Patents by Inventor Hui-Min Huang

Hui-Min Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Door assembly and method for a vehicle
    Patent number: 8033592
    Abstract: A door assembly for a vehicle includes an outer panel. A support panel is operatively connected to the outer panel and configured such that the support panel provides bending resistance to the outer panel when the outer panel is deflected toward the support panel during a first deflection distance of the outer panel. A cable is operatively connected in the door assembly between a first end and a second end of the outer panel such that the cable provides additional bending resistance to the outer panel when the outer panel is deflected toward the support panel during a second deflection distance of the outer panel, greater than the first deflection distance.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: October 11, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Chih-Cheng Hsu, Albert H. Butlin, John E. Carsley, Hui-Min Huang, Stephen R. Koshorek, John N. Owens
  • Door Assembly and Method for a Vehicle
    Publication number: 20100052360
    Abstract: A door assembly for a vehicle includes an outer panel. A support panel is operatively connected to the outer panel and configured such that the support panel provides bending resistance to the outer panel when the outer panel is deflected toward the support panel during a first deflection distance of the outer panel. A cable is operatively connected in the door assembly between a first end and a second end of the outer panel such that the cable provides additional bending resistance to the outer panel when the outer panel is deflected toward the support panel during a second deflection distance of the outer panel, greater than the first deflection distance.
    Type: Application
    Filed: August 27, 2008
    Publication date: March 4, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Chih-Cheng Hsu, Albert H. Butlin, John E. Carsley, Hui-Min Huang, Stephen R. Koshorek, John N. Owens
  • Polymer thick film resistor pastes
    Patent number: 6030553
    Abstract: Polymer thick film resistor pastes with dimensionally stability and excellent processibility, such as coating, printing, and extruding, are disclosed. The resistor paste composition in accordance with the present invention comprises a low-k cycloaliphatic epoxy resin vehicle loaded with electrically conductive particles, a cationic photoinitiator, a thermal catalyst, and optionally a reactive diluent.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: February 29, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Hui-min Huang, Chia-Tin Chung, Bin-Yuan Lin, Hsin-Herng Wang, Wun-Ku Wang, Te-Yeu Su, Su-Jen Chang