Patents by Inventor Hui Mei

Hui Mei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130154060
    Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Ti YEH, Wu-Chang LIN, Chung-Yi HUANG, Ya Wen WU, Hui-Mei JAO, Ting-Chun WANG, Chia-Hung CHUNG
  • Patent number: 8419805
    Abstract: A silicone liner unit used for prosthetic limbs includes a silicone liner portion, a smooth outer layer, an inner layer and an innermost layer. The silicone liner portion is made of silicone elastomer liner and has an open end. The smooth outer layer is made of Hl a-methyl-Disilane or a compound containing poly-p-xylene and may have a slightly protrusive pattern on its outer surface. The inner layer is made of fibrous tissue and is flexible. The innermost layer is disposed on top of the inner layer and is made of silicone elastomer liner to enhance the strength of the improved silicone liner unit. The smooth outer layer allows the improved silicone liner unit to be put on and taken off easily.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: April 16, 2013
    Inventor: Hui-Mei Chen
  • Publication number: 20130052294
    Abstract: A method of making a molding tool includes: preparing an imprinting master having a surface relief pattern; applying a curable material on a flexible film; embossing the curable material on the flexible film using the imprinting master so as to transfer the surface relief pattern to the curable material; curing the embossed curable material so as to form a patterned-and-cured material; attaching and conforming the flexible film to a non-planar surface of a model; forming a thin metal film over the patterned-and-cured material; electroforming a metal layer over the thin metal film so as to form a molding tool of the metal layer; and removing the molding tool from the thin metal film.
    Type: Application
    Filed: March 30, 2011
    Publication date: February 28, 2013
    Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.
    Inventors: Shaupoh Wang, Ray Long Tsai, Tung Chuan Chen, Pei Shan Hsieh, Hui Mei Chang, Shih Tsung Chang
  • Publication number: 20120194490
    Abstract: A display panel have a transmissive region and a reflective region. The display panel comprises a first plate, a second plate opposite to the first plate and a display medium. The first plate comprises a first substrate, a scan line, a data line, an active device, a common electrode, a pixel electrode and a dielectric layer. The active device is electrically connected to the scan line and the data line. The pixel electrode is electrically connected to the active device and is electrically insulated from the common electrode. The pixel electrode has slits exposing the common electrode. The dielectric layer is located between the common electrode and the pixel electrode and has first openings in the reflective region. The second plate is opposite to the first plate. The display medium is located between the first plate and the second plate.
    Type: Application
    Filed: April 7, 2011
    Publication date: August 2, 2012
    Applicant: CHUNGHWA PICTURE TUBES, LTD.
    Inventors: Jiun-Jr Huang, Chin-Hai Huang, Hui-Mei Hu
  • Publication number: 20120123560
    Abstract: A silicone liner unit used for prosthetic limbs includes a silicone liner portion, a smooth outer layer, an inner layer and an innermost layer. The silicone liner portion is made of silicone elastoomer liner and has an open end. The smooth outer layer is made of Hl a—methyl-Disilane or a compound containing poly-p-xylene and may have a slightly protrusive pattern on its outer surface. The inner layer is made of fibrous tissue and is flexible. The innermost layer is disposed on top of the inner layer and is made of silicone elastomer liner to enhance the strength of the improved silicone liner unit. The smooth outer layer allows the improved silicone liner unit to be put on and taken off easily.
    Type: Application
    Filed: November 15, 2010
    Publication date: May 17, 2012
    Inventor: Hui-Mei CHEN
  • Patent number: 8162718
    Abstract: A bra pad includes a thermoplastic polyurethane (TPU) film, a silicone gel layer and a cloth layer. The silicone gel layer is formed in a concave shape. On the edge of the silicone gel layers is attached to TPU films and the cloth layers. The silicone gel layers is semi-secured on the edge of the cloth layers to form the bar pad structure. Between the silicone gel layer and the TPU film, there is formed a first space and between the silicone gel layer and the cloth layer, there is formed a second space. The present bra pad employs the silicone gel material layer to enhance the softness and comfort. With the first and second space between the thermoplastic polyurethane (TPU) film, the silicone gel layer, and the cloth layer, the bra pad has effective breathing capability and heat-dissipating capability.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: April 24, 2012
    Inventor: Hui-Mei Chen
  • Patent number: 7887655
    Abstract: A fluid enveloping device includes a housing having a vacuum chamber; a valve for blocking off the communication of the vacuum chamber and atmospheric environment; a vacuum pump module connected to the vacuum chamber for extracting air until the vacuum chamber is close to a vacuum state; a die holder for locating a lower thin film and receiving the fluid at the lower thin film; a punch holder for locating an upper thin film; and a sealing nip in the vacuum chamber for hot-pressing the upper and the lower thin films to envelope the fluid therein.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: February 15, 2011
    Inventor: Hui-Mei Chen
  • Publication number: 20110027519
    Abstract: A pad structure is composed of a thermoplastic, an inner cloth layer, a buffering high molecular layer and an outer cloth layer. The buffering high molecular layer is enclosed with the inner cloth layer, the outer surface of the inner cloth layer is bonded to the thermoplastic which is further enclosed with the outer cloth layer. After that at least a recess slot is formed on the surface combined as such. The completed pad structure is of excellent properties of softness, slip-proof, air ventilation and heat dissipation. When the pad is bonded to the subject matter for associated use, it can improve the usability of the subject matter and make the user comfortable.
