Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Abstract: A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.

Abstract: An electronic door lock is provided and includes a housing, a movable latch assembly, a telescopic rod, a driving member, an elastic member and a driving assembly. The telescopic rod is arranged in the movable latch assembly, and the elastic member is connected to the movable latch assembly and the driving assembly. The elastic member is driven by the driving assembly to drive the movable latch assembly, so that the telescopic rod located in the movable latch assembly can be controlled to retract or protrude from the movable latch assembly and the movable latch assembly is in a locked mode or an unlocked mode. In the unlocked mode, the driving member can push the telescopic rod to drive the movable latch assembly to move. Therefore, the problem that the driving assembly must accurately calculate the operating time can be solved and damage to the driving assembly can be prevented.

Abstract: Disclosed herein is a battery module comprising a plurality of battery cells encased in an outer shell. The outer shell has disposed on an inner surface a flame retardant layer that comprises expandable graphite. The expandable graphite is operative to expand during an thermal event that results in an increase in battery module temperature. Disclosed herein too is a method comprising disposing in a battery module a flame retardant layer; where the battery module comprises a plurality of battery cells encased in an outer shell. The outer shell has disposed on an inner surface a flame retardant layer that comprises expandable graphite. The expandable graphite is operative to expand during an thermal event that results in an increase in battery module temperature.

Abstract: An example apparatus includes a first flexible portion connected to a second flexible portion. The first flexible portion includes a keyboard having a set of input keys disposed thereon and circuitry coupled to the set of input keys, the first flexible portion is to couple to a portable computing device proximal to a display side of the portable computing device. The second flexible portion has a plurality of fasteners to couple to a kickstand of the portable computing device, the first and second flexible portion to provide an opposing force there between while the kickstand is disposed at one of a plurality of variable support angles.

Abstract: A battery system includes a power cell and a heat exchanger abutting the power cell. The heat exchanger includes a cooling medium reservoir, a heat exchange member, and a wicking structure disposed between the cooling medium reservoir and the heat exchange member. The wicking structure provides a fluid pathway from the cooling medium reservoir to the heat exchange member and from the heat exchange member to the cooling medium reservoir.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Abstract: A method for CMP includes following operations. A dielectric structure is received. The dielectric structure includes a metal layer stack formed therein. The metal layer stack includes at least a first metal layer and a second metal layer, and the first metal layer and the second metal layer are exposed through a surface of the dielectric structure. A first composition is provided to remove a portion of the first metal layer from the surface of the dielectric structure. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed from the second metal layer. A CMP operation is performed to remove a portion of the second metal layer. In some embodiments, the protecting layer protects the second metal layer during the removal of the portion of the first metal layer.

Abstract: A heating apparatus is provided. The heating apparatus includes a positive temperature coefficient (PTC) heating element and a power controller configured to generate and apply a pulse width modified signal to the PTC heating element. The power controller is configured to vary a current of the pulse width modified signal linearly with respect to a temperature of a space being heated by the PTC heating element.

Abstract: A control system of a vehicle comprising: i) a plurality of adjustable aerodynamic control devices associated with the vehicle; ii) a fuel economy sensor configured to determine a first fuel economy measurement; and iii) an aerodynamic device controller module configured to adjust a first one of the plurality of adjustable aerodynamic control devices and to receive from the fuel economy sensor a second fuel economy measurement. The aerodynamic device controller module stores in an onboard database state information corresponding to settings of the plurality of adjustable aerodynamic control devices if the second fuel economy measurement is an improvement over the first fuel economy measurement.

Abstract: A fingerprint identification apparatus, including a light path adjustment element, an optical filter layer, and an image sensor, is provided. The light path adjustment element is disposed on a transmission path of an image beam from a fingerprint of a user. The optical filter layer is disposed on a transmission path of the image beam from the light path adjustment element. The optical filter layer has openings. An inclined image beam in the image beam is obliquely incident to the light path adjustment element. The light path adjustment element adjusts a light path of the inclined image beam to be transmitted to the openings along a normal direction. The image sensor is disposed on a transmission path of the image beam from the optical filter layer. The image sensor has pixels. Positions of the pixels respectively correspond to positions of the openings.

Abstract: The present invention relates to a sensing circuit with signal compensation, which comprises a first sensing element, a second sensing element and a differential amplifying circuit, the differential amplifying circuit generates an output signal through a differential compensation according to a common mode voltage, a first sensing signal and a second sensing signal. Hereby, reducing the noise of the sensing circuit is achieved, and the interference of the display driving signal may be effectively improved.

Abstract: Methods and apparatus are provided for heating a vehicle window to remove ice and condensation using a carbon nanotube heating pad. The apparatus includes a user interface operative to receive a user request, a vehicle windshield, a heating pad wherein the heating pad includes a carbon nanotube heating element and a reflective surface and is oriented such that the carbon nanotube heating element is directed towards the windshield, a power supply operative to supply power to the carbon nanotube heating element in response to a control signal, and a processor operative to generate the control signal in response to the user request.

Abstract: A vascular jet cooling system for use with a planar power module and a coolant supply includes a manifold housing and one or more jet impingement plates. The manifold housing is constructed of a dielectric polymer molding material, and defines a coolant inlet port configured to fluidly connect to the coolant supply, an internal cavity in fluid communication with the coolant inlet port and containing the power module, and a coolant outlet port in fluid communication with the internal cavity. The jet impingement plate(s) is arranged in the internal cavity. Openings of the plates direct coolant passing through the coolant inlet port onto a respective major surface of the power module. A power module assembly includes a planar power module and the vascular jet cooling system. A method of constructing the power module assembly uses sacrificial materials and overmolding of the jet impingement plates.

Abstract: A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.

Abstract: A heat pipe is provided for cooling an electronic component of a printed circuit board. The heat pipe includes a tube having an inner diameter surface defining a bore, with the tube having first and second ends along the bore. The heat pipe further includes a sorbent material coated onto the inner diameter surface of the tube, a first liquid contained within the bore, and a second liquid adsorbed by the sorbent material. The second liquid has a second boiling temperature that is higher than a first boiling temperature of the first liquid. The first liquid vaporizes into a first vapor, in response to the tube receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material and vaporizes into a second vapor in response to the second liquid reaching the second boiling temperature.