Patents by Inventor Hung Liao

Hung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250066582
    Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Yi-Hsuan TANG, Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Tzu-Yuan SHIH, Ka Chun AU-YEUNG
  • Publication number: 20250072003
    Abstract: A method for manufacturing a semiconductor device includes: forming an etch stop layer with an opening; forming a barrier layer on the etch stop layer to fill the opening, the barrier layer including a layer portion disposed on the etch stop layer and an insert portion protruding from the layer portion to be inserted into the opening of the etch stop layer; forming a bottom electrode layer on the layer portion of the barrier layer opposite to the etch stop layer; forming a ferroelectric layer on the bottom electrode layer opposite to the barrier layer; and forming a top electrode layer on the ferroelectric layer opposite to the bottom electrode layer.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tzu-Yu CHEN, Chu-Jie HUANG, Yu-Wen LIAO, Sheng-Hung SHIH, Kuo-Chi TU
  • Patent number: 12228277
    Abstract: A light source module includes a light source and a reflective element. The light source has a light emitting surface. The reflective element is disposed on a transmission path of an illumination light beam emitted from the light source. The illumination light beam reflected by the reflective element is irradiated on a target plane. The reflective element includes a first reflective surface and a second reflective surface. The first reflective surface is disposed towards the light emitting surface of the light source, and is a plane. The second reflective surface bendably extends from the first reflective surface.
    Type: Grant
    Filed: March 28, 2024
    Date of Patent: February 18, 2025
    Assignee: CHAMP VISION DISPLAY INC.
    Inventors: Chun-Chien Liao, Hsin-Hung Lee, Chung-Hao Wu
  • Publication number: 20250051073
    Abstract: A food packaging barrier film is provided. The food packaging barrier film includes a base film, an inorganic laminated film formed on a surface of the base film, and a barrier coating layer formed on the inorganic laminated film. The inorganic laminated film includes at least one first inorganic material deposition layer and a second inorganic material deposition layer stacked upon each other, and the at least one first inorganic material deposition layer and the second inorganic material deposition layer are formed in a same vacuum deposition process and in a vacuum condition. The at least one first inorganic material deposition layer and the second inorganic material deposition layer are respectively formed by different inorganic metal oxides in the same vacuum deposition process. The barrier coating layer is formed by coating a barrier coating solution on the inorganic laminated film and then curing the barrier coating solution.
    Type: Application
    Filed: October 29, 2024
    Publication date: February 13, 2025
    Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN
  • Publication number: 20250044270
    Abstract: A system for notifying environmental pollution status includes wireless environment sensing devices and a portable wireless environmental pollution status notification device. The wireless environment sensing devices, respectively arranged in the different sensing locations of a physical environment, respectively store the sensing locations and respectively sense pollution related information corresponding to the different sensing locations to output the pollution related information and the sensing locations corresponding thereto. The portable wireless environmental pollution status notification device, wirelessly connected to the plurality of wireless environment sensing devices and located in the physical environment, receives the pollution related information and the sensing locations corresponding thereto and generates notification signals based on the pollution related information and the sensing locations corresponding thereto.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 6, 2025
    Inventors: CHIA-JUI YANG, HERMAN CHUNGHWA RAO, CHUN-CHIEH KUO, HUA-PEI CHIANG, SHUI-SHU HSIAO, ZHENG-XIANG CHANG, CHYI-DAR JANG, TSUNG-JEN WANG, CHE-YU LIAO, CHIH-MIN CHAN, TENG-CHIEH YANG, CHANG-HUNG HSU
  • Publication number: 20250035603
    Abstract: A positioning pollutant-measuring system includes a cloud server, a wireless base station, an automatic moving vehicle, and a positioning pollutant-measuring device. The automatic moving vehicle carries the positioning pollutant-measuring device and passes through different locations. The positioning pollutant-measuring device receives location related parameters from the wireless base station and measures the air flow rates or the air humidity of the different locations to adjust a resolution for measuring pollutants corresponding to the different locations.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 30, 2025
    Inventors: Chia-Jui YANG, HERMAN CHUNGHWA RAO, Chun-Chieh KUO, Hua-Pei CHIANG, Shui-Shu HSIAO, Zheng-Xiang CHANG, Chyi-Dar JANG, Tsung-Jen WANG, Che-Yu LIAO, Chih-Min CHAN, Teng-Chieh YANG, CHANG-HUNG HSU
  • Publication number: 20250035897
    Abstract: A zoom lens sequentially includes a first lens group, a second lens group and a third lens group along an optical axis from an object side to an image side. The zoom lens at least has a wide-angle state and a telephoto state, the second lens group has positive refracting power, and the zoom lens has only the above three lens groups and satisfies the following relationships: TTL*(Fnow+Fnot)/fw?20.000, (ft+fw)/ImgH?9.000 and ft/fw?1.600. TTL is a system length of the zoom lens, Fnow is an f-number of the zoom lens in the wide-angle state, Fnot is an f-number of the zoom lens in the telephoto state, fw is an effective focal length of the zoom lens in the wide-angle state, ft is an effective focal length of the zoom lens in the telephoto state, and ImgH is a maximum image height of the zoom lens.
