Patents by Inventor Hung Liao

Hung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12267598
    Abstract: The present invention relates to a method of image fusion, which uses the brightness difference of the current frame and the previous frame to determine whether the pixel in a frame image is static or dynamic. If the current pixel is static, the previous corresponding pixel is superimposed onto the current pixel; if the current pixel is dynamic, the previous corresponding pixel is replaced with the current pixel.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: April 1, 2025
    Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., Ltd.
    Inventors: Ping-Hung Yin, Yung-Ming Chou, Bo-Jia Lin, Yu-Sheng Liao
  • Publication number: 20250101151
    Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.
    Type: Application
    Filed: September 25, 2024
    Publication date: March 27, 2025
    Inventors: Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Ka Chun AU-YEUNG, Chiung-Yao HUANG, Tzu-Yin HUANG, Yi-Hsuan TANG
  • Publication number: 20250102231
    Abstract: A heat exchange device may include a fin stack, plurality of heat pipes, and thermally conductive substrate. The fins stack includes a plurality of fins defining a stacked direction. The plurality of heat pipes have a fin stack portion, transportation portion, and substrate portion. The transportation portion is between the fin stack portion and the substrate portion. The thermally conductive substrate includes a top surface and bottom surface. The fin stack portion is coupled to each plurality of fins and the substrate portion is coupled to the top surface. The bottom surface is configured to couple to at least one packaged integrated circuit. The transportation portion includes at least one bend defining a gap between the fin stack and the top surface. A direction of the stacked direction is along a plane of the top surface.
    Type: Application
    Filed: September 22, 2024
    Publication date: March 27, 2025
    Inventor: Pen-hung Liao
  • Patent number: 12259111
    Abstract: An electronic device with light-indicating function is provided. The electronic device includes a substrate, a first light source, a second light source, and a light guiding element. The substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The first light source is disposed on the first surface of the substrate, wherein the first light source faces the first direction, and the first light source provides a first light beam. The second light source is disposed on the first surface of the substrate, wherein the second light source faces the second direction, the second light source provides a second light beam, and the first direction is not parallel to the second direction. The light guiding element includes a first section and a second section.
    Type: Grant
    Filed: March 7, 2024
    Date of Patent: March 25, 2025
    Assignee: WISTRON NEWEB CORP.
    Inventors: Ching-Hsun Meng, Wei-Hung Liao, Yang-Chieh Ma, Hsueh-Chu Lin
  • Patent number: 12261055
    Abstract: The method includes receiving a semiconductor device having a first surface and a second surface. The first surface is a top surface including a conductive material exposed thereon; and the second surface is an embedded surface including the conductive material and a dielectric material. The method also includes selecting a first polishing slurry to achieve a first polishing rate of the conductive material in the first polishing slurry and a second polishing rate of the dielectric material in the first polishing slurry. The method further includes selecting a second polishing slurry to achieve a third polishing rate of the conductive material in the second polishing slurry and a fourth polishing rate of the dielectric material in the second polishing slurry. The method additionally includes polishing the first surface with the first polishing slurry until the second surface is exposed; and polishing the second surface with the second polishing slurry.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: March 25, 2025
    Assignee: TAIWAN SSEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: An-Hsuan Lee, Chun-Hung Liao, Chen-Hao Wu, Shen-Nan Lee, Teng-Chun Tsai, Huang-Lin Chao
  • Publication number: 20250091126
    Abstract: A magnetic component is adapted to be used in a power inductor. The magnetic component includes a magnetic body containing amorphous magnetic powders and/or nano-crystalline magnetic powders and at least one silicon-free glass material distributed among the amorphous magnetic powders and/or nano-crystalline magnetic powders; a coil embedded in the magnetic body; and a pair of electrodes electrically connected to two terminals of the coil, respectively.
    Type: Application
    Filed: November 29, 2024
    Publication date: March 20, 2025
    Inventors: Chih Hung Wei, Chung Kai Liao
  • Publication number: 20250098118
    Abstract: An evaporating concave-convex platform structure of a vapor chamber and a manufacturing method thereof, the structure include a lower plate and an upper plate. The lower plate includes a main plate member and a concave-convex member. The main plate member has a chamber portion dented from one surface thereof and a frame edge surrounding a periphery of the chamber portion. The upper plate is stacked on the lower plate facing a dented surface of the chamber portion. The concave-convex member has a concave-convex surface disposed protrusively from the chamber portion of the lower plate or disposed concavely toward the chamber portion. A connecting portion is disposed to surrounds a periphery of the concave-convex surface. The connecting portion is stacked on the main plate member through the concave-convex surface. The connecting portion is welded to the main plate member.
