Abstract: Disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. A material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.

Abstract: A semiconductor package includes a redistribution substrate including a conductive structure having a lower conductive pattern and a redistribution structure electrically connected to the lower conductive pattern, on the lower conductive pattern, an insulating structure covering at least a side surface of the redistribution structure, and a protective layer between the lower conductive pattern and the insulating structure, a semiconductor chip on the redistribution substrate, and a lower connection pattern below the redistribution substrate and electrically connected to the lower conductive pattern. The protective layer includes a first portion in contact with at least a portion of an upper surface of the lower conductive pattern, and a second portion in contact with at least a portion of a side surface of the lower conductive pattern.

Abstract: A semiconductor package includes a semiconductor chip, a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer including a plurality of lower insulating layers, a plurality of lower redistribution patterns, and a plurality of lower conductive vias, a lower passivation layer disposed under the lower redistribution layer and provided with a recess at a bottom surface of the lower passivation layer, an under bump metallization (UBM) pad disposed in the first recess, a UBM protective layer disposed in the first recess and connected to the lower conductive vias while covering a top surface and opposite side surfaces of the UBM pad, and an outer connecting terminal connected to a bottom surface of the UBM pad. The bottom surface of the UBM pad is positioned at a first depth from the bottom surface of the lower passivation layer.

Abstract: A semiconductor package comprises a first redistribution substrate including first interconnection layers sequentially stacked on each other, a semiconductor chip mounted on the first redistribution substrate, a mold layer disposed on the first redistribution substrate and surrounding the semiconductor chip, a second redistribution substrate disposed on the mold layer and including second interconnection layers sequentially stacked on each other, a connection terminal disposed beside the semiconductor chip to connect the first and second redistribution substrates to each other, and outer terminals disposed on a bottom surface of the first redistribution substrate. Each of the first and second interconnection layers may include an insulating layer and a wire pattern in the insulating layer. The first redistribution substrate may have substantially the same thickness as the second redistribution substrate, and the first interconnection layers may be thinner than the second interconnection layers.

Abstract: A cleaner includes: a suction motor that generates suction force; a dust separation unit disposed under the suction motor and separates dust from air; a handle disposed behind the suction motor; and a battery disposed under the handle and behind the dust separation unit to supply power to the suction motor.

Abstract: An electronic device is provided. The electronic device includes a voice input device, a communication circuit, a display, a processor operatively connected to the voice input device, the communication circuit, and the display, and a memory operatively connected to the processor. The memory may store one or more instructions that, when executed, cause the processor to receive a first utterance from a first user through the voice input device, to communicatively connect to a first external electronic device based on the first utterance, to display, to the display, a first user interface indicating a state of communicatively connecting to the first external electronic device, and to display, to the display, a second user interface indicating that the electronic device and the second external electronic device are simultaneously connected to the first external electronic device when the first external electronic device is communicatively connected to a second external electronic device.

Abstract: An image sensor package includes a glass substrate configured to focus incident light, a first redistribution layer and a second redistribution layer both disposed under the glass substrate while being horizontally spaced apart from each other by a first distance, an image sensor disposed such that an upper surface thereof is vertically spaced apart from both a lower surface of the first redistribution layer and a lower surface of the second redistribution layer by a second distance, and a first connector that connects both the first redistribution layer and the second redistribution layer to the image sensor. The thickness of the glass substrate is 0.6 to 0.8 mm. The first distance is smaller than the horizontal length of the image sensor by 50 ?m to 1 mm. The second distance is equal to or less than 0.1 mm.

Abstract: A cleaner includes: a main body that has an opening; a suction motor that is disposed in the main body and generates suction force; and a filter unit that includes an exhaust filter for filtering air discharged from the suction motor, the filter unit being inserted into the main body through the opening and being separated from the main body, wherein when the filter unit is combined with the main body, a portion of the filter unit protrudes out of the main body, and a portion of the exhaust filter is positioned inside the main body and the other portion of the exhaust filter is positioned outside the main body.

Abstract: A cleaner includes: a suction unit; a suction motor that generates suction force for sucking air through the suction unit and includes an impeller; a dust separation unit that includes one or more cyclone units generating cyclonic flow to separate dust from air flowing inside through the suction unit; a dust container that stores dust separated by the dust separation unit and is disposed under the suction motor; a battery disposed behind the dust container to supply power to the suction motor; and a handle disposed behind the suction motor, wherein a rotational axis of the impeller and an axis of the cyclonic flow vertically extend and an extension line from the rotational axis of the impeller passes through the one or more cyclone units.

Abstract: A method for manufacturing a display device including providing a protection resin having a base resin, a first initiator, and a second initiator to the non-display area, irradiating light having a first wavelength region to the protection resin to form a preliminary protection layer, bending the flexible substrate so that the bending part has a first curvature radius, and additionally curing the preliminary protection layer to form a protection layer.

Abstract: Described are methods for the production and use of cryopreservable double negative T cells (DNTs) for the treatment of cancer as an off-the-shelf cellular therapy. A sample population of DNTs is expanded using DNTs from one or more donors. The expanded population of DNTs from different donors does not exhibit alloreactivity against allogenic cells in the expanded population. The expanded populations of DNTs can be long-term stored as cryopreserved products.

Abstract: A cleaner includes: a main body that has an opening; a suction motor that is disposed in the main body and generates suction force; and a filter unit that includes an exhaust filter for filtering air discharged from the suction motor, the filter unit being inserted into the main body through the opening and being separated from the main body, wherein when the filter unit is combined with the main body, a portion of the filter unit protrudes out of the main body, and a portion of the exhaust filter is positioned inside the main body and the other portion of the exhaust filter is positioned outside the main body.

Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a first molding layer on the first redistribution substrate and covering a top surface and lateral surfaces of the first semiconductor chip, a second redistribution substrate on the first molding layer, and an adhesive film between the second redistribution substrate and the first molding layer. The adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer. A lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate.

Abstract: A cleaner includes: a suction unit; a suction motor that generates suction force for sucking air through the suction unit and includes an impeller; a dust separation unit that includes one or more cyclone units generating cyclonic flow to separate dust from air flowing inside through the suction unit; a dust container that stores dust separated by the dust separation unit and is disposed under the suction motor; a battery disposed behind the dust container to supply power to the suction motor; and a handle disposed behind the suction motor, wherein a rotational axis of the impeller and an axis of the cyclonic flow vertically extend and an extension line from the rotational axis of the impeller passes through the one or more cyclone units.