    Type: Application
    Filed: October 14, 2010
    Publication date: February 3, 2011
    Inventor: Hui-Mei CHEN
  • Patent number: 7699953
    Abstract: A method and a product of one-time enveloping silicone gel with plastic films. The surfaces of two films to be in contact with the silicone gel are treated by a plasma casing process (crosslinking by activated species of inert gases) or an electron beam process in advance so as to improve the wetting capability thereof. Thereby the films and the silicone gel are able to tightly combine together without the fear of separation. The operation is carried out under a vacuum environment so that no bubble will be generated therein and the leakage of the silicone gel on welding portions will be prevented.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: April 20, 2010
    Inventor: Hui-Mei Chen
  • Patent number: 7618304
    Abstract: A bra pad is combined selectively from thermoplastic polyurethane (TPU) films, silicone gel material or silicone gel material layers, lightweight material layers and cloth layers. The TPU films are configured for containing the silicone gel material to make the silicone gel material layer form a concave cup. A space defined in the concave cup is configured for combining the lightweight material layer. The lightweight material layer has an opposite side surface attaching to the cloth layer to form the bra pad. The present bra pad employs the silicone gel material layer to make it have excellent tactility and comfortable, and employs the lightweight material layer to decrease the weight. Furthermore, the cloth layer is configured for increase the breathe capability and the heat-dissipating capability to make the users more comfortable and no burthen when being carried for a long time or in sports.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: November 17, 2009
    Inventor: Hui-Mei Chen
  • Publication number: 20090227181
    Abstract: A bra pad includes a thermoplastic polyurethane (TPU) film, a silicone gel layer and a cloth layer. The silicone gel layer is formed in a concave shape. On the edge of the silicone gel layers is attached to TPU films and the cloth layers. The silicone gel layers is semi-secured on the edge of the cloth layers to form the bar pad structure. Between the silicone gel layer and the TPU film, there is formed a first space and between the silicone gel layer and the cloth layer, there is formed a second space. The present bra pad employs the silicone gel material layer to enhance the softness and comfort. With the first and second space between the thermoplastic polyurethane (TPU) film, the silicone gel layer, and the cloth layer, the bra pad has effective breathing capability and heat-dissipating capability.
    Type: Application
    Filed: May 18, 2009
    Publication date: September 10, 2009
    Inventor: Hui-Mei CHEN
  • Patent number: 7572676
    Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.
    Type: Grant
    Filed: April 25, 2007
    Date of Patent: August 11, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng, Jian-Shu Wu, Hui-Mei Wu, Chien-Wei Chieh
  • Patent number: 7565564
    Abstract: A switching circuit located in a computer system is disclosed in the present invention. The switching circuit comprises a first phase-locked loop generating a first host clock signal, a second phase-locked loop generating a second host clock signal and an output switch unit coupled to the first PLL and the second PLL. When the computer system operates in a first mode, the output switch unit chooses the first host clock signal to be a fundamental clock signal of the front side bus. In the other hand, when the computer system operates in a second mode, the output switch unit chooses the second host clock signal to be a fundamental clock signal of the front side bus.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: July 21, 2009
    Assignee: Via Technologies Inc.