    Type: Application
    Filed: December 4, 2024
    Publication date: March 20, 2025
    Inventors: Pang-Hung LIAO, Chih-Wei CHEN
  • Publication number: 20250093622
    Abstract: The present invention provides an optical imaging lens. The optical imaging lens comprises five lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and satisfying inequalities, the optical imaging lens may be provided with smaller volume and great field of view.
    Type: Application
    Filed: August 12, 2024
    Publication date: March 20, 2025
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Huabin LIAO, Hai LIN, Hung-Chien HSIEH
  • Publication number: 20250095075
    Abstract: Disclosed herein is a system for implementing medical data exchange and medical claim settlement via Fast Healthcare Interoperability Resources (FHIR) standard data. The system includes a data exchange module, a blockchain database, a service-provider server, and an authority management module, all of which are communicatively connected to each other. The system receives and converts raw medical data into FHIR standard data for transmission to insurance institutions, and encrypts the FHIR standard data, and facilitates medical claims settlement. Also disclosed herein is a method for implementing medical data exchange and claims settlement based on FHIR standards.
    Type: Application
    Filed: September 2, 2024
    Publication date: March 20, 2025
    Inventors: Kun-Cheng CHIANG, Yun-Ting KUNG, Fang-Yu JHANG, Ming-Hung LIAO
  • Publication number: 20250087291
    Abstract: An input/output circuit comprises a bypass circuit, a first latch, a second latch, a first transistor, and a second transistor. The bypass circuit is configured to directly receive a data signal and indirectly receive a write enable signal. The first latch is coupled between a first data line and a second data line. The second latch is operatively coupled to the first latch and configured to generate a data output signal based on a voltage level presented on the second data line. The first transistor is coupled to the first latch and gated by a sense enable signal. The second transistor is coupled to the first latch and gated by a clock signal. The first transistor and the second transistor are alternately activated in each of a plurality of operation modes of the input/output circuit.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Hua-Hsin Yu, Che-An Lee, Hau-Tai Shieh, Cheng Hung Lee, Hung-Jen Liao
  • Publication number: 20250087571
    Abstract: A package structure includes a carrier substrate and a die. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The semiconductor substrate is located between the conductive posts and the carrier substrate.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Yueh Wu, Chien-Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu
  • Publication number: 20250082727
    Abstract: The present invention provides a method and a pharmaceutical composition for cartilage regeneration or treatment of a cartilage defect disease, e.g., degenerative osteoarthritis, which comprises CXCL14 protein, or the peptide fragment thereof. The method and pharmaceutical composition could further comprise stem cell-derived extracellular vesicles.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 13, 2025
    Applicant: FAR EASTERN MEMORIAL HOSPITAL
    Inventors: Hsiu-Jung LIAO, Chih-Hung CHANG, Yi-Shan SHEN, Chi-Ying HUANG
  • Publication number: 20250075989
    Abstract: A liquid-cooling heat sink includes a substrate, a fin assembly, and a housing. The substrate has a longitudinal direction. The fin assembly is arranged on the substrate and includes multiple fins arranged at interval to form flow channels along the longitudinal direction. Each flow channel includes an inlet and an outlet opposite to each other. A turbulence structure divides a cross-section of at least one of the flow channels into at least two diverging passages. The housing arranged on the substrate covers the inlets and includes an inlet port and a chamber. Accordingly, the number of fins may be increased in a fixed space, and each flow channel has a smaller cross-sectional area to increase flow velocity of a dielectric liquid. Moreover, this reduces the flow resistance of the dielectric liquid in a turbulent flow area in each flow channel to improve the heat dissipation efficiency.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Inventors: Pang-Hung LIAO, Chih-Wei CHEN, Shih-Ming WANG
  • Publication number: 20250081387
    Abstract: A liquid-cooling heat dissipation device includes a substrate, a fin assembly, a shell and a shunt component. The fin assembly is disposed on the substrate and has a plurality of channels parallelly arranged, and each of the channels has an inlet and an outlet opposite to each other. The shell is disposed on the substrate and has a liquid input port, a chamber is jointly formed by the shell and the substrate, and the chamber is located between the liquid input port and each of the inlets. The shunt component is disposed in the shell and has a plurality of manifold passages, the liquid input port is in communication with the chamber and each of the inlets through each of the manifold passages. Accordingly, the amount of fin member is increased in a fixed space to increase the heat dissipating efficiency.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 6, 2025
    Inventors: Pang-Hung LIAO, Chih-Wei CHEN, Shih-Ming WANG
  • Publication number: 20250076560
    Abstract: A light source module includes a light guide plate, a first light source, multiple first optical microstructures, and multiple second optical microstructures. The first light source is disposed on a side of a first light incident surface of the light guide plate. The first and second optical microstructures are disposed on a bottom surface of the light guide plate, and respectively located in a first and a second zone. A first light receiving surface of each first optical microstructure facing the first light source has a first edge connecting the bottom surface, and a perpendicular bisector of the first edge passes through the first light source. The first zone does not overlap the second zone. A second light receiving surface of each second optical microstructure has a second edge connecting the bottom surface, and a perpendicular bisector of the second edge does not pass through the first light source.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Applicant: CHAMP VISION DISPLAY INC.
