting the PCB information to network information which is uploaded to the internet.

Abstract: A testing device for testing functions of a printed circuit board (PCB) includes a transfer board electrically coupled to the PCB, and a controller board electrically coupled to the transfer board and the PCB. The transfer board includes a signal bus and a controller bus. The PCB is capable of running a test program stored therein to transmit instructions to the controller board; and the controller board is capable of transmitting control signals to the transfer board according to the instructions. The transfer board is capable of switching the PCB corresponding ports on/off; and the PCB information is capable of being transmitted to the controller board via the signal bus. The controller board is capable of converting the PCB information to network information which is uploaded to the internet.

Abstract: The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium.

Abstract: A chip card holder for holding a chip card is disclosed including a base member, a mounting frame and a holding member. The mounting frame is made of metal materials and secured to the base member. The holding member is used to hold the chip card and is slidably mounted within the mounting frame. When the holding member is completely received in the mounting frame, the mounting frame and the base member cooperatively enclose and preventing the chip card from electromagnetic interference.