    Type: Application
    Filed: March 1, 2024
    Publication date: January 30, 2025
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Huabin Liao, Wei-Jeh Kao, Ying-Hua Lin, Hung-Chien Hsieh
  • Publication number: 20250029910
    Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.
    Type: Application
    Filed: October 8, 2024
    Publication date: January 23, 2025
    Applicant: Innolux Corporation
    Inventors: Yeong-E Chen, Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang
  • Patent number: 12207181
    Abstract: A first access point in a mesh network includes a transceiver and a processor. The processor is coupled to the transceiver, and is used to determine whether a second access point transmitting a beacon belongs to the mesh network upon detecting the beacon. If so, the processor is used to determine whether the beacon includes first channel switch announcement information, and if so, configure the transceiver to transmit second channel switch announcement information, and configure the first access point to switch to a target channel. The first channel switch announcement information and the second channel switch announcement information include information of the target channel.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: January 21, 2025
    Assignee: Realtek Semiconductor Corp.
    Inventor: Chien-Hung Liao
  • Patent number: 12205664
    Abstract: A memory circuit includes a first and a second bit line coupled to a set of memory cells, a local input output circuit including a first and a second data line, a first control circuit configured to generate a first sense amplifier signal and a second sense amplifier signal, a second control circuit configured to generate a first control signal in response to at least a second control signal or a third control signal, a switching circuit configured to transfer a first and second input signal to the corresponding first and second data line during a write operation, and to electrically isolate the first and second data line from the first and second input signal during a read operation, and a first latch configured as a sense amplifier, during the read operation, and configured as a write-in latch, during the write operation.
    Type: Grant
    Filed: January 20, 2023
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hua-Hsin Yu, Hau-Tai Shieh, Cheng Hung Lee, Hung-Jen Liao
  • Publication number: 20250022802
    Abstract: An integrated circuit (IC) with conductive structures and a method of fabricating the IC are disclosed. The method includes depositing a first dielectric layer on a semiconductor device, forming a conductive structure in the first dielectric layer, removing a portion of the first dielectric layer to expose a sidewall of the conductive structure, forming a barrier structure surrounding the sidewall of the conductive structure, depositing a conductive layer on the barrier structure, and performing a polishing process on the barrier structure and the conductive layer.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 16, 2025
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Tzu Pei Chen, Sung-Li Wang, Shin-Yi Yang, Po-Chin Chang, Yuting Cheng, Chia-Hung Chu, Chun-Hung Liao, Harry CHIEN, Chia-Hao Chang, Pinyen LIN
  • Patent number: 12191127
    Abstract: An apparatus for PVD is provided. The apparatus includes a chamber, a pedestal disposed in the chamber to accommodate a wafer, and a ring. The ring includes a ring body having a first top surface and a second top surface, and a barrier structure disposed between the first top surface and the second top surface. The barrier structure can further include at least a first portion and a second portion separated from each other. The second vertical distance is equal to or greater than the first vertical distance.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: January 7, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsin-Liang Chen, Wen-Chih Wang, Chia-Hung Liao, Cheng-Chieh Chen, Yi-Ming Yeh, Hung-Ting Lin, Yung-Yao Lee
  • Patent number: 12176217
    Abstract: The present disclosure provides a method for manufacturing a semiconductor. The method includes: forming a metal oxide layer over a gate structure over a substrate; forming a dielectric layer over the metal oxide layer; forming a metal layer over the metal oxide layer; and performing a chemical mechanical polish (CMP) operation to remove a portion of the dielectric layer and a portion of the metal layer, the CMP operation stopping at the metal oxide layer, wherein a slurry used in the CMP operation includes a ceria compound. The present disclosure also provides a method for planarizing a metal-dielectric surface.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: December 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Hung Liao, Chung-Wei Hsu, Tsung-Ling Tsai, Chen-Hao Wu, An-Hsuan Lee, Shen-Nan Lee, Teng-Chun Tsai, Huang-Lin Chao
  • Patent number: 12170218
    Abstract: A method includes detecting a location of a particle on a bottom surface of an electrostatic chuck; moving a platform to a position under the bottom surface of the electrostatic chuck and right under the particle; and rotating the platform about a center of the platform to remove the particle from the bottom surface of the electrostatic chuck.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: December 17, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yueh-Lin Yang, Chi-Hung Liao
