Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.

Abstract: An eye-bolt assembly includes an eye bolt and a base portion. The eye bolt includes a ring portion, a stem portion, and at least one winged extension. The ring portion is attached a first end of the stem portion. The at least one winged extension is attached to a second end of the stem portion. The base portion receives and securely locks the eye bolt therein. The base portion includes a collar and a platform secured to the collar. The collar forms a first aperture therein. The platform forms a second aperture therein. The platform includes a spring being located at least partially within the second aperture. A first end of the spring is attached to the platform. The second aperture formed in the platform is in spaced communication with the first aperture formed in the collar.

Abstract: Various schemes pertaining to generating a full-frame color image using a hybrid sensor are described. An apparatus receives sensor data from the hybrid sensor, wherein the sensor data includes partial-frame chromatic data of a plurality of chromatic channels and partial-frame color-insensitive data. The apparatus subsequently generates full-frame color-insensitive data based on the partial-frame color-insensitive data. The apparatus subsequently generates the full-frame color image based on the full-frame color-insensitive data and the partial-frame chromatic data. The apparatus provides benefits of enhancing image quality of the full-frame color image especially under low light conditions.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.

Abstract: A method for high dynamic range imaging is provided. The method includes the following stages. A first image from a first sensor capable of sensing a first spectrum is received. A second image from a second sensor capable of sensing a second spectrum is received. The second spectrum has a higher wavelength range as compared to the first spectrum. A first image feature from the first image and a second image feature from the second image are retrieved. The first and second images are fused by referencing the first image feature and the second image feature to generate a final image.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: A Bluetooth communication system is provided, which comprises a Bluetooth host device and a Bluetooth device set. The connections between the Bluetooth host device and the Bluetooth device set complies with the specification of Bluetooth Low Energy Audio technology. The Bluetooth device set comprises at least a first member device and a second member device. The first member device and the second member device may be configured in a first mode wherein uplink audio signal transmission is allowed, and the connections are carried out by isochronous streaming channels respectively. The first member device transmits captured voice data to the Bluetooth host device, while the second member device does not. When an event is triggered, the first member device can notify the second member device through direct wireless connection, so that the first member device and the second member device can carry out subsequent voice input handover procedures.

Abstract: A Bluetooth communication system is provided, which comprises a Bluetooth host device and a Bluetooth device set. The connections between the Bluetooth host device and the Bluetooth device set complies with the specification of Bluetooth Low Energy Audio technology. The Bluetooth device set comprises at least a first member device and a second member device. The first member device and the second member device may be configured in a first mode and a second mode respectively, and the connections are carried out by isochronous streaming channels. The first member device transmits captured voice data to the Bluetooth main control device, while the second member device does not. When an event is triggered, the first member device can notify the second member device through the Bluetooth host device, so that the first member device and the second member device can carry out subsequent voice input handover procedures.

Abstract: Cable release devices and methods are disclosed. The device includes a frame defining an aperture. The frame is sized to fit around a connector on a printed circuit board (PCB) within a computer system with the connector extending into the aperture. The device further includes a post extending from the frame. The device further includes a lever connected to the post. The lever includes a first end positioned such that the first end aligns with a latch of a cable when the cable is connected to the connector and when the frame is around the connector such that actuation of the lever causes the lever to depress the latch. The actuation causes the release of the cable from being retained by the connector.

Abstract: A keyboard device with a display panel including a base, a scissors feet assembly movably disposed on the base, an elastic member disposed on the base, a display panel supported by the scissors feet assembly and the elastic member, and multiple light transmittance keycaps disposed on the display panel is provided. The display panel has multiple display surfaces, multiple hollow portions, and multiple elastic portions. Each of the display surfaces is surrounded by the hollow portions, and is suspended between the hollow portions by the elastic portions. The light transmittance keycaps respectively and correspondingly cover the display surfaces.

Abstract: An image calibration method is applied to an image calibration device includes an image receiver and an operation processor. The image calibration method of providing a motion deblur function includes driving a first camera to capture a first image having a first exposure time, driving a second camera disposed adjacent to the first camera to capture a second image having a second exposure time different from and at least partly overlapped with the first exposure time, and fusing a first feature of the first image and a second feature of the second image to generate a fusion image.

Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.

Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.

Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.

Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.

Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.

Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.