Patents by Inventor Hyo-san Lee

Hyo-san Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10576582
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
  • Patent number: 10525566
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: January 7, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki Hong, Yung-jun Kim, Sung-oh Park, Hyo-san Lee, Joo-han Lee, Kyu-min Oh, Sun-gyu Park, Seh-kwang Lee, Chan-ki Yang
  • Patent number: 10395951
    Abstract: In a method of cleaning a substrate, a protecting liquid may be sprayed to a surface of the substrate from a first position in a first spray direction. Cleaning droplets may be injected on to the surface of the substrate. The protecting liquid may be sprayed to the surface of the substrate from a second position different from the first position in a second spray direction. For example, the protecting liquid may be always sprayed from the central portion toward the edge portions in the substrate so that the protecting liquid on the substrate may have a uniform thickness.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-Hoon Kim, Kyoung-Seob Kim, Dong-Chul Kim, Hyo-San Lee
  • Publication number: 20190241844
    Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.
    Type: Application
    Filed: January 17, 2019
    Publication date: August 8, 2019
    Inventors: Mi Hyun PARK, Jung-Min OH, Young-Hoo KIM, Hyo San LEE, Tae Keun KIM, Ye Rim YEON, Hae Rim OH, Ji Soo JEONG, Min Hee CHO
  • Patent number: 10332762
    Abstract: A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: June 25, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-hoo Kim, Il-sang Lee, In-gi Kim, Kyoung-hwan Kim, Hyo-san Lee, Sang-won Bae, Tae-hong Kim, Yong-jun Choi
  • Publication number: 20190019669
    Abstract: Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.
    Type: Application
    Filed: September 18, 2018
    Publication date: January 17, 2019
    Inventors: Ji-Hoon JEONG, Jung-Min OH, Kun-Tack LEE, Hyo-San LEE
  • Publication number: 20180311764
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 1, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo KIM, Il-Sang LEE, Yong-sun KO, Chang-Gil RYU, Kun-Tack LEE, Hyo-San LEE
  • Patent number: 10083829
    Abstract: Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: September 25, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Hoon Jeong, Jung-Min Oh, Kun-Tack Lee, Hyo-San Lee
  • Publication number: 20180267409
    Abstract: A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.
    Type: Application
    Filed: May 23, 2018
    Publication date: September 20, 2018
    Applicant: DONGWOO FINE-CHEM
    Inventors: Jung-Min OH, Mi-Hyun PARK, Hyo-San LEE, Ji-Hoon JEONG, Yong-Sun KO, In-Gi KIM, Na-Rim KIM, Sang-Tae KIM, Seong-Min KIM, Kyong-Ho LEE
  • Patent number: 10029332
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: July 24, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
  • Patent number: 10025192
    Abstract: A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: July 17, 2018
    Assignees: SAMSUNG ELECTRONICS CO., LTD., DONGWOO FINE-CHEM
    Inventors: Jung-Min Oh, Mi-Hyun Park, Hyo-San Lee, Ji-Hoon Jeong, Yong-Sun Ko, In-Gi Kim, Na-Rim Kim, Sang-Tae Kim, Seong-Min Kim, Kyong-Ho Lee
  • Publication number: 20180104792
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Application
    Filed: May 23, 2017
    Publication date: April 19, 2018
    Applicant: EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki HONG, Yung-jun KIM, Sung-oh PARK, Hyo-san LEE, Joo-han LEE, Kyu-min Oh, Sun-gyu PARK, Seh-kwang LEE, Chan-ki YANG
  • Publication number: 20180028936
    Abstract: A source supplier includes a source reservoir that contains a liquefied source fluid for a supercritical process, a vaporizer that vaporizes the liquefied source fluid into a gaseous source fluid under high pressure, a purifier that removes organic impurities and moistures from the gaseous source fluid and an analyzer connected to the purifier that analyzes an impurity fraction and a moisture fraction in the gaseous source fluid. Moisture and organic impurities are removed from the source fluid to reduce the moisture concentration of the supercritical fluid in the supercritical process.
