Abstract: A user terminal device includes a display; at least one sensor; a communication module; and a processor operatively connected to the display, the at least one sensor, and the communication module, wherein the processor is configured to, based on receiving a user utterance voice, determine whether or not a response screen corresponding to the user utterance voice is able to be provided through the display on the basis of at least one of a sensed value obtained from the at least one sensor or an inactive period of the display, based on determining that the response screen is unable to be provided through the display, receive current status information of at least one external device connected to the user terminal device through the communication module, determine one external device among the at least one external device to display the response screen on the basis of the current status information of the at least one external device, obtain the response screen to the user utterance voice, and transmit the respo

Abstract: A cleaner includes a suction motor that generates suction force, a dust separation unit that is disposed under the suction motor and separates dust from air, a handle disposed behind the suction motor, and a battery disposed under the handle and behind the dust separation unit to supply power to the suction motor.

Abstract: A cleaner includes: a suction unit; a suction motor that generates suction force for sucking air through the suction unit and includes an impeller; a dust separation unit that includes one or more cyclone units generating cyclonic flow to separate dust from air flowing inside through the suction unit; a dust container that stores dust separated by the dust separation unit and is disposed under the suction motor; a battery disposed behind the dust container to supply power to the suction motor; and a handle disposed behind the suction motor, wherein a rotational axis of the impeller and an axis of the cyclonic flow vertically extend and an extension line from the rotational axis of the impeller passes through the one or more cyclone units.

Abstract: A cleaner includes: a suction motor that generates suction force; a dust separation unit that separates dust from air sucked by the suction force; a motor housing that covers the suction motor; a flow guide that surrounds an outer side of the motor housing and guides air discharged from the dust separation unit to the suction motor; and a body that forms an external appearance by surrounding the flow guide and guides air discharged from the suction motor together with the flow guide.

Abstract: A cleaner includes: a suction unit; a suction motor that generates suction force for sucking air through the suction unit and includes an impeller; a dust separation unit that includes one or more cyclone units generating cyclonic flow to separate dust from air flowing inside through the suction unit; a dust container that stores dust separated by the dust separation unit and is disposed under the suction motor; a battery disposed behind the dust container to supply power to the suction motor; and a handle disposed behind the suction motor, wherein a rotational axis of the impeller and an axis of the cyclonic flow vertically extend and an extension line from the rotational axis of the impeller passes through the one or more cyclone units.

Abstract: A redistribution substrate may include a first interconnection layer having a first insulating pattern, a first dummy pattern and a second dummy pattern, the first and second dummy patterns being in the first insulating pattern, and a second interconnection layer stacked on the first interconnection layer, the second interconnection layer having a second insulating pattern, a signal pattern and a power/ground pattern, the signal and power/ground patterns being in the second insulating pattern. The first dummy pattern may be located below the signal pattern, and the second dummy pattern may be located below the power/ground pattern. The first dummy pattern may include dot patterns, and the second dummy pattern may include a plate pattern.

Abstract: A user terminal device includes a display; at least one sensor; a communication module; and a processor operatively connected to the display, the at least one sensor, and the communication module, wherein the processor is configured to, based on receiving a user utterance voice, determine whether or not a response screen corresponding to the user utterance voice is able to be provided through the display on the basis of at least one of a sensed value obtained from the at least one sensor or an inactive period of the display, based on determining that the response screen is unable to be provided through the display, receive current status information of at least one external device connected to the user terminal device through the communication module, determine one external device among the at least one external device to display the response screen on the basis of the current status information of the at least one external device, obtain the response screen to the user utterance voice, and transmit the respo

Abstract: According to various embodiments, an electronic device comprising a memory; a communication module; and a processor, operatively connected to the memory and the communication module, and configured to, if a locked state of the electronic device and a first state of the electronic device are identified, when a first user utterance is acquired that requests a task executable in an unlocked state of the electronic device, change an unlocking type of the electronic device to an unlocking type of an external device, based on first information of the external device, the external device being communicatively connected to the electronic device through the communication module, unlock the electronic device, which is configured with the unlocking type of the external device, based on user authentication information acquired from the external device, and execute the task corresponding to the first user utterance. Various other embodiments may be provided.

