Patents by Inventor Hung Wang

Hung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149438
    Abstract: A semiconductor structure includes a first dielectric layer, a first conductive feature, a second conductive feature, a first etch stop layer, and a conductive via. The first conductive feature and the second conductive feature are embedded in the first dielectric layer. The first etch stop layer is disposed over the dielectric layer. The conductive via is surrounded by the first etch stop layer and electrically connected to the first conductive feature, in which the conductive via is in contact with a top surface of the first etch stop layer.
    Type: Application
    Filed: January 7, 2025
    Publication date: May 8, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Ren WANG, Tze-Liang LEE, Jen-Hung WANG
  • Patent number: 12295126
    Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may heat them when their temperatures fall outside of thermal operating ranges. To mitigate some risk associated with heating, the data processing system may proactively calibrate temperature sensors used to guide the heating process.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: May 6, 2025
    Assignee: Dell Products L.P.
    Inventors: Curtis Ray Genz, Yu-Hung Wang, Nicole Mutesi, Randy Alton Frazier, Donald W. Gerhart
  • Publication number: 20250138144
    Abstract: A time division duplexed (TDD) frequency modulation continuous wave (FMCW) radar system includes P transmitter circuit chains and M receiver circuit chains. The P transmitter circuit chains are used to transmit a plurality of FMCW signals. A pth transmitter circuit chain is coupled to a single pole Op throw (SPQPT) radio frequency (RF) switch, the SPOT RF switch is coupled to Op antennas, Qp and P are positive integers, and p is a positive integer not larger than P. The M receiver circuit chains are used to receive a plurality of reflected FMCW signals. An mth receiver circuit chain is coupled to a single pole Nm throw (SPNmT) radio frequency (RF) switch, the SPNmT RF switch is coupled to Nm antennas, Nm and M are positive integers, and m is a positive integer not larger than M.
    Type: Application
    Filed: September 26, 2024
    Publication date: May 1, 2025
    Applicant: KaiKuTek INC.
    Inventors: Mike Chun-Hung Wang, Yi-Chu Chen, Tun-Yen Liao, Zi-Hao Fu, Hsiang-Chieh Jhan, Yi-Ting Tseng, Chun-Hsuan Kuo, Wei-Chi Li, Sheng-Tse Tai, Wei-Ming Sun, Pei-Ming Cai
  • Publication number: 20250134754
    Abstract: A muscle relaxation device includes a main body unit and an air inflation unit. The main body unit has an axis a predetermined length along the axis, and a predetermined width perpendicular to the axis. The main body unit includes an inflatable member defining an inflation space, and a structural reinforcement layer covering an outer surface of the inflatable member and made of a material different from that of the inflatable member. The inflatable member is changeable between an inflated state, in which air pressure in the inflation space ranges from 2 psi to 35 psi, and a deflated state, in which the air pressure in the inflation space is less than 2 psi. The air inflation unit is connected to the main body unit for guiding air into and out of the inflation space.
    Type: Application
    Filed: March 20, 2024
    Publication date: May 1, 2025
    Inventor: Chih-Hung Wang
  • Patent number: 12276137
    Abstract: A stepless adjustable electronic device locking apparatus has a fixing member, a stage adjusting mechanism, a driving mechanism, an unlocking member, and a lock. The driving mechanism selectively opens the fixing member to engage in an anti-theft hole based on a current one of working stages to which the stage adjusting mechanism adjusts. The unlocking member is able to close the fixing member. By separating adjustment of the working stages and movement of the fixing member, the movements of the fixing member do not interfere in the working stages. Therefore, the unlocking member can be applied to the driving mechanism to unlock. The fixing member can be closed to disengage from the anti-theft hole through the unlocking member without being reversely rotated and adjusting the working stages, so as to unlocking quickly.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: April 15, 2025
    Assignee: Sinox Co., Ltd
    Inventors: Chia-Hung Wang, Chia-Ming Wu, Kuo-Kuang Pan
  • Publication number: 20250102621
    Abstract: In a radar sensor, a transmitting antenna is configured to radiate a transmitted RF signal, a receiving antenna is configured to receive a reflected RF signal from a target, and a frontend circuit is configured to calculate the distance between the target and the radar sensor by measuring the frequency shift between the transmitted RF signal and the reflected RF signal. The frontend circuit includes a crystal-less signal synthesizer configured to generate the transmitted RF signal without using a crystal, and a mixer configured to provide an IF-band signal associated with the frequency shift between the transmitted RF signal and the reflected RF signal by mixing the reflected RF signal and the transmitted RF signal.
    Type: Application
    Filed: April 8, 2024
    Publication date: March 27, 2025
    Applicant: KaiKuTek INC.
    Inventors: Mike Chun-Hung Wang, Yi-Chu Chen, Tun-Yen Liao, Yi-Ting Tseng, Wei-Chi Li
  • Publication number: 20250104195
    Abstract: The present invention relates to an ultrasound image enhancement processing system and method thereof. The ultrasound image enhancement processing system includes at least one first ultrasound device and at least one server apparatus. The server apparatus receives a first ultrasound original image file, processes the first ultrasound original image file through a speckle reduction algorithm to generate a first processed image file, and performs a deep learning training on the first ultrasound original image file and the first processed image file to generate a first neural network model. The first neural network learning module is used to output a first speckle reduction enhancement image file. The image content of the first speckle reduction enhancement image file is approximating to the image content of the first processed image file.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Inventors: Ting Lin, Chih-Hung WANG, Ming-Hsiao YAO, Kuan-Chieh WANG, Szu-Tien YU
  • Patent number: 12255095
    Abstract: A semiconductor structure including a substrate, a first dielectric layer, a first conductive feature, an etch stop layer, a second dielectric layer and a second conductive feature is provided. The first dielectric layer is disposed over the substrate. The first conductive feature is disposed in the first dielectric layer. The etch stop layer is disposed over the first dielectric layer and the first conductive feature, wherein the etch stop layer comprises a metal-containing layer and a silicon-containing layer, the metal-containing layer is located between the first dielectric layer and the silicon-containing layer, the metal-containing layer comprises a nitride-containing region and an oxide-containing region, and the nitride-containing region contacts the first conductive feature. The second dielectric layer is disposed over the etch stop layer. The second conductive feature penetrates the second dielectric layer and electrically connects with the first conductive feature.
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Kai Lin, Su-Jen Sung, Tze-Liang Lee, Jen-Hung Wang
  • Patent number: 12255201
    Abstract: Electrostatic discharge (ESD) structures are provided. An ESD structure includes a semiconductor substrate, a first epitaxy region with a first type of conductivity over the semiconductor substrate, a second epitaxy region with a second type of conductivity over the semiconductor substrate, and a plurality of semiconductor layers. The semiconductor layers are stacked over the semiconductor substrate and between the first and second epitaxy regions. A first conductive feature is formed over the first epitaxy region and outside an oxide diffusion region. A second conductive feature is formed over the second epitaxy region and outside the oxide diffusion region. A third conductive feature is formed over the first epitaxy region and within the oxide diffusion region. A fourth conductive feature is formed over the second epitaxy region and within the oxide diffusion region. The oxide diffusion region is disposed between the first and second conductive features.
    Type: Grant
    Filed: November 28, 2023
    Date of Patent: March 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Chia Hsu, Tung-Heng Hsieh, Yung-Feng Chang, Bao-Ru Young, Jam-Wem Lee, Chih-Hung Wang
  • Patent number: 12245872
    Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: March 11, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih Lung Lin, Kuei-Hao Tseng, Te Kao Tsui, Kai Hung Wang, Hung-I Lin
  • Publication number: 20250078537
    Abstract: The present invention relates to a license plate identification system and method thereof. The license plate identification system comprises at least a server apparatus storing at least one license plate picture file to be identified and a plurality of license plate sample picture files. Each of the license plate sample picture files has a double-row of character. Through deep learning training, the system generates a neural network model, inputs the license plate picture file to be identified into the neural network model for outputting analysis result information, and decodes the analysis result information through a decoding algorithm to obtain an identification license plate character content.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 6, 2025
    Inventors: Ting Lin, Chih-Hung WANG, Ming-Hsiao YAO, Kuan-Chieh WANG, Szu-Tien YU
  • Publication number: 20250080894
    Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element having a channel, a first cover at least covering the channel, and a transducing element connected with the flexible element. The transducing element is configured to convert energy from one form to another to deform and affect the flexible element to adjust a dimension of the first cover.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuei-Hao TSENG, Kai Hung WANG, Chih Lung LIN
  • Publication number: 20250081371
    Abstract: An adjustable and changeable modular control panel includes a supporting dock, and at least one control unit. The supporting dock includes a main connecting member, and a plurality of receiving areas. Each of the receiving areas has a first connector, and a plurality of first positioning portions. The first connector of the receiving area is electrically connected to the main connecting member. The at least one control unit is mated with one of the receiving areas. Each of the control units has a control switch on its top side. The bottom side of each of the control units has a second connector, and a plurality of second positioning portions. The control switch is electrically connected to the second connector. The second connector is selectively mated with the first connector. The second positioning portions can be correspondingly located on the first positioning portions.
