Abstract: A polishing system includes a support to hold a substrate having a substrate surface to be polished, a conditioning system for conditioning a polishing pad, the conditioning system comprising one or more conditioning heads, a movable support structure, and a carrier to hold a polishing pad. The carrier is suspended from the movable support structure, and the support structure is configured to move the carrier between the support to hold the substrate and the conditioning system.

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate during a polishing operation, a polishing pad assembly include a membrane and a polishing pad portion, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad carrier includes a casing having a cavity and an aperture connecting the cavity to an exterior of the casing. The polishing pad assembly is positioned in the casing such that the membrane divides the cavity into a first chamber and a second chamber and the aperture extends from the second chamber. The polishing pad carrier and polishing pad assembly are positioned and configured such that at least during application of a sufficient pressure to the first chamber the polishing pad portion projects through the aperture.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate during a polishing operation, a polishing pad assembly include a membrane and a polishing pad portion, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad carrier includes a casing having a cavity and an aperture connecting the cavity to an exterior of the casing. The polishing pad assembly is positioned in the casing such that the membrane divides the cavity into a first chamber and a second chamber and the aperture extends from the second chamber. The polishing pad carrier and polishing pad assembly are positioned and configured such that at least during application of a sufficient pressure to the first chamber the polishing pad portion projects through the aperture.

Abstract: A polishing system include a support to hold a substrate having a substrate surface to be polished, a carrier to hold a polishing pad in contact with the substrate surface, and a pressure applicator to apply pressure at a selected region of a back surface of the polishing pad. The back surface is opposite to the polishing surface. The pressure applicator includes an actuator and a body configured to be moved by the actuator into and out of contact with the selected region of the back surface of the polishing pad.

Abstract: A supporting base suitable for a computer device is provided. The computer device has a device fitting portion. The supporting base includes a main body and a connection interface. The connection interface includes a housing and a first moving element. The housing is connected to the main body and has an opening. The first moving element is movably disposed in the housing and has a base fitting portion. The base fitting portion protrudes out from the housing through the opening to be engaged with the device fitting portion of the computer device. A computer system having said supporting base and said computer device is also provided herein.

Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.

Abstract: A computer apparatus includes a base and a display device. The base includes a first casing and a ferromagnetic unit fastened to the first casing. The display device includes a second casing having a connecting side portion and a magnetic unit. In a first use state, the connecting side portion of the second casing is adjacent to the first casing of the base, and an angle formed therebetween is adjustable. The magnetic unit is fastened to the connecting side portion of the second casing, and magnetically attracts ferromagnetic unit of the base, thereby permitting sliding of the display device relative to the base without separating therefrom.

Abstract: A supporting base suitable for a computer device is provided. The computer device has a device fitting portion. The supporting base includes a main body and a connection interface. The connection interface includes a housing and a first moving element. The housing is connected to the main body and has an opening. The first moving element is movably disposed in the housing and has a base fitting portion. The base fitting portion protrudes out from the housing through the opening to be engaged with the device fitting portion of the computer device. A computer system having said supporting base and said computer device is also provided herein.

Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

Abstract: A computer apparatus includes a base and a display device. The base includes a first casing and a ferromagnetic unit fastened to the first casing. The display device includes a second casing having a connecting side portion and a magnetic unit. In a first use state, the connecting side portion of the second casing is adjacent to the first casing of the base, and an angle formed therebetween is adjustable. The magnetic unit is fastened to the connecting side portion of the second casing, and magnetically attracts ferromagnetic unit of the base, thereby permitting sliding of the display device relative to the base without separating therefrom.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

Abstract: An expanding platform for a portable electronic apparatus is disclosed. The expanding platform includes a base, a moving element, an elastic element and a magnetic element. The moving element and the magnetic element are respectively and movably combined with the base. When the moving element is at an initial position, the moving element limits the movement of the magnetic element by a blocking portion. When the moving element moves to an unlocking position with respect to the base, the magnetic element disengages from the blocking portion and is attracted to move by a corresponding magnetic element of a main device combined with the base, so that the moving element is fixed at the unlocking position by the magnetic element blocking the blocking portion. After the magnetic element returns to its original position, the moving element returns to the initial position by the elastic element.

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Abstract: A portable electronic device includes a host module, a display module, a pivoting mechanism and a moving component. The pivoting mechanism is connected to the host module and the display module and for pivoting the host module relative to the display module. The pivoting mechanism includes a base and a pivoting unit. The pivoting unit includes a lower pivoting component and an upper pivoting component. The lower pivoting component is installed on the base. The upper pivoting component is pivotally connected to the lower pivoting component in a first pivoting direction and installed on the display module, so that the display module rotates relative to the host module in the first pivoting direction. The moving component contacts an upper surface of the host module and moves relative to the upper surface as the display module rotates relative to the host module in the first pivoting direction.

Abstract: The present invention discloses a fixing device for fixing a portable electronic device. The fixing device includes a base and a plurality of fixing structures. A slot structure is formed on the base. The plurality of fixing structures is disposed on the base. The plurality of fixing structures is for fixing the portable electronic device on the base as an end of the portable electronic device is inserted into the slot structure.