Patents by Inventor Hung Chih Chen
Hung Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11577361Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: GrantFiled: February 1, 2022Date of Patent: February 14, 2023Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Publication number: 20230042448Abstract: The disclosure provides a method for or the early diagnosis, prognosis and differentiation of myocardial infarction (MI). The method comprises performing genetic analysis on gut microbiota. The disclosure also provides a biomarker and kit for the early diagnosis, prognosis, recurrence and differentiation of MI.Type: ApplicationFiled: June 14, 2022Publication date: February 9, 2023Inventors: Patrick CH HSIEH, Hung-Chih CHEN
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Publication number: 20220302054Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.Type: ApplicationFiled: March 19, 2021Publication date: September 22, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung-Chih Chen
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Publication number: 20220152778Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: ApplicationFiled: February 1, 2022Publication date: May 19, 2022Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 11260500Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: GrantFiled: September 3, 2020Date of Patent: March 1, 2022Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 11173579Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: GrantFiled: June 25, 2018Date of Patent: November 16, 2021Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Patent number: 11072049Abstract: Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.Type: GrantFiled: October 16, 2018Date of Patent: July 27, 2021Assignee: Applied Materials, Inc.Inventor: Hung Chih Chen
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Publication number: 20200398399Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: ApplicationFiled: September 3, 2020Publication date: December 24, 2020Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 10766117Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: GrantFiled: February 28, 2018Date of Patent: September 8, 2020Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Patent number: 10702971Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.Type: GrantFiled: September 13, 2016Date of Patent: July 7, 2020Assignee: Applied Materials, Inc.Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
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Patent number: 10602362Abstract: A gateway, a gateway setup method, and an IoT device setup method are provided. The gateway setup method includes to detect received signal strength indicator (RSSI) between a user device and a gateway to determine whether a distance between the two devices is less than a distance threshold. If yes, authentication information is exchanged between the gateway and the user device so that the gateway is able to connect to the server through an access point and the user device is able to connect to the server and the gateway. The IoT device setup method includes to detect RSSI between an IoT device and the gateway device to determine whether a distance between the two devices is less than a distance threshold. If yes, authentication information is exchanged between the gateway and the IoT device so that the two devices are able to connect to each other.Type: GrantFiled: August 29, 2017Date of Patent: March 24, 2020Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Hung-Chih Chen, Tzu-Hao Tsao, Kai-Ho Hsiung
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Patent number: 10226853Abstract: A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.Type: GrantFiled: March 13, 2013Date of Patent: March 12, 2019Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Hung Chih Chen
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Patent number: 10207389Abstract: A polishing pad includes and upper portion and one or more lower portions. The upper portion has an upper surface for attachment to a pad carrier and a first lateral dimension. The one or more lower portions project downward from the upper portion. A bottom surface of the one or more lower portions provide a contact surface to contact a substrate during chemical mechanical polishing. Each lower portion has a second lateral dimension that is less than the first lateral dimension. A total surface area of the contact surface from the one or more lower portions is no more than 10% of a surface area of the upper surface.Type: GrantFiled: August 20, 2014Date of Patent: February 19, 2019Assignee: Applied Materials, Inc.Inventor: Hung Chih Chen
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Publication number: 20190047110Abstract: Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.Type: ApplicationFiled: October 16, 2018Publication date: February 14, 2019Inventor: Hung Chih Chen
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Publication number: 20180304441Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Patent number: 10105812Abstract: Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.Type: GrantFiled: July 16, 2015Date of Patent: October 23, 2018Assignee: Applied Materials, Inc.Inventor: Hung Chih Chen
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Patent number: 10076817Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.Type: GrantFiled: July 17, 2014Date of Patent: September 18, 2018Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Paul D. Butterfield, Jay Gurusamy, Jason Garcheung Fung, Shou-Sung Chang, Jimin Zhang, Eric Lau
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Patent number: 10022837Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: GrantFiled: December 3, 2015Date of Patent: July 17, 2018Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Publication number: 20180185979Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: ApplicationFiled: February 28, 2018Publication date: July 5, 2018Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
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Publication number: 20180184298Abstract: A gateway, a gateway setup method, and an IoT device setup method are provided. The gateway setup method includes to detect received signal strength indicator (RSSI) between a user device and a gateway to determine whether a distance between the two devices is less than a distance threshold. If yes, authentication information is exchanged between the gateway and the user device so that the gateway is able to connect to the server through an access point and the user device is able to connect to the server and the gateway. The IoT device setup method includes to detect RSSI between an IoT device and the gateway device to determine whether a distance between the two devices is less than a distance threshold. If yes, authentication information is exchanged between the gateway and the IoT device so that the two devices are able to connect to each other.Type: ApplicationFiled: August 29, 2017Publication date: June 28, 2018Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Hung-Chih Chen, Tzu-Hao Tsao, Kai-Ho Hsiung