Abstract: A semiconductor package includes: a package substrate; a first semiconductor chip disposed on the package substrate; a heat-dissipation pattern disposed on the first semiconductor chip; a first mold layer disposed on the package substrate and at least partially surrounding the first semiconductor chip and the heat-dissipation pattern; a redistribution layer disposed on the first mold layer; a penetration electrode penetrating the first mold layer and coupled to the package substrate; and a connection pattern disposed on the penetration electrode, and connecting the redistribution layer to the penetration electrode, wherein a top surface of the heat-dissipation pattern and a top surface of the connection pattern are exposed by the first mold layer.

Abstract: Disclosed are semiconductor packages and fabrication methods thereof. The semiconductor package may include a lower substrate, a lower semiconductor chip, a redistribution layer, an upper semiconductor chip, and a through electrode. The lower substrate may include a first dielectric layer, a first conductive pattern having a wiring pattern and an under-bump pattern, a second dielectric layer, and a second conductive pattern. The under-bump pattern may include a first head part and a first tail part. The first head part may have a first lateral surface on the first dielectric layer that is inclined to a top surface of the first dielectric layer. The second conductive pattern may have a second lateral surface on the second dielectric layer that is perpendicular to a top surface of the second dielectric layer.

Abstract: A semiconductor package is disclosed. The semiconductor package may include a first redistribution substrate including a first insulating layer and a first redistribution pattern, a lower semiconductor chip mounted on the first redistribution substrate, a conductive structure disposed on the first redistribution substrate and horizontally spaced apart from the lower semiconductor chip, a first mold layer interposed between the first redistribution substrate and the second redistribution substrate to cover the lower semiconductor chip and the conductive structure, a second redistribution substrate on the first redistribution substrate, the second redistribution substrate including a second insulating layer and a second redistribution pattern, a first heat-dissipation pattern interposed between the lower semiconductor chip and the second insulating layer, and a heat-dissipation pad on the conductive structure.

Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a first molding layer on the first redistribution substrate and covering a top surface and lateral surfaces of the first semiconductor chip, a second redistribution substrate on the first molding layer, and an adhesive film between the second redistribution substrate and the first molding layer. The adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer. A lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate.

Abstract: An electronic device is provided. The electronic device includes a processor and a memory storing instructions which, when executed by the processor, cause the processor to obtain information of a wireless audio device wirelessly connectable to the electronic device, determine whether an utterance of a user is a device-controlling utterance for a target device which is a target of remote control in response to the information of the wireless audio device, and suggest switching a connection of the wireless audio device to the target device based on an intent in the utterance of the user. Other example embodiments, in addition to the foregoing example embodiment, are also applicable.

Abstract: A semiconductor package including: a first substrate and a semiconductor device on the first substrate, wherein the first substrate includes: a first dielectric layer including a first hole; a second dielectric layer on the first dielectric layer and including a second hole that overlaps the first hole, the second hole being wider than the first hole; an under bump disposed in the first hole and the second hole, the under bump covering a portion of the second dielectric layer; and a connection member bonded to the under bump.

Abstract: According to an example embodiment, an electronic device includes: a memory storing instructions and a processor electrically connected to the memory and configured to execute the instructions. The instructions, when executed by the processor, cause the processor to: determine whether an utterance is a device-controlling utterance for a target device to be remotely controlled, verify a distance between the electronic device and the target device based on the utterance being the device-controlling utterance, and output an object generated differently based on whether the distance is a short distance less than or equal to a specified distance or a long distance greater than the specified distance.

Abstract: A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, a redistribution insulating layer covering a top surface and a side surface of the under-bump pattern, a protection pattern interposed between the top surface of the under-bump pattern and the redistribution insulating layer, and interposed between the side surface of the under-bump pattern and the redistribution insulating layer, and a redistribution pattern on the under-bump pattern. The outer terminal may be disposed on a bottom surface of the under-bump pattern.

Abstract: An electronic device and method are disclosed herein. The electronic device includes a communication circuit, a processor, and a memory. The processor implements the method, including: receiving, from each of one or more external devices receiving a voice signal of a user, via the communication circuit, a first probability value based on usage frequency, and a second probability value based on signal-to-noise (SNR) magnitude, calculating final probability values for each of the one or more external devices, based on respective first and second probability values of each of the one or more external devices, and selecting an external device from among the one or more external devices having a highest final probability value from among the calculated final probability values.

Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a first molding layer on the first redistribution substrate and covering a top surface and lateral surfaces of the first semiconductor chip, a second redistribution substrate on the first molding layer, and an adhesive film between the second redistribution substrate and the first molding layer. The adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer. A lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate.