Patents by Inventor Hun Kang

Hun Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210299676
    Abstract: Disclosed herein is an improved method for magnetic capture of target molecules (e.g., microbes) in a fluid. Kits and solid substrates for carrying the method described herein are also provided. In some embodiments, the methods, kits, and solid substrates described herein are optimized for separation and/or detection of microbes and microbe-associated molecular pattern (MAMP) (including, e.g., but not limited to, a cell component of microbes, lipopolysaccharides (LPS), and/or endotoxin).
    Type: Application
    Filed: June 10, 2021
    Publication date: September 30, 2021
    Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Joo Hun KANG, Donald E. INGBER, Michael SUPER
  • Patent number: 11133569
    Abstract: A compact connector for transmitting super-high-frequency signals is adapted to connect a printed circuit board (PCB) to a single or multiple high-frequency signal lines transmitting super-high frequency signals therethrough. The compact connector includes: a male connector connected to the single or multiple super-high frequency signal lines and including a male connector housing receiving, securing, and protecting terminals of the single or multiple super-high frequency signal lines; and a connector socket mounted on the PCB and receiving the male connector housing fastened to the male connector, wherein the super high-frequency signal line terminals in the male connector are brought into direct contact with and connected to signal line terminal pads formed on the printed circuit board, respectively.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: September 28, 2021
    Assignee: SENSORVIEW INCORPORATED
    Inventors: Byoung Nam Kim, Kyoung Il Kang, Sung Gyu Park, Joung Min Park, Sang Woo Han, Ji Hun Kang
  • Patent number: 11121508
    Abstract: Disclosed is a coaxial cable male connector for transmitting super-high frequency signals, which is used in a coaxial cable connector for transmitting super-high frequency signals and is received in a connector socket mounted on a printed circuit board (PCB) to connect multiple coaxial cables to the PCB. The coaxial cable male connector includes: a single or multiple coaxial cables each including an inner conductor, an outer conductor, a dielectric, and a sheath, wherein the outer conductor, the dielectric, and the sheath are partially stripped to expose the inner conductor over a predetermined length, and a terminal of the exposed inner conductor is brought into electrical connect with a signal line terminal pad formed on the PCB; and a shielding can receiving the exposed inner conductors of the single or multiple coaxial cables, securing and protecting ends of the exposed inner conductors, and blocking electromagnetic waves generated from the inner conductors.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: September 14, 2021
    Assignee: SENSORVIEW INCORPORATED
    Inventors: Byoung Nam Kim, Kyoung Il Kang, Sang Woo Han, Ji Hun Kang
  • Publication number: 20210281174
    Abstract: A power provider includes: a first power source configured to receive an input voltage and to provide a first power voltage to a first output terminal; a low voltage detection circuit configured to provide a low voltage detection signal of an enable level in response to the input voltage being less than a reference low voltage, and to provide the low voltage detection signal of a disable level in response to the input voltage being greater than the reference low voltage; a first soft start circuit configured to connect the first input terminal to the first output terminal in response to a first control signal for the first power source being changed from a disable level to an enable level; and a first boost converter configured to convert the input voltage to provide the first power voltage greater than the input voltage to the first output terminal.
    Type: Application
    Filed: September 1, 2020
    Publication date: September 9, 2021
    Inventor: Kwang Hun KANG
  • Publication number: 20210280738
    Abstract: A method of fabricating a light emitting device includes (i) determining whether each measurement location is defective or not based on a measurement result of the emission wavelength of each location, (ii) forming a test stacked structure by combining one of the first wafers, one of the second wafers, and one of the third wafers in a set of wafers, and (iii) calculating a combination yield of the test stacked structure based on a count of defective measurement locations that overlap in the test stacked structure.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 9, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Ji Hoon PARK, Ji Hun KANG, Chae Hon KIM, Yong Hyun BAEK, Hyo Shik CHOI
  • Patent number: 11112410
    Abstract: The invention relates to methods of detection, capture, isolation and targeting of cancer cells for example circulating tumor cells (CTCs) using carbohydrate recognition domain of a lectin. The invention relates to methods of diagnosis, prognosis and treatment of cancer.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: September 7, 2021
    Assignee: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Joo-Hun Kang, Donald E. Ingber, Michael Super, Alexander L. Watters, Harry Scott Driscoll
  • Publication number: 20210273385
    Abstract: A connector assembly includes a first signal pin formed to be in contact with a signal line of a circuit board; a first insulator surrounding the first signal pin; and a first housing accommodating the first signal pin and the first insulator and having a hole at a rear thereof corresponding to the first signal pin, wherein the first housing includes at least one clamping arm disposed on at least one side of the hole, protruding to a rear of the first housing, and having a lower surface formed to be in contact with an upper surface of the circuit board and the connector assembly further includes a ground plate disposed below the clamping arm and having an upper surface formed to be in contact with a lower surface of the circuit board; a clamping plate movably disposed below the ground plate; and a fastening member.