    Type: Application
    Filed: December 28, 2023
    Publication date: March 6, 2025
    Inventors: WEI-HAO TENG, MING-HUNG WANG
  • Publication number: 20250080895
    Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element and a deformable element configured to convert energy from one form to make the flexible element compliant with a user's skin.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 6, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kai Hung WANG, Kuei-Hao TSENG, Chih Lung LIN
  • Patent number: 12243565
    Abstract: A two-dimensional magnetic recording (TDMR) read head includes a lower reader and an upper reader. Each of the lower reader and the upper reader may have a dual free layer (DFL) magnetic tunnel junction structure having first and second free layers located between lower and upper shields. A synthetic antiferromagnetic (SAF) structure is located on a side of each magnetic tunnel junction. A sidewall insulating layer is located between the lower soft bias layer of the SAF structure and the first free layer. The sidewall insulating layer can have a reduced height such that an upper soft bias layer of the SAF structure is in direct contact with a sidewall of the second free layer, or the upper portion of the sidewall insulating layer located between the upper soft bias layer of the SAF structure and the sidewall of the second free layer has a reduced thickness.
    Type: Grant
    Filed: August 14, 2023
    Date of Patent: March 4, 2025
    Assignee: Western Digital Technologies, Inc.
    Inventors: Chih-Ching Hu, Yung-Hung Wang, Ming Mao, Ming Jiang, Yukimasa Okada, Goncalo Baiao de Albuquerque
  • Patent number: 12237224
    Abstract: An improved method of forming conductive features and a semiconductor device formed by the same are disclosed. In an embodiment, a method includes forming a metal line extending through a first dielectric layer, the metal line being electrically coupled to a transistor; selectively depositing a sacrificial material over the metal line; selectively depositing a first dielectric material over the first dielectric layer and adjacent to the sacrificial material; selectively depositing a second dielectric material over the first dielectric material; removing the sacrificial material to form a first recess exposing the metal line; and forming a metal via in the first recess and electrically coupled to the metal line.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Wei-Ren Wang, Jen Hung Wang, Tze-Liang Lee
  • Patent number: 12230567
    Abstract: A semiconductor structure includes a first dielectric layer, a first conductive feature, a second conductive feature, a first etch stop layer, and a conductive via. The first conductive feature and the second conductive feature are embedded in the first dielectric layer. The first etch stop layer is disposed over the dielectric layer. The conductive via is surrounded by the first etch stop layer and electrically connected to the first conductive feature, in which the conductive via is in contact with a top surface of the first etch stop layer.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Ren Wang, Tze-Liang Lee, Jen-Hung Wang
  • Patent number: 12230585
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. An alignment process is performed on a first semiconductor workpiece and a second semiconductor workpiece by virtue of a plurality of workpiece pins. The first semiconductor workpiece is bonded to the second semiconductor workpiece. A shift value is determined between the first and second semiconductor workpieces by virtue of a first plurality of alignment marks on the first semiconductor workpiece and a second plurality of alignment marks on the second semiconductor workpiece. A layer of an integrated circuit (IC) structure is formed over the second semiconductor workpiece based at least in part on the shift value.
    Type: Grant
    Filed: January 24, 2024
    Date of Patent: February 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
  • Publication number: 20250050339
    Abstract: A system includes a control module and a microfluidics chip. The control module includes electromagnets. The microfluidics chip includes two bead sets, a substrate, a channel layer disposed on the substrate, and a flow-control layer disposed on the channel layer. The channel layer has a central recess, channels in communication with the central recess, and cavities in communication with the channels. The flow-control layer has through holes aligned with the cavities of the channel layer. The through holes and the cavities cooperatively form wells. The flow-control layer includes micro-valves corresponding in position to the channels, and magnetic components connected to the micro-valves. A sample is disposed in one of the wells, and the bead sets are coated with aptamers and attach to another two of the wells. The electromagnets control the micro-valves to allow flow of the sample and to allow the sample to be mixed with the bead sets.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 13, 2025
    Applicant: National Tsing Hua University
    Inventors: Gwo-Bin LEE, Chien-Hsin CHIU, Chih-Hung WANG
  • Publication number: 20250020833
    Abstract: There is provided a lens including a first curved surface and a second curved surface. The first curved surface and the second curved surface have different focal distances and are arranged interlacedly along a radial direction of the lens.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Inventors: HUI-HSUAN CHEN, YEN-HUNG WANG, WEN-YEN SU