Abstract: A method for manufacturing a memory device is provided. The method includes forming a bottom electrode layer, a resistance switching element layer over the bottom electrode layer, and a top electrode layer over the resistance switching element layer; patterning the top electrode layer into a top electrode; forming a protection spacer on a sidewall of the top electrode; patterning the resistance switching element layer into a resistance switching element after forming the protection spacer; and patterning the bottom electrode layer into a bottom electrode after patterning the resistance switching element layer.

Abstract: A method of forming a MRAM device includes forming an interconnect structure spanning a memory region and a peripheral region; forming a MTJ stack over the interconnect structure within the memory region; depositing a dielectric layer over the MTJ stack and spanning the memory region and the peripheral region; removing a first portion of the dielectric layer from the peripheral region, while leaving a second portion of the dielectric layer within the memory region; after removing the first portion of the dielectric layer from the peripheral region, forming a first IMD layer spanning the memory region and the peripheral region; forming a dual damascene structure through the first IMD layer to a metallization pattern of the interconnect structure within the peripheral region; and after forming the dual damascene structure within the peripheral region, forming a top electrode via in contact with a top electrode of the MTJ stack.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: an Nth metal layer; a bottom electrode over the Nth metal layer; a magnetic tunneling junction (MTJ) over the bottom electrode; a top electrode over the MTJ; a spacer, including: a first spacer layer including SiN with a first atom density, the first spacer layer laterally encompassing the MTJ; and a second spacer layer including SiN with a second atom density different from the first atom density, the second spacer layer laterally encompassing at least a portion of the first spacer layer; and an (N+1)th metal layer over the top electrode. A method for manufacturing a semiconductor structure is also disclosed.

Abstract: Some embodiments relate to a magnetoresistive random-access memory (MRAM) cell. The cell includes a bottom electrode having a central bottom electrode portion surrounded by a peripheral bottom electrode portion. Step regions of the conductive bottom electrode couple the central and peripheral bottom electrode portions to one another such that an upper surface of the central portion is recessed relative to an upper surface of the peripheral portion. A magnetic tunneling junction (MTJ) has MTJ outer sidewalls which are disposed over the bottom central electrode portion and which are arranged between the step regions. A top electrode is disposed over an upper surface of the MTJ. Other devices and methods are also disclosed.

Abstract: A method of forming a magnetic random access memory (MRAM) device includes forming a bottom electrode layer over a substrate including an inter-metal dielectric (IMD) layer having a metal line therein; forming a barrier layer over the bottom electrode layer; forming a magnetic tunnel junction (MTJ) layer stack over the bottom electrode layer; forming a dielectric layer over the MTJ layer stack; forming an opening in the dielectric layer to expose the barrier layer; filling the opening in the dielectric layer with a top electrode; after filling the opening in the dielectric layer with the top electrode, etching the dielectric layer to expose the barrier layer; and patterning the MTJ layer stack to form an MTJ stack that exposes the bottom electrode layer.

Abstract: The present disclosure relates to a method of forming an integrated chip. The method includes forming an ILD layer over a memory device over a substrate. A hard mask structure is formed over the ILD layer and a patterning structure is formed over the hard mask structure. The hard mask structure has sidewalls defining a first opening directly over the memory device and centered along a first line perpendicular to an upper surface of the substrate. The patterning structure has sidewalls defining a second opening directly over the memory device and centered along a second line parallel to the first line. The second line is laterally offset from the first line by a non-zero distance. The ILD layer is etched below an overlap of the first and second openings to define a top electrode via hole. The top electrode via hole is with a conductive material.

Abstract: The present disclosure provides a system and method for forming a reduced area MRAM memory cell including a substrate, a transistor overlying the substrate and a magnetic tunnel junction overlying the transistor. The transistor includes a first and second source regions, a drain region between the first and second source regions, at least one first channel region between the drain region and the first source region, at least one second channel region between the drain region and the second source region, a first gate structure overlying the at least one first channel region, and a second gate structure overlying the at least one second channel region. First and second metal layers overlie the transistor. The first and second metal layers are configured to couple a common source line signal to the first and second source regions.

Abstract: An integrated circuit die includes a magnetic tunnel junction as a storage element of a MRAM cell. The integrated circuit die includes a top electrode positioned on the magnetic tunnel junction. The integrated circuit die includes a first sidewall spacer laterally surrounding the top electrode. The first sidewall spacer acts as a mask for patterning the magnetic tunnel junction. The integrated circuit die includes a second sidewalls spacer positioned on a lateral surface of the magnetic tunnel junction.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a memory device surrounded by a dielectric structure disposed over a substrate. The memory device includes a data storage structure disposed between a bottom electrode and a top electrode. A top electrode via couples the top electrode to an upper interconnect wire. A first line is tangent to a first outermost sidewall of the top electrode via and a second line is tangent to an opposing second outermost sidewall of the top electrode via. The first line is oriented at a first angle with respect to a horizontal plane that is parallel to an upper surface of the substrate and the second line is oriented at a second angle with respect to the horizontal plane. The second angle is less than the first angle.

