Patents by Inventor Hung-Cheng Chen
Hung-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11262914Abstract: A solid-state drive and a performance optimization method for the solid-state drive are provided. The performance optimization method for the solid-state drive includes the following steps: detecting a queue depth of the solid-state drive to determine a use proportion of the queue depth; determining whether an access speed of the solid-state drive is raisable when the use proportion of the queue depth is higher than a first threshold proportion, so as to raise the access speed of the solid-state drive; and determining whether the access speed of the solid-state drive is reduceable when the use proportion of the queue depth is lower than a second threshold proportion, so as to reduce the access speed of the solid-state drive.Type: GrantFiled: April 29, 2020Date of Patent: March 1, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 11226863Abstract: A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.Type: GrantFiled: December 13, 2020Date of Patent: January 18, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 11216649Abstract: A display device capable of automatically adjusting displayed image comprises a display device, a camera assembly, an image recognition device and a signal processor. The display device including a shell and a display panel partially exposed from the shell, wherein the display panel faces a first direction. The camera assembly obtains a first image with a first visual angle and obtain a second image with a second visual angle. The image recognition device generates a first instruction when the first image meets a first condition and generates a second instruction when the second image meets a second condition. The signal processor adjusts the display signal to conceal the displayed image according to the first instruction and to adjust the display signal to generate a reminder message on the displayed image according to the second instruction.Type: GrantFiled: April 20, 2020Date of Patent: January 4, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsine Liao, Chin Hui Chen, Chih-Hua Ke
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Patent number: 11157048Abstract: A memory module with a screen includes a memory substrate, a power conversion module, a screen control module, and a screen. The memory substrate includes a plurality of memory components and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is disposed on the memory substrate and electrically connected to the connection interface and the power conversion module. The screen is disposed on the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module to receive a voltage output from the power conversion module and a display signal output from the screen control module. A motherboard module including a memory module with a screen is also provided.Type: GrantFiled: September 3, 2019Date of Patent: October 26, 2021Assignee: GAGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chen-Te Hsu
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Publication number: 20210303402Abstract: A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.Type: ApplicationFiled: December 13, 2020Publication date: September 30, 2021Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 11134553Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.Type: GrantFiled: April 23, 2020Date of Patent: September 28, 2021Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20210274640Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.Type: ApplicationFiled: December 7, 2020Publication date: September 2, 2021Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 10869384Abstract: A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.Type: GrantFiled: March 5, 2020Date of Patent: December 15, 2020Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20200383191Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.Type: ApplicationFiled: April 23, 2020Publication date: December 3, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20200356763Abstract: A display device capable of automatically adjusting displayed image comprises a display device, a camera assembly, an image recognition device and a signal processor. The display device including a shell and a display panel partially exposed from the shell, wherein the display panel faces a first direction. The camera assembly obtains a first image with a first visual angle and obtain a second image with a second visual angle. The image recognition device generates a first instruction when the first image meets a first condition and generates a second instruction when the second image meets a second condition. The signal processor adjusts the display signal to conceal the displayed image according to the first instruction and to adjust the display signal to generate a reminder message on the displayed image according to the second instruction.Type: ApplicationFiled: April 20, 2020Publication date: November 12, 2020Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng CHEN, Tse-Hsine LIAO, Chin Hui CHEN, Chih-Hua KE
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Publication number: 20200356279Abstract: A solid-state drive and a performance optimization method for the solid-state drive are provided. The performance optimization method for the solid-state drive includes the following steps: detecting a queue depth of the solid-state drive to determine a use proportion of the queue depth; determining whether an access speed of the solid-state drive is raisable when the use proportion of the queue depth is higher than a first threshold proportion, so as to raise the access speed of the solid-state drive; and determining whether the access speed of the solid-state drive is reduceable when the use proportion of the queue depth is lower than a second threshold proportion, so as to reduce the access speed of the solid-state drive.Type: ApplicationFiled: April 29, 2020Publication date: November 12, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Publication number: 20200347491Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.Type: ApplicationFiled: July 17, 2020Publication date: November 5, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ping-Yuan CHEN, Hung-Cheng CHEN, Chih-Hsua HSIEH, Yu-Hsuan WANG
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Patent number: 10827645Abstract: A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.Type: GrantFiled: July 23, 2019Date of Patent: November 3, 2020Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chih-Hua Ke
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Publication number: 20200296819Abstract: A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.Type: ApplicationFiled: March 5, 2020Publication date: September 17, 2020Inventors: Hung-Cheng Chen, Tse-Hsien Liao
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Patent number: 10718048Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.Type: GrantFiled: January 29, 2018Date of Patent: July 21, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ping-Yuan Chen, Hung-Cheng Chen, Chih-Hsua Hsieh, Yu-Hsuan Wang
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Publication number: 20200174532Abstract: A memory module with a screen includes a memory substrate, a power conversion module, a screen control module, and a screen. The memory substrate includes a plurality of memory components and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is disposed on the memory substrate and electrically connected to the connection interface and the power conversion module. The screen is disposed on the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module to receive a voltage output from the power conversion module and a display signal output from the screen control module. A motherboard module including a memory module with a screen is also provided.Type: ApplicationFiled: September 3, 2019Publication date: June 4, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chen-Te Hsu
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Publication number: 20200171578Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
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Patent number: 10645785Abstract: An illumination dummy module is adapted for covering and protecting a card slot and includes a circuit board, a power pin, a clock pin, a data pin, at least one light source, a power converter, and a drive circuit. The circuit board includes an insertion part for inserting into the card slot. The power pin, the clock pin and the data pin are disposed to the insertion part, and the light source is disposed on the circuit board. The power converter receives input power from the card slot via the power pin, and converts the input power into output power. The drive circuit is disposed on the circuit board, and receives the output power from the power converter. The drive circuit also respectively receives a clock signal and a control command via the clock pin and the data pin, to enable or disable the light source.Type: GrantFiled: September 3, 2018Date of Patent: May 5, 2020Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chen-Te Hsu
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Publication number: 20200117248Abstract: An external electrical connector includes a carrier and a plurality of pins disposed on the carrier. The pins support at least two kinds of PCI-E, USB, HDMI, and DP interfaces, and a part of the pins are selectively transmitting at least two kinds of PCI-E, USB, HDMI, and DP signals. A computer system is further provided.Type: ApplicationFiled: August 7, 2019Publication date: April 16, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chih-Hua Ke
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Publication number: 20200053910Abstract: A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.Type: ApplicationFiled: July 23, 2019Publication date: February 13, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chih-Hua Ke