  • Publication number: 20240385511
    Abstract: A reticle enclosure includes a base including a first surface, a cover including a second surface and disposed on the base, wherein the base and the cover form an internal space therebetween that includes a reticle, and a layer of electrostatic discharge material disposed on the first surface, wherein the electrostatic discharge material reduces electrostatic charges on the reticle.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Hung LIAO, Po-Ming SHIH
  • Patent number: 12143857
    Abstract: The present invention provides a control method of a communication device, wherein the control method includes the steps of: controlling a wireless communication module of the communication device to use a first channel to communicate with an access point; detecting a plurality of channels to generate a plurality of first quality parameters, respectively, to generate a first channel detection result; receiving a second channel detection result from the access point, wherein the second channel detection result comprises a plurality of second quality parameters respectively generated by the access point detecting at least part of the plurality of channels; calculating a plurality of final quality parameters according to the first channel detection result and the second channel detection result; and determining whether to control the wireless communication module to switch from the first channel to a second channel according to the plurality of final quality parameters.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: November 12, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventor: Chien-Hung Liao
  • Patent number: 12140293
    Abstract: A light-emitting device includes a base, a shell with a through hole, a circuit board, a first covering body and a second covering body. The shell covers on the base along an installing direction to form an accommodating space. The circuit board is disposed in the accommodating space and includes a light-emitting element configured to emit a light beam to the through hole along a light-emitting direction. A separation distance is formed between the light-emitting element and the through hole. The light-emitting direction is perpendicular to the installing direction. The first covering body and the second covering body are respectively located at a first side and a second side of the circuit board. A covering space is formed by the first covering body and the second covering body and has an opening corresponding to the through hole. The light-emitting element is located in the covering space.
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: November 12, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Yu-Kai Chiu, Chang-Yu Huang, Wei-Hung Liao
  • Publication number: 20240342745
    Abstract: A method of preventing drippage in a liquid dispensing system includes generating at least a first proxy signal representing at least a first indirect measure of a position of a first automatic control valve (ACV), wherein the first ACV has positions ranging from fully closed to fully open. The method further includes recognizing, based on at least the first proxy signal, whether a failure state exists in which the first ACV has failed to close. The method further includes causing a second ACV to close when the failure state exists, wherein the second ACV is fluidically connected to the first ACV, and the second ACV has positions ranging from fully closed to fully open.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Inventors: Chien-Hung WANG, Chun-Chih LIN, Chi-Hung LIAO, Yung-Yao LEE, Wei Chang CHENG
  • Publication number: 20240327677
    Abstract: A CMP slurry composition and a method of polishing a metal layer are provided. In some embodiments, the CMP slurry composition includes about 0.1 to 10 parts by weight of a metal oxide, and about 0.1 to 10 parts by weight of a chelator. The chelator includes a thiol compound or a thiolether compound.
    Type: Application
    Filed: June 4, 2024
    Publication date: October 3, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hung Liao, An-Hsuan Lee, Shen-Nan Lee, Teng-Chun Tsai, Chen-Hao Wu, Huang-Lin Chao
  • Publication number: 20240328605
    Abstract: An electronic device with light-indicating function is provided. The electronic device includes a substrate, a first light source, a second light source, and a light guiding element. The substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The first light source is disposed on the first surface of the substrate, wherein the first light source faces the first direction, and the first light source provides a first light beam. The second light source is disposed on the first surface of the substrate, wherein the second light source faces the second direction, the second light source provides a second light beam, and the first direction is not parallel to the second direction. The light guiding element includes a first section and a second section.
    Type: Application
    Filed: March 7, 2024
    Publication date: October 3, 2024
    Inventors: Ching-Hsun MENG, Wei-Hung LIAO, Yang-Chieh MA, Hsueh-Chu LIN