Patents by Inventor Hung-Jen Hsu

Hung-Jen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210232168
    Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.
    Type: Application
    Filed: January 29, 2020
    Publication date: July 29, 2021
    Inventors: Haruki Mori, Hidehiro Fujiwara, Zhi-Hao Chang, Yangsyu Lin, Yu-Hao Hsu, Yen-Huei Chen, Hung-Jen Liao, Chiting Cheng
  • Patent number: 11031556
    Abstract: In an embodiment, a method includes: growing a phase change material on a platform configured for a semiconductor workpiece process; setting the phase change material to an amorphous state; performing the semiconductor workpiece process within a semiconductor processing chamber; and measuring resistance across two points along the phase change material.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Mao Chen, Hung-Jen Hsu
  • Publication number: 20200185603
    Abstract: In an embodiment, a method includes: growing a phase change material on a platform configured for a semiconductor workpiece process; setting the phase change material to an amorphous state; performing the semiconductor workpiece process within a semiconductor processing chamber; and measuring resistance across two points along the phase change material.
    Type: Application
    Filed: April 2, 2019
    Publication date: June 11, 2020
    Inventors: Chien-Mao CHEN, Hung-Jen HSU
  • Publication number: 20200052025
    Abstract: A semiconductor device structure for sensing an incident light includes a substrate, a passivation layer and a wiring structure. The substrate has a device embedded therein. The passivation layer is disposed on the substrate, where the passivation layer has a first side and a second side opposite to the first side, the first side of the passivation layer includes microstructures disposed on the substrate, and the second side of the passivation layer is a continuous flat plane, wherein each of the microstructures has a cross-section in a shape of a triangle, trapezoid or arc. The wiring structure is disposed on the substrate, where the writing structure includes at least one contact and metal interconnection patterns respectively formed in different dielectric layers, and the at least one contact and the metal interconnection patterns are electrically connected, where the substrate is located between the passivation layer and the wiring structure.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 13, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Ping Pan, Hung-Jen Hsu
  • Patent number: 10475835
    Abstract: A semiconductor device structure for sensing an incident light includes a substrate, a wiring structure, and at least one passivation layer. The substrate has a device. The at least one passivation layer is disposed above the wiring structure. The at least one passivation layer includes a plurality of microstructures, and each of the microstructures has a cross-section in a shape of a triangle, trapezoid or arc. The wiring structure is disposed below the at least one passivation layer. A method for manufacturing the semiconductor device structure is also provided.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: November 12, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Ping Pan, Hung-Jen Hsu
  • Publication number: 20180069043
    Abstract: A semiconductor device structure for sensing an incident light includes a substrate, a wiring structure, and at least one passivation layer. The substrate has a device. The at least one passivation layer is disposed above the wiring structure. The at least one passivation layer includes a plurality of microstructures, and each of the microstructures has a cross-section in a shape of a triangle, trapezoid or arc. The wiring structure is disposed below the at least one passivation layer. A method for manufacturing the semiconductor device structure is also provided.
    Type: Application
    Filed: September 5, 2016
    Publication date: March 8, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Ping Pan, Hung-Jen Hsu
  • Patent number: 9865929
    Abstract: A communication device includes a ground element and an antenna element. The antenna element is disposed adjacent to an edge of the ground element. The antenna element includes a first metal element and a second metal element. The first metal element has a first end and a second end. The first end is coupled through a capacitive element to a communication module. The second end is coupled through a shorting element to the ground element. The second metal element has a third end and a fourth end. The third end is coupled to the communication module. The fourth end is open. The first metal element and the second metal element are adjacent to each other, but not connected to each other. The first metal element and the second metal element have projections on the edge of the ground element, wherein the projections do not overlap with each other.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: January 9, 2018
    Assignee: ACER INCORPORATED
    Inventors: Kin-Lu Wong, Hung-Jen Hsu
  • Patent number: 9437925
    Abstract: A communication device including a ground element and an antenna element is provided. The antenna element is disposed adjacent to an edge of the ground element. The antenna element includes a loop metal element and a branch metal element. The loop metal element has a first end and a second end. The first end is coupled to a signal source. The second end is coupled to the ground element. The loop metal element includes a first segment and a second segment. The first segment is separated from the second segment by a gap. The first segment includes the first end, and the second segment includes the second end. The branch metal element has a third end and a fourth end. The third end is coupled through an inductive element to a connection point on the loop metal element. The fourth end is open.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: September 6, 2016
    Assignee: ACER INCORPORATED
    Inventors: Kin-Lu Wong, Hung-Jen Hsu
  • Patent number: 9385419
    Abstract: A communication device, including a device casing, an external connection element, and a first metal element, is provided. A ground element and an antenna element are disposed in the device casing. The ground element has a first edge, a second edge, and a first connection point. The first edge and the second edge are opposite to each other. The first connection point is disposed near or at the second edge. The antenna element is disposed near the first edge. The external connection element is formed by a non-conductive material and is outside the device casing. The external connection element has a belt-like structure and is combined with the device casing to substantially form a loop structure. The first metal element is supported by the external connection element and is coupled to the first connection point of the ground element.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: July 5, 2016
    Assignee: Acer Incorporated
    Inventors: Kin-Lu Wong, Hung-Jen Hsu
  • Publication number: 20150162659
    Abstract: A communication device including a ground element and an antenna element is provided. The antenna element is disposed adjacent to an edge of the ground element. The antenna element includes a loop metal element and a branch metal element. The loop metal element has a first end and a second end. The first end is coupled to a signal source. The second end is coupled to the ground element. The loop metal element includes a first segment and a second segment. The first segment is separated from the second segment by a gap. The first segment includes the first end, and the second segment includes the second end. The branch metal element has a third end and a fourth end. The third end is coupled through an inductive element to a connection point on the loop metal element. The fourth end is open.