    Inventors: Chin-Ku Liu, Chung-Hao Wu, Hsin-Hung Lee, Chun-Chien Liao
  • Publication number: 20250072003
    Abstract: A method for manufacturing a semiconductor device includes: forming an etch stop layer with an opening; forming a barrier layer on the etch stop layer to fill the opening, the barrier layer including a layer portion disposed on the etch stop layer and an insert portion protruding from the layer portion to be inserted into the opening of the etch stop layer; forming a bottom electrode layer on the layer portion of the barrier layer opposite to the etch stop layer; forming a ferroelectric layer on the bottom electrode layer opposite to the barrier layer; and forming a top electrode layer on the ferroelectric layer opposite to the bottom electrode layer.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tzu-Yu CHEN, Chu-Jie HUANG, Yu-Wen LIAO, Sheng-Hung SHIH, Kuo-Chi TU
  • Publication number: 20250066582
    Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Yi-Hsuan TANG, Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Tzu-Yuan SHIH, Ka Chun AU-YEUNG
  • Patent number: 12228277
    Abstract: A light source module includes a light source and a reflective element. The light source has a light emitting surface. The reflective element is disposed on a transmission path of an illumination light beam emitted from the light source. The illumination light beam reflected by the reflective element is irradiated on a target plane. The reflective element includes a first reflective surface and a second reflective surface. The first reflective surface is disposed towards the light emitting surface of the light source, and is a plane. The second reflective surface bendably extends from the first reflective surface.
    Type: Grant
    Filed: March 28, 2024
    Date of Patent: February 18, 2025
    Assignee: CHAMP VISION DISPLAY INC.
    Inventors: Chun-Chien Liao, Hsin-Hung Lee, Chung-Hao Wu
  • Publication number: 20250051073
    Abstract: A food packaging barrier film is provided. The food packaging barrier film includes a base film, an inorganic laminated film formed on a surface of the base film, and a barrier coating layer formed on the inorganic laminated film. The inorganic laminated film includes at least one first inorganic material deposition layer and a second inorganic material deposition layer stacked upon each other, and the at least one first inorganic material deposition layer and the second inorganic material deposition layer are formed in a same vacuum deposition process and in a vacuum condition. The at least one first inorganic material deposition layer and the second inorganic material deposition layer are respectively formed by different inorganic metal oxides in the same vacuum deposition process. The barrier coating layer is formed by coating a barrier coating solution on the inorganic laminated film and then curing the barrier coating solution.
    Type: Application
    Filed: October 29, 2024
    Publication date: February 13, 2025
    Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN
  • Publication number: 20250044270
    Abstract: A system for notifying environmental pollution status includes wireless environment sensing devices and a portable wireless environmental pollution status notification device. The wireless environment sensing devices, respectively arranged in the different sensing locations of a physical environment, respectively store the sensing locations and respectively sense pollution related information corresponding to the different sensing locations to output the pollution related information and the sensing locations corresponding thereto. The portable wireless environmental pollution status notification device, wirelessly connected to the plurality of wireless environment sensing devices and located in the physical environment, receives the pollution related information and the sensing locations corresponding thereto and generates notification signals based on the pollution related information and the sensing locations corresponding thereto.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 6, 2025
    Inventors: CHIA-JUI YANG, HERMAN CHUNGHWA RAO, CHUN-CHIEH KUO, HUA-PEI CHIANG, SHUI-SHU HSIAO, ZHENG-XIANG CHANG, CHYI-DAR JANG, TSUNG-JEN WANG, CHE-YU LIAO, CHIH-MIN CHAN, TENG-CHIEH YANG, CHANG-HUNG HSU