    Type: Application
    Filed: February 18, 2021
    Publication date: September 2, 2021
    Inventors: Byoung Nam KIM, Kyoung Il KANG, Dong Il YIM, Sung Cheol CHO, Ji Hun KANG
  • Publication number: 20210242371
    Abstract: A light emitting diode includes an n-type nitride semiconductor layer, a V-pit generation layer located over the n-type nitride semiconductor layer and having a V-pit, an active layer located on the V-pit generation layer, and a p-type nitride semiconductor layer located on the active layer. The active layer includes a well layer, which includes a first well layer portion formed along a flat surface of the V-pit generation layer and a second well layer portion formed in the V-pit of the V-pit generation layer. The light emitting diode emits light having at least two peak wavelengths at a single chip level.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 5, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Yong Hyun BAEK, Ji Hun KANG, Chae Hon KIM, Ji Hoon PARK
  • Patent number: 11066730
    Abstract: According to one embodiment of the present invention, a cast alloy material is provided. The cast alloy material includes a matrix metal and an alloy element, wherein oxide particles in a nanometer scale are decomposed in the matrix metal, so that a new phase including a metal element that is a component of the oxide particles and the alloy element forms a band or network structure, wherein the metal element and the alloy element have a relationship of a negative heat of mixing, and wherein oxygen atoms formed by decomposition of the oxide particles are dispersed in the matrix metal and do not form an oxide with the matrix metal.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: July 20, 2021
    Assignee: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Dong Hyun Bae, Hun Kang
  • Patent number: 11059050
    Abstract: Disclosed herein is an improved method for magnetic capture of target molecules (e.g., microbes) in a fluid. Kits and solid substrates for carrying the method described herein are also provided. In some embodiments, the methods, kits, and solid substrates described herein are optimized for separation and/or detection of microbes and microbe-associated molecular pattern (MAMP) (including, e.g., but not limited to, a cell component of microbes, lipopolysaccharides (LPS), and/or endotoxin).
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: July 13, 2021
    Assignee: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Joo Hun Kang, Donald E. Ingber, Michael Super
  • Patent number: 11048025
    Abstract: The present disclosure discloses an anti-reflection coating and a method of forming the same. According to one embodiment of the present disclosure, the anti-reflection coating includes a first layer positioned on a substrate to be spaced apart from the substrate by a first distance and a second layer positioned on the first layer to be spaced apart from the first layer by a second distance. In this case, the first and second layers are a metamaterial forming a structural double layer and are realized as an anomalous dispersive medium that does not absorb incident light. The structural double layer may realize spatiotemporal dispersion that varies depending on an incidence angle using the nonlocality of the electromagnetic wave reaction of incident light.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: June 29, 2021
    Assignee: Korea University Research and Business Foundation
    Inventors: Q Han Park, Ku Im, Ji Hun Kang
  • Publication number: 20210190370
    Abstract: The present disclosure relates to an air conditioner capable of inducing airflow blown through a blowing port to blow in a substantially horizontal direction. The air conditioner includes a housing including a blowing port, and an airflow guide unit installed in the blowing port to be rotatable about a rotation shaft, wherein the airflow guide unit includes a main blade configured to cover the blowing port, and a pair of sub blades spaced downwardly apart from the main blade and disposed in a flow passage of the blowing port such that outer surfaces thereof are in contact with airflow in the blowing port as a whole, and having different inclination angles.
    Type: Application
    Filed: October 15, 2018
    Publication date: June 24, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Hun KANG, Jin Baek KIM, Seong Hyun YOON, Eung Ryeol SEO
  • Publication number: 20210180482
    Abstract: A method of operating a relief valve assembly for an oil pump includes unblocking a first bypass inlet passage and blocking a first bypass outlet passage, a second bypass inlet passage, and a second bypass outlet passage with a plunger, introducing oil to the relief valve assembly, moving the plunger in a downward direction by a first displacement to unblock the first bypass outlet passage, starting a first bypass of the oil, moving the plunger in the downward direction by a second displacement to block the first bypass inlet passage and unblock the second bypass inlet passage, terminating the first bypass of the oil, moving the plunger in the downward direction by a third displacement to unblock the second bypass outlet passage, and starting a second bypass of the oil.
    Type: Application
    Filed: May 28, 2020
    Publication date: June 17, 2021
    Inventors: Dong-Hun Kang, Tae-Gyun Kim
  • Publication number: 20210164068
    Abstract: The purpose of the present invention is to provide a steel material and a manufacturing method for the same, wherein the steel material has excellent strength, elongation, and impact toughness as well as excellent inside quality and wear resistance. According to the present invention, provided are a steel material having excellent wear resistance and a manufacturing method for the same, wherein. the steel material contains, in weight, 0.55-1.4% carbon (C), 12-23% manganese (Mn), 5% or less (excluding 0%) chromium (Cr), 5% or less (excluding 0%) copper (Cu), 0.5% or less (excluding 0%) Al, 1.0% or less (excluding 0%) Si, 0.02% or less (including 0%) S, 0.04% or less (including 0%) phosphor (P), and the balance Fe and unavoidable impurities, and has a microstructure comprising, in area, 10% or less (including 0%) carbide and the balance austenite.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 3, 2021
    Inventors: Yong-Jin KIM, Young-Deok JUNG, Myeong-Hun KANG, Yeo-Sun YUN, Soo-Gil PARK
  • Publication number: 20210154648
    Abstract: The present disclosure is directed to novel germanosilicate compositions and methods of producing the same. In particular, this disclosure describes new silica-rich compositions of the germanosilicate designated CIT-13, with and without added metal oxides. The disclosure also describes methods of preparing and using these new germanosilicate compositions as well as the compositions themselves.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 27, 2021
    Inventors: Joel E. Schmidt, Mark E. Davis, Ben W. Boal, Jong Hun Kang
  • Publication number: 20210154649
    Abstract: The present disclosure is directed to novel phyllosilicate compositions designated CIT-13P and methods of producing and using the same.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 27, 2021
    Inventors: Joel E. Schmidt, Mark E. Davis, Ben W. Boal, Jong Hun Kang
  • Publication number: 20210159021
    Abstract: A tantalum capacitor includes: a tantalum body including tantalum, and having a tantalum wire in which a distance from a lower surface of the tantalum body is closer than a distance from an upper surface of the tantalum body; an insulating member on which the tantalum body is disposed; an encapsulation portion; an anode terminal including an upper anode and connected to the tantalum wire, a lower anode pattern, and an anode connection portion connecting the upper anode pattern and the lower anode pattern; and a cathode terminal including an upper cathode pattern and connected to the tantalum body, a lower cathode pattern disposed on a lower surface of the insulating member to be spaced apart from the lower anode pattern, and a cathode connection portion connecting the upper cathode pattern and the lower cathode pattern.
    Type: Application
    Filed: May 22, 2020
    Publication date: May 27, 2021
    Inventors: Hun Chol JUNG, Wan Suk YANG, Tae Hun KANG, Yeong Su CHO
  • Publication number: 20210142946
    Abstract: A semiconductor device includes: a first electrode; a second electrode; and a multi-layered stack including a hafnium oxide layer of a tetragonal crystal structure which is positioned between the first electrode and the second electrode, wherein the multi-layered stack includes: a seed layer for promoting tetragonal crystallization of the hafnium oxide layer and having a tetragonal crystal structure; and a booster layer for boosting a dielectric constant of the hafnium oxide layer.
    Type: Application
    Filed: May 4, 2020
    Publication date: May 13, 2021
    Inventors: Se-Hun KANG, Han-Joon KIM, Ki-Vin IM
  • Publication number: 20210134567
    Abstract: An apparatus for treating a substrate includes a housing having a process space inside and having an exhaust hole formed through the housing, a support unit that supports the substrate in the process space, and an exhaust unit that is provided at the bottom of the housing and that exhausts the process space. The exhaust unit includes a body having a buffer space inside and having a through-hole formed through the body, the buffer space connecting to the process space, and an exhaust pipe that discharges gas in the buffer space. The support unit includes a support plate that supports the substrate in the process space and a support shaft connected with the support plate and inserted into the through-hole and the exhaust hole, the support shaft having a smaller diameter than the through-hole.
    Type: Application
    Filed: December 3, 2019
    Publication date: May 6, 2021
    Inventors: Kwang Sung Yoo, Jung Hyun Kang, Seong Hun Kang
  • Publication number: 20210129120
    Abstract: The present disclosure is directed to novel germanosilicate compositions and methods of producing and using the same. In particular, this disclosure describes new germanosilicates of CIT-14 topology. The disclosure also describes methods of preparing and using these new germanosilicate compositions as well as the compositions themselves.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 6, 2021
    Inventors: Joel E. Schmidt, Mark E. Davis, Ben W. Boal, Jong Hun Kang, Dan Xie