    Inventors: Hung-Yi Kuo, Hui-Mei Chen, Weber Chuang
  • Publication number: 20090155510
    Abstract: A pad structure is made a combination selectively combined from a group consisting of a thermoplastic polyurethane (TPU) film, a silicone gel material, and a cloth layer. The TPU film is configured for containing the silicone gel material. The cloth layer is arranged out of the TPU film, and at least one scotch is designed on an upper surface thereof to form the pad structure. The pad structure of the present invention, employ the silicone gel material to have an excellent pliancy. The TPU film can contain the silicone gel material to prevent the silicone gel material from leaking. The cloth layer can enhance the skidproof capability of the pad structure. The scotch is designed to make the pad structure prone to be bent and have the excellent breathe capability, such that the pad structure can increase the value of the objects and enhance the comfort of the users when the pad structure cooperates with the other objects.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Inventor: Hui-Mei CHEN
  • Patent number: 7549073
    Abstract: By adjusting a scale factor of a phase locked loop in computers for generating a basic clock signal of a front-side bus, the frequency of the basic clock signal is modulated when the central processing unit of computers operates. By a bridge unit of the present invention, a selecting signal is received so as to output a corresponding adjustment signal to a check unit and then the check unit checks the adjustment signal for outputting a checking signal to a scale parameter adjustment unit. According to the checking signal, the scale parameter adjustment unit adjusts a first scale parameter of the scale factor that the phase locked loop uses now and outputs this parameter to the phase locked loop. Thus after receiving a fixed clock signal for generating the basic clock signal, the phase locked loop generates the basic clock signal of the front-side bus in accordance with the adjusted first scale parameter and further the frequency of the basic clock signal is adjusted.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: June 16, 2009
    Assignee: Via Technologies Inc.
    Inventors: Hung-Yi Kuo, Hui-Mei Chen
  • Publication number: 20090130952
    Abstract: A bra pad is combined selectively from thermoplastic polyurethane (TPU) films, silicone gel material or silicone gel material layers, lightweight material layers and cloth layers. The TPU films are configured for containing the silicone gel material to make the silicone gel material layer form a concave cup. A space defined in the concave cup is configured for combining the lightweight material layer. The lightweight material layer has an opposite side surface attaching to the cloth layer to form the bra pad. The present bra pad employs the silicone gel material layer to make it have excellent tactility and comfortable, and employs the lightweight material layer to decrease the weight. Furthermore, the cloth layer is configured for increase the breathe capability and the heat-dissipating capability to make the users more comfortable and no burthen when being carried for a long time or in sports.
    Type: Application
    Filed: November 19, 2007
    Publication date: May 21, 2009
    Inventor: Hui-Mei Chen
  • Publication number: 20090065122
    Abstract: An fluid enveloping device includes a housing having a vacuum chamber; a valve for blocking off the communication of the vacuum chamber and atmospheric environment; a vacuum pump module connected to the vacuum chamber for extracting air until the vacuum chamber is close to a vacuum state; a die holder for locating a lower thin film and receiving the fluid at the lower thin film; a punch holder for locating an upper thin film; and a sealing nip in the vacuum chamber for hot-pressing the upper and the lower thin films to envelope the fluid therein.
    Type: Application
    Filed: September 10, 2007
    Publication date: March 12, 2009
    Inventor: Hui-Mei Chen
  • Patent number: 7411306
    Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: August 12, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Fang-Jun Leu, Shou-Lung Chen, Ching-Wen Hsiao, Shan-Pu Yu, Jyh-Rong Lin, I-Hsuan Peng, Jian-Shu Wu, Hui-Mei Wu, Chien-Wei Chieh
  • Patent number: 7375561
    Abstract: A timing adjustment circuit and method thereof are disclosed. The timing adjustment circuit at least consists of a second timing adjustment unit, a multistage sample circuit, and a decision circuit for adjusting received timing of an output signal transmitted by a first chip and received by a second chip. The method takes advantage of the multistage sample circuit to receive a clock signal of receiving end so as to generate a plurality of sample clock signal. Later, according to the sample clock signals, sample output signals to generate a plurality of sampled signal. At last, make comparison of the sampled signals by the decision circuit in accordance with the output signals to generate a second adjustment signal being transmitted to the second timing adjustment unit for adjusting phase of a base clock to generate an adjusted receiving-end clock signal. Thus the receiving timing of the second chip to receive the output signal is adjusted.
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: May 20, 2008
    Assignee: Via Technologies Inc.
    Inventors: Hung-Yi Kuo, Hui-Mei Chen
  • Patent number: D570800
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: June 10, 2008
    Assignee: Uniband Electronic Corp.
    Inventors: Hui-Mei Chen, Wei-Hsiu Hsu, Huan-Ping Su, Chien-Hsin Su