Patents by Inventor Hung-Cheng Chen
Hung-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250040075Abstract: A computing device include a chassis, a mounting ear, a lever, and a locking unit. The chassis holds one or more electronic devices and is insertable into a rack, such as a server rack. The mounting ear is coupled to the chassis. The lever is rotatably coupled to the mounting ear and is rotatable between a first position and a second position. In the first position, the lever engages the rack to prevent the chassis from being removed. In the second position, the lever disengages the rack and allows the chassis to be removed. The locking unit is coupled to the mounting ear and transitions between locked and unlocked states. In the locked state, the locking unit secures the lever in the first position. In the unlocked state, the lever is movable from the first position to the second position.Type: ApplicationFiled: October 30, 2023Publication date: January 30, 2025Inventors: Yaw-Tzorng TSORNG, Ming-Lung WANG, Hung-Wei CHEN, Yu-Cheng CHANG, Pei-Jung HSIEH
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Publication number: 20240414887Abstract: A temperature adjustment module is provided. The temperature adjustment module includes a temperature changing module and a temperature control module. The temperature changing module includes a temperature changing area. The temperature changing module is in contact with a peripheral circuit element on a motherboard through the temperature changing area and a heat conduction material. The temperature control module is electrically connected to the temperature changing module and configured to control a temperature of the temperature changing module to reach a target temperature. The temperature changing module further includes a printed circuit board in the temperature changing area, and the temperature of the temperature changing module is changed by at least one of a winding wire or an electronic component on the printed circuit board.Type: ApplicationFiled: February 27, 2024Publication date: December 12, 2024Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Chih-Hua Ke, Hung-Cheng Chen, Tse-Hsien Liao, Ching-Yi Chang
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Publication number: 20240414834Abstract: A temperature adjustment module and a temperature adjustment method are provided. The temperature adjustment module includes a temperature control module, a temperature changing module, and a temperature sensor. The temperature changing module is in contact with a peripheral circuit element and electrically connected to the temperature control module. The temperature sensor is in contact with the peripheral circuit element and electrically connected to the temperature control module. When a cool down module on a main circuit element of a mother board cools down the main circuit element, the temperature sensor detects a peripheral temperature of the peripheral circuit element. The temperature control module determines whether the peripheral temperature is lower than or higher than a target temperature to determine whether to operate the temperature changing module to perform temperature adjustment on the peripheral circuit element.Type: ApplicationFiled: February 27, 2024Publication date: December 12, 2024Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Chih-Hua Ke, Hung-Cheng Chen, Tse-Hsien Liao, Ching-Yi Chang
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Publication number: 20240145436Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.Type: ApplicationFiled: December 29, 2023Publication date: May 2, 2024Inventors: Hung Cheng Chen, Yu Chun Chen, Hsuan Chao Hou
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Patent number: 11862607Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.Type: GrantFiled: August 16, 2021Date of Patent: January 2, 2024Assignee: Micron Technology, Inc.Inventors: Hung Cheng Chen, Yu Chun Chen, Hsuan Chao Hou
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Patent number: 11649543Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.Type: GrantFiled: February 8, 2022Date of Patent: May 16, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ping-Yuan Chen, Hung-Cheng Chen, Chih-Hsuan Hsieh, Yu-Hsuan Wang
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Patent number: 11612050Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.Type: GrantFiled: December 7, 2020Date of Patent: March 21, 2023Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20230047231Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.Type: ApplicationFiled: August 16, 2021Publication date: February 16, 2023Inventors: Hung Cheng Chen, Yu Chun Chen, Hsuan Chao Hou
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Patent number: 11426793Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.Type: GrantFiled: December 3, 2018Date of Patent: August 30, 2022Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
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Publication number: 20220162744Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.Type: ApplicationFiled: February 8, 2022Publication date: May 26, 2022Applicant: Taiwa Semiconductor Manufacturing Co, Ltd.Inventors: Ping-Yuan CHEN, Hung-Cheng CHEN, Chih-Hsuan HSIEH, Yu-Hsuan WANG
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Patent number: 11268186Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.Type: GrantFiled: July 17, 2020Date of Patent: March 8, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ping-Yuan Chen, Hung-Cheng Chen, Chih-Hsuan Hsieh, Yu-Hsuan Wang
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Patent number: 11262914Abstract: A solid-state drive and a performance optimization method for the solid-state drive are provided. The performance optimization method for the solid-state drive includes the following steps: detecting a queue depth of the solid-state drive to determine a use proportion of the queue depth; determining whether an access speed of the solid-state drive is raisable when the use proportion of the queue depth is higher than a first threshold proportion, so as to raise the access speed of the solid-state drive; and determining whether the access speed of the solid-state drive is reduceable when the use proportion of the queue depth is lower than a second threshold proportion, so as to reduce the access speed of the solid-state drive.Type: GrantFiled: April 29, 2020Date of Patent: March 1, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 11226863Abstract: A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.Type: GrantFiled: December 13, 2020Date of Patent: January 18, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 11216649Abstract: A display device capable of automatically adjusting displayed image comprises a display device, a camera assembly, an image recognition device and a signal processor. The display device including a shell and a display panel partially exposed from the shell, wherein the display panel faces a first direction. The camera assembly obtains a first image with a first visual angle and obtain a second image with a second visual angle. The image recognition device generates a first instruction when the first image meets a first condition and generates a second instruction when the second image meets a second condition. The signal processor adjusts the display signal to conceal the displayed image according to the first instruction and to adjust the display signal to generate a reminder message on the displayed image according to the second instruction.Type: GrantFiled: April 20, 2020Date of Patent: January 4, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsine Liao, Chin Hui Chen, Chih-Hua Ke
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Patent number: 11157048Abstract: A memory module with a screen includes a memory substrate, a power conversion module, a screen control module, and a screen. The memory substrate includes a plurality of memory components and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is disposed on the memory substrate and electrically connected to the connection interface and the power conversion module. The screen is disposed on the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module to receive a voltage output from the power conversion module and a display signal output from the screen control module. A motherboard module including a memory module with a screen is also provided.Type: GrantFiled: September 3, 2019Date of Patent: October 26, 2021Assignee: GAGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chen-Te Hsu
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Publication number: 20210303402Abstract: A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.Type: ApplicationFiled: December 13, 2020Publication date: September 30, 2021Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 11134553Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.Type: GrantFiled: April 23, 2020Date of Patent: September 28, 2021Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20210274640Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.Type: ApplicationFiled: December 7, 2020Publication date: September 2, 2021Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 10869384Abstract: A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.Type: GrantFiled: March 5, 2020Date of Patent: December 15, 2020Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20200383191Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.Type: ApplicationFiled: April 23, 2020Publication date: December 3, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao