Abstract: A method for fabricating a chip package structure is disclosed. One or plural patterned plates are used to fabricate the inner circuits and the outer circuits, and some fabricating steps can be proceeded repeatedly to form a stack structure, and after a protective layer is formed, the carrier is removed. Using the plate as a mask to fabricate the circuits can enhance the yield and simplify the fabricating processes of the package. Further, the removed carrier can be recycled to reduce the production cost.

Abstract: An optics lens structure of LED printer head has a light array mould includes a plurality of LED array and driving chip array mounted at a printed circuit board formed at least two orientation points; and a stationary barrier comprising a housing and fastening parts installed at bottom of the housing which is imbedded an optics rod lens array on the top and has at least two orientation points; wherein the orientation points of the printed circuit board are according to the orientation points of the housing for assembling the light array mould and the stationary barrier.

Abstract: A full-color scanning-type LED display is provided, including a scanning LED module, a projection screen and a structure frame. The scanning LED module further includes a red LED row having a plurality of red LEDs, a green LED row having a plurality of green LEDs, a blue LED row having a plurality of blue LEDs, a driver for driving the red, green, and blue LED rows, a plurality of metal conductive lines for connecting these elements of the scanning LED module, and a micro lens structure for focusing and projecting the light emitted from the red, green and blue LED rows. The driver further includes a driving IC and a serving motor. The projection screen is placed at an appropriate distance from scanning LED module, and both are engaged at the fixed distance by the structure frame.