    Type: Application
    Filed: March 12, 2014
    Publication date: June 11, 2015
    Applicant: Acer Incorporated
    Inventors: Kin-Lu Wong, Hung-Jen Hsu
  • Publication number: 20150070226
    Abstract: A communication device, including a device casing, an external connection element, and a first metal element, is provided. A ground element and an antenna element are disposed in the device casing. The ground element has a first edge, a second edge, and a first connection point. The first edge and the second edge are opposite to each other. The first connection point is disposed near or at the second edge. The antenna element is disposed near the first edge. The external connection element is formed by a non-conductive material and is outside the device casing. The external connection element has a belt-like structure and is combined with the device casing to substantially form a loop structure. The first metal element is supported by the external connection element and is coupled to the first connection point of the ground element.
    Type: Application
    Filed: October 23, 2013
    Publication date: March 12, 2015
    Applicant: Acer Incorporated
    Inventors: Kin-Lu Wong, Hung-Jen Hsu
  • Publication number: 20150002363
    Abstract: A communication device includes a ground element and an antenna element. The antenna element is disposed adjacent to an edge of the ground element. The antenna element includes a first metal element and a second metal element. The first metal element has a first end and a second end. The first end is coupled through a capacitive element to a communication module. The second end is coupled through a shorting element to the ground element. The second metal element has a third end and a fourth end. The third end is coupled to the communication module. The fourth end is open. The first metal element and the second metal element are adjacent to each other, but not connected to each other. The first metal element and the second metal element have projections on the edge of the ground element, wherein the projections do not overlap with each other.
    Type: Application
    Filed: August 28, 2013
    Publication date: January 1, 2015
    Applicant: ACER INCORPORATED
    Inventors: Kin-Lu WONG, Hung-Jen HSU
  • Patent number: 8129762
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: March 6, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7553689
    Abstract: A semiconductor device including a semiconductor substrate having a photosensor formed therein; a first layer overlying the substrate, the first layer includes a portion having a generally concave shaped surface being the negative shaped of a micro-lens to be formed there over; a second layer overlying the first layer, the second layer including a generally convex shaped portion vertically aligned with and mating with the generally concave shaped surface, the generally convex shaped portion being constructed and arranged to define a micro-lens positioned to cause parallel light passing through the micro-lens to converge on and strike the photosensor.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: June 30, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jeng-Shyan Lin, Chien-Hsien Tseng, Shou-Gwo Wuu, Ho-Ching Chien, Dun-Nian Yaung, Hung-Jen Hsu
  • Publication number: 20090104547
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: December 31, 2008
    Publication date: April 23, 2009
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7507598
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: March 24, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7508084
    Abstract: A method for forming an image sensor device. An alignment mark is formed on or in a substrate with distance from the alignment mark to the substrate edge less than about 3 mm. An array of active photosensing pixels is formed on the substrate. At least one dielectric layer is formed covering the substrate and the array. A color filter photoresist is formed on the least one dielectric layer. Subsequent to removal of the color filter photoresist from the alignment mark, the color filter photoresist is exposed with alignment to the alignment mark.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: March 24, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hung-Jen Hsu, Fu-Tien Wong
  • Patent number: 7372497
    Abstract: An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: May 13, 2008
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Chin-Kung Chang, Hung-Jen Hsu, Yi-Ming Dai, Chin-Chen Kuo
  • Publication number: 20070087467
    Abstract: A method for forming an image sensor device. An alignment mark is formed on or in a substrate with distance from the alignment mark to the substrate edge less than about 3 mm. An array of active photosensing pixels is formed on the substrate. At least one dielectric layer is formed covering the substrate and the array. A color filter photoresist is formed on the least one dielectric layer. Subsequent to removal of the color filter photoresist from the alignment mark, the color filter photoresist is exposed with alignment to the alignment mark.
    Type: Application
    Filed: October 19, 2005
    Publication date: April 19, 2007
    Inventors: Hung-Jen Hsu, Fu-Tien Wong
  • Publication number: 20070015305
    Abstract: A semiconductor device including a semiconductor substrate having a photosensor formed therein; a first layer overlying the substrate, the first layer includes a portion having a generally concave shaped surface being the negative shaped of a micro-lens to be formed there over; a second layer overlying the first layer, the second layer including a generally convex shaped portion vertically aligned with and mating with the generally concave shaped surface, the generally convex shaped portion being constructed and arranged to define a micro-lens positioned to cause parallel light passing through the micro-lens to converge on and strike the photosensor.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 18, 2007
    Inventors: Jeng-Shyan Lin, Chien-Hsien Tseng, Shou-Gwo Wuu, Ho-Ching Chien, Dun-Nian Yaung, Hung-Jen Hsu