Abstract: Methods for manufacturing semiconductor devices according to embodiments of the present invention may include providing a sacrificial substrate including a wiring region and a device region, sequentially forming a sacrificial layer and a buffer layer on the sacrificial substrate, forming a thin-film transistor on the buffer layer of the device region, forming a device protection element surrounding the thin-film transistor within the device region, forming a flexible substrate on the buffer layer, and exposing a surface of the buffer layer by separating the sacrificial substrate by removing the sacrificial layer. Since typical semiconductor process technologies may be directly used, the process compatibility may be improved, and semiconductor devices having high resolution and high performance may be manufactured.

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

Abstract: Provided are a spatial light modulator (SLM) and a method of fabricating the same. The complex spatial light modulator includes a thin film transistor (TFT) layer provided on a substrate, an amplitude type SLM and a phase type SLM electrically connected to the TFT layer, and a first polarizer provided on the phase type SLM, wherein the TFT layer includes transistors electrically connected to the amplitude type SLM and the phase type SLM, respectively, and the amplitude type SLM and the phase type SLM are commonly and electrically connected to the TFT layer and driven.

Abstract: Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.

Abstract: An organic light emitting device is provided that includes a substrate; an embossing layer provided on the substrate; a planarization layer provided on the embossing layer; a first electrode provided on the planarization layer; an organic light emitting layer provided on the first electrode; and a second electrode provided on the organic light emitting layer. The planarization layer may include a first planarization layer provided on the embossing layer; and a second planarization layer provided on the first planarization layer. The embossing layer may have a refractive index ranging from about 1.3 to about 1.5. The planarization layer may include a first planarization layer having a surface roughness of about 10 nm to about 50 nm and a refractive index that ranges from about 1.8 to about 2.5; and a second planarization layer provided on the first planarization layer and having a surface roughness of less than about 10 nm.

Abstract: Provided are a display device and a driving method thereof. The driving method of a display device including first pixels emitting lights or transmitting and reflecting an external light, and second pixels corresponding to the first pixels respectively, includes calculating light emission amounts necessary for the respective first pixels for realizing an image signal, receiving the light information on the amount of the external light incident to the first and second pixels, calculating a reflection light amount of a reflection device according to the external light amount, comparing the light emission amounts necessary for the respective first pixels with the reflection light amount, and adjusting light emission amounts of the respective first pixels according to a result of the comparing.

Abstract: Provided is a metal oxide thin film forming method including: vaporizing a first metal oxide precursor; allowing the vaporized first metal oxide precursor to flow into a mixture chamber by using a first carrier gas; injecting the flowed first metal oxide precursor on a substrate through a micro nozzle connected to the mixture chamber to form a first metal oxide precursor layer on the substrate; and emitting electromagnetic waves to the first metal oxide precursor layer to form a first metal oxide layer.

Abstract: Provided is a display device and a method of manufacturing the same. The display device includes a thin film transistor, a first electrode electrically connected to the thin film transistor, a self-light emitting pixel layer disposed on the first electrode, a second electrode disposed on the self-light emitting pixel layer, a substrate in which an auxiliary wire is buried, the substrate being disposed on the second electrode, and a reflective pixel layer disposed on the substrate.

Abstract: Provided is a method of manufacturing an organic light-emitting device including a graphene layer. The method of manufacturing an organic light-emitting device according to the present invention may include providing a graphene donor unit including a patterned graphene layer, providing a device unit, and attaching the graphene layer of the graphene donor unit to an organic part. The device unit may include a substrate, a lower electrode, and the organic part which are sequentially stacked, and the organic part may include a dopant. The graphene donor unit may include the graphene layer, a release layer, and an elastic stamp layer which are sequentially stacked.

Abstract: Provided is a stretchable devices. The stretchable device includes a first stretchable substrate having a first wavy surface that wrinkles in a first direction; first wiring lines extending along the first wavy surface in the first direction; a second stretchable substrate having a second wavy surface that faces the first wavy surface and wrinkles in a second direction intersecting the first direction, wherein the second stretchable substrate is disposed on the first stretchable substrate; second wiring lines extending along the second wavy surface in the second direction; and interlayer insulating layers disposed on the intersections of the first wiring lines and the second wiring lines and disposed between the first wiring lines and the second wiring lines.

