Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.

Abstract: Techniques for secure boot up of unified extensible firmware interface (UEFI) compliant devices are described. In an example, execution of a driver associated with a hardware component of a computing device may be detected during booting of the computing device. Based on the detection, a first driver hash of a system table of the UEFI may be computed, where the system table is a data structure that stores configuration details of the computing device and UEFI services. Thereafter, a second driver hash of the system table may be computed based on detection of completion of the execution of the driver. The first driver hash and the second driver hash may then be compared to determine tampering with the system table of the UEFI.

Abstract: A method for forming a semiconductor memory structure includes forming an MTJ stack over a substrate. The method also includes etching the MTJ stack to form an MTJ device. The method also includes depositing a metal layer over a top surface and sidewalls of the MTJ device. The method also includes oxidizing the metal layer to form an oxidized metal layer. The method also includes depositing a cap layer over the oxidized metal layer. The method also includes oxidizing the cap layer to form an oxidized cap layer. The method also includes removing an un-oxidized portion of the cap layer.

Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element and a second movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and when viewed along the main axis, a portion of the first movable element overlaps the second movable element.

Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining smoothness of the waveform segments; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the waveform segments, and generating a detection result.

Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining systolic peaks for determining first and second portions of the waveform segments; determining smoothness of the second portions; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the second portions, and generating a detection result.

Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element. The first drive assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and the first driving assembly is configured to drive the first movable element to move around the main axis.

Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element and a second movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and the first driving assembly is configured to drive the second movable element to move along a first axis, thereby driving the first movable element to move around the main axis.

Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to at least two first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element. The first drive assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, the first driving assembly is configured to drive the first movable element to move around the main axis, and a portion of the first driving assembly is disposed on the first movable element.

Abstract: An optical system includes a first optical element driving mechanism, including a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to at least two first optical elements. The first movable assembly includes a first movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis. The first driving assembly is configured to drive the first movable element to move around the main axis. A portion of the first driving assembly is disposed on the first movable element. When viewed in a direction perpendicular to the main axis, the first driving assembly exceeds the first fixed assembly and the first movable assembly.

Abstract: A method for detecting a location of a segment of a feeding tube is provided. The feeding tube has a proximal end, a hollow tube body and a distal end, and is placed inside the body of a patient. An audio collecting component is placed on a predetermined part of the patient. The method includes steps of pumping air into the proximal end of the feeding tube, collecting sound to obtain audio data by the audio collecting component, performing audio analysis on the audio data, and determining whether a segment of the hollow tube body is at a part inside the body of the patient that corresponds with the location of the audio collecting component based on result of the audio analysis.

Abstract: A method and semiconductor device including a substrate having one or more semiconductor devices. In some embodiments, the device further includes a first passivation layer disposed over the one or more semiconductor devices. The device may further include a metal-insulator-metal (MIM) capacitor structure formed over the first passivation layer. In addition, the device may further include a second passivation layer disposed over the MIM capacitor structure. In various examples, a stress-reduction feature is embedded within the second passivation layer. In some embodiments, the stress-reduction feature includes a first nitrogen-containing layer, an oxygen-containing layer disposed over the first nitrogen-containing layer, and a second nitrogen-containing layer disposed over the oxygen containing layer.

Abstract: A method and semiconductor device including a substrate having one or more semiconductor devices. In some embodiments, the device further includes a first passivation layer disposed over the one or more semiconductor devices. The device may further include a metal-insulator-metal (MIM) capacitor structure formed over the first passivation layer. In addition, the device may further include a second passivation layer disposed over the MIM capacitor structure. In various examples, a stress-reduction feature is embedded within the second passivation layer. In some embodiments, the stress-reduction feature includes a first nitrogen-containing layer, an oxygen-containing layer disposed over the first nitrogen-containing layer, and a second nitrogen-containing layer disposed over the oxygen containing layer.

Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: A substrate structure having a cold sprayed layer and a method for manufacturing the same are provided. The substrate structure having the cold sprayed layer includes a base layer and the cold sprayed layer. The cold sprayed layer is formed on a predetermined area of the base layer by spraying and dissolving. An included angle is formed between at least one side surface of the cold sprayed layer and the base layer.

Abstract: An electronic device includes: a display panel and a host. The host is electrically connected to the display panel, and includes a processing unit and a graphics processing unit. The processing unit executes a driver program of the graphics processing unit and a specific program to render a display image of the specific program, wherein the display image includes a user interface. The processing unit obtains position information about a static area of the user interface. In response to the processing unit obtaining the position information about the static area of the user interface, the graphics processing unit performs a burn-in-prevention process on the static area via the driver program to generate an output image, and transmits the output image to the display panel for displaying.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, a driving assembly, a circuit assembly, and a connecting element. The movable part is for connecting an optical element. The fixed part includes an outer frame and a base, wherein the movable part is movable relative to the fixed part. The driving assembly is for generating a driving force to drive the movable part to move relative to the fixed part. The circuit assembly is for connecting to an external circuit. The circuit assembly includes a first terminal. The outer frame is fixedly connected to the base via the connecting element.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, and a driving assembly. The movable part is for connecting the optical element. The movable part is movable relative to the fixed part. The driving assembly is used for generating a driving force to drive the movable part to move relative to the fixed part. The driving assembly further includes a first reinforcement element, for strengthening the driving force.

Abstract: The present disclosure is directed to a method of fabrication a semiconductor structure. The method includes providing a substrate and forming a bottom electrode over the substrate, wherein a terminal end of the bottom electrode has a tapered sidewall. The method also includes depositing an insulating layer over the bottom electrode and forming a top electrode over the insulating layer, wherein a terminal end of the top electrode has a vertical sidewall.

Abstract: Methods of forming a 3-dimensional metal-insulator-metal super high density (3D-MIM-SHD) capacitor and semiconductor device are disclosed herein. A method includes depositing a base layer of a first dielectric material over a semiconductor substrate and etching a series of recesses in the base layer. Once the series of recesses have been etched into the base layer, a series of conductive layers and dielectric layers may be deposited within the series of recesses to form a three dimensional corrugated stack of conductive layers separated by the dielectric layers. A first contact plug may be formed through a middle conductive layer of the corrugated stack and a second contact plug may be formed through a top conductive layer and a bottom conductive layer of the corrugated stack. The contact plugs electrically couple the conductive layers to one or more active devices of the semiconductor substrate.