Abstract: Some embodiments relate to a method for forming a memory device. The method includes forming a first memory cell over a substrate and forming a second memory cell over the substrate. Further, an inter-level dielectric (ILD) layer is formed over the substrate such that the ILD layer comprises sidewalls defining a first trough between the first memory cell and the second memory cell. In addition, a first dielectric layer is formed over the ILD layer and within the first trough.

Abstract: Some embodiments relate to an integrated chip. The integrated chip includes a first memory cell overlying a substrate and a second memory cell overlying the substrate. A dielectric structure overlies the substrate. A trench extends into the dielectric structure and is spaced laterally between the first memory cell and the second memory cell. A dielectric layer is disposed within the trench.

Abstract: Some embodiments relate to a method for manufacturing a magnetoresistive random-access memory (MRAM) cell. The method includes forming a spacer layer surrounding at least a magnetic tunnel junction (MTJ) layer and a top electrode of the MRAM cell; etching the spacer layer to expose a top surface of the top electrode and a top surface of a spacer formed by the spacer layer; forming an upper etch stop layer over the top electrode top surface and the spacer top surface; and forming an upper metal layer in contact with the top electrode top surface of the MRAM cell. A width of the upper etch stop layer is greater than a width of a bottom surface of the upper metal layer.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a magnetoresistive random access memory (MRAM) device surrounded by a dielectric structure disposed over a substrate. The MRAM device includes a magnetic tunnel junction disposed between a bottom electrode and a top electrode. A bottom electrode via couples the bottom electrode to a lower interconnect wire. A top electrode via couples the top electrode to an upper interconnect wire. A bottom surface of the top electrode via has a first width that is smaller than a second width of a bottom surface of the bottom electrode via.

Abstract: The present disclosure relates to an integrated circuit. The integrated circuit includes a an inter-layer dielectric (ILD) structure laterally surrounding a conductive interconnect. A dielectric protection layer is disposed over the ILD structure and a passivation layer is disposed over the dielectric protection layer. The passivation layer includes a protrusion extending outward from an upper surface of the passivation layer. A bottom electrode continuously extends from over the passivation layer to between sidewalls of the passivation layer. A data storage element is over the bottom electrode and a top electrode is over the data storage element.

Abstract: The present disclosure provides a semiconductor structure, including a memory region, a first metal line in the memory region, a magnetic tunneling junction (MTJ) cell over the first metal line, a carbon-based layer between the first metal line and the MTJ cell, a second metal line over the MTJ cell, a logic region adjacent to the memory region, wherein the logic region is free from a coverage of the carbon-based layer.

Abstract: The present disclosure provides a semiconductor structure, including a logic region and a memory region. The memory region includes a first Nth metal line of an Nth metal layer, a magnetic tunneling junction (MTJ) over first Nth metal line, a carbon-based layer between the first Nth metal line and the MTJ, and a first (N+M)th metal via of an (N+M)th metal layer. A method of manufacturing the semiconductor structure is also disclosed.

Abstract: Some embodiments relate to a memory device. The memory device includes a first magnetoresistive random-access memory (MRAM) cell disposed on a substrate, and a second MRAM cell disposed on the substrate. An inter-level dielectric (ILD) layer is disposed over the substrate. The ILD layer comprises sidewalls defining a trough between the first and second MRAM cells. A dielectric layer disposed over the ILD layer. The dielectric layer completely fills the trough.

Abstract: The present disclosure, in some embodiments, relates to an integrated circuit. The integrated circuit includes a dielectric protection layer disposed over a dielectric structure that laterally surrounds one or more conductive interconnect layers. The dielectric protection layer has a protrusion extending outward from an upper surface of the dielectric protection layer. A bottom electrode is disposed over the dielectric protection layer and has sidewalls extending outward from a lower surface of the bottom electrode through the dielectric protection layer. The bottom electrode has a substantially planar upper surface over the protrusion. A data storage element is over the substantially planar upper surface of the bottom electrode, and a top electrode is over the data storage element.

Abstract: The present disclosure provides a semiconductor structure and a method for manufacturing the same. The semiconductor structure comprises a memory region. The memory region comprises a bottom via, a recap layer on the BV, a bottom electrode on the recap layer, a magnetic tunneling junction layer on the bottom electrode, and a top electrode on the MTJ layer. The material of the recap layer is different from that of the BV.

Abstract: Some embodiments relate to a memory device. The memory device includes a first magnetoresistive random-access memory (MRAM) cell disposed on a substrate, and a second MRAM cell disposed on the substrate. An inter-level dielectric (ILD) layer is disposed over the substrate. The ILD layer comprises sidewalls defining a trough between the first and second MRAM cells. A dielectric layer disposed over the ILD layer. The dielectric layer completely fills the trough.