Abstract: Provided is a method for fabricating a flexible display device. The method includes attaching a shape memory alloy film memorizing a shape thereof as a curved shape at a shape memory temperature or lower to a flexible substrate at a temperature higher than the shape memory temperature, forming a display device on the flexible substrate, and returning the shape memory alloy to the curved shape to remove the shape memory alloy film from the flexible substrate.

Abstract: Provided is a method of manufacturing a flexible substrate allowing an electronic device to be mounted thereto. The method of manufacturing a flexible substrate allowing an electronic device to be mountable thereto, includes preparing a substrate, applying a force to the substrate to stretch the substrate in horizontal direction, performing a surface treatment process on the substrate and forming a first region having a plurality of wavy surfaces, and forming an electrode on the first region.

Abstract: Provided is a dual-mode display including a substrate and a plurality of sub-pixels on the substrate, in which each sub-pixel includes an emissive device, a color selection reflector disposed on one side of the emissive device, and an optical shutter disposed on another side of the emissive device, wherein the emissive device includes a cathode and an anode, and the cathode and the anode include a carbon-based material including graphene sheets, graphene flakes, and graphene platelets, and a binary or ternary transparent conductive oxide including indium oxide, tin oxide, and zinc oxide.

Abstract: Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.

Abstract: Provided is an organic light emitting device. The organic light emitting device comprising a first light emitting part on a substrate, emitting a first light of a first wavelength, wherein the first light emitting part includes a transparent first electrode, a first organic light emitting layer, and a transparent second electrode sequentially stacked on the substrate, a second light emitting part on the first light emitting part, emitting a second light of a second wavelength, wherein the second light emitting part includes a transparent third electrode, a second organic light emitting layer, and a reflective fourth electrode sequentially stacked on the first light emitting part, and a fluorescent material disposed at least one between the substrate and the first light emitting part, and between the first light emitting part and second light emitting part.

Abstract: The inventive concept provides light emitting devices and methods of manufacturing a light emitting device. The light emitting device may include a transparent substrate including a first region and a second region, a first transparent electrode disposed on a first surface of the transparent substrate, a second transparent electrode facing and spaced apart from the first transparent electrode, an organic light emitting layer disposed between the first and second transparent electrodes, an assistant electrode disposed between the first and second transparent electrodes and selectively masking the second region, and a light path changing structure disposed on a second surface of the transparent substrate and selectively masking the second region.

Abstract: The inventive concept provides organic light emitting diodes and methods of manufacturing an organic light emitting diode. The organic light emitting diode includes a substrate, a first electrode layer and a second electrode layer formed on the substrate, an organic light emitting layer disposed between the first electrode layer and the second electrode layer and generating light, and a scattering layer between the first electrode layer and the substrate or between the first electrode layer and the organic light emitting layer. The scattering layer scatters the light.

Abstract: Disclosed are dual mode display devices and methods of manufacturing the same. The dual mode display device may include a first substrate, a first electrode on the first substrate, a second substrate opposite to the first electrode and the first substrate, a second electrode between the second substrate and the first electrode, a third electrode between the first electrode and the second electrode, an optic switching layer between the first electrode and the third electrode, and an organic light-emitting layer between the second electrode and the third electrode.

Abstract: The inventive concept provides light emitting devices and methods of manufacturing a light emitting device. The light emitting device may include a transparent substrate including a first region and a second region, a first transparent electrode disposed on a first surface of the transparent substrate, a second transparent electrode facing and spaced apart from the first transparent electrode, an organic light emitting layer disposed between the first and second transparent electrodes, an assistant electrode disposed between the first and second transparent electrodes and selectively masking the second region, and a light path changing structure disposed on a second surface of the transparent substrate and selectively masking the second region.

Abstract: Provided is a method of manufacturing a gradually stretchable substrate. The method includes forming convex regions and concave regions on a top surface of a stretchable substrate by compressing a mold onto the stretchable substrate and forming non-stretchable patterns by filling the concave regions of the stretchable substrate. The stretchable substrate includes a stretchable region defined by the non-stretchable patterns, the non-stretchable patterns have side surfaces in contact with the stretchable region, and the side surfaces of the non-stretchable patterns are formed of protrusions and a non-protrusion between the protrusions repetitively connected to one another.