    Type: Application
    Filed: April 7, 2017
    Publication date: February 1, 2018
    Inventors: JUNG-MIN OH, JI-HOON JEONG, DONG-GYUN HAN, KUN-TACK LEE, HYO-SAN LEE, YONG-MYUNG JUN
  • Publication number: 20170330770
    Abstract: In a method of cleaning a substrate, a protecting liquid may be sprayed to a surface of the substrate from a first position in a first spray direction. Cleaning droplets may be injected on to the surface of the substrate. The protecting liquid may be sprayed to the surface of the substrate from a second position different from the first position in a second spray direction. For example, the protecting liquid may be always sprayed from the central portion toward the edge portions in the substrate so that the protecting liquid on the substrate may have a uniform thickness.
    Type: Application
    Filed: February 24, 2017
    Publication date: November 16, 2017
    Inventors: Seok-Hoon KIM, Kyoung-Seob KIM, Dong-Chul KIM, Hyo-San LEE
  • Patent number: 9754806
    Abstract: Provided are an apparatus and method for treating wafers using a supercritical fluid. The wafer treatment apparatus includes a plurality of chambers; a first supply supplying a first fluid in a supercritical state; a second supply supplying a mixture of the first fluid and a second fluid; a plurality of first and second valves; and a controller selecting a first chamber of the plurality of chambers for wafer treatment to control the open/closed state of each of the plurality of first valves so that the first fluid can be supplied only to the first chamber of the plurality of chambers and selecting a second chamber of the plurality of chambers to control the open/closed state of each of the plurality of second valves so that the mixture of the first fluid and a second fluid can be supplied only to the second chamber of the plurality of chambers.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 5, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo-San Lee, Chang-ki Hong, Kun-tack Lee, Jeong-nam Han
  • Publication number: 20170110316
    Abstract: A method of cleaning a substrate includes providing the substrate, the substrate including a metal material film, performing physical cleaning of the substrate, performing chemical cleaning of the substrate, and drying a surface of the substrate. Performing the chemical cleaning includes supplying a chemical cleaning solution including an anionic surfactant at a concentration that is equal to or greater than a critical micelle concentration (CMC) onto the surface of the substrate.
    Type: Application
    Filed: August 16, 2016
    Publication date: April 20, 2017
    Inventors: Mi-hyun PARK, Jung-min OH, Kyoung-hwan KIM, In-gi KIM, Hyo-san LEE, Ji-hoon JEONG, Kyoung-seob KIM, Seok-hoon KIM
  • Publication number: 20170069513
    Abstract: A semiconductor cleaning process system includes a process chamber configured to hold a semiconductor substrate, a cleaning solution supply unit configured to provide a cleaning solution to the process chamber, the cleaning solution including an organic fluoride, an organic acid and an organic solvent, a recycling unit configured to collect the cleaning solution discharged from the process chamber, a first concentration measuring unit configured to evaluate a fluorine concentration of a collected solution in the recycling unit, and a sub-cleaning solution supply unit configured to provide the organic fluoride to the cleaning solution supply unit based on the fluorine concentration evaluated by the first concentration measuring unit.
    Type: Application
    Filed: May 31, 2016
    Publication date: March 9, 2017
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jung-Min OH, Mi-Hyun PARK, ln-Gi KIM, Ji-Hoon JEONG, Seok-Hoon KIM, Hyo-San LEE
  • Publication number: 20170062242
    Abstract: A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.
    Type: Application
    Filed: June 3, 2016
    Publication date: March 2, 2017
    Inventors: YOUNG-HOO KIM, IL-SANG LEE, IN-GI KIM, KYOUNG-HWAN KIM, HYO-SAN LEE, SANG-WON BAE, TAE-HONG KIM, YONG-JUN CHOI
  • Publication number: 20170008040
    Abstract: Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which the supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.
    Type: Application
    Filed: March 15, 2016
    Publication date: January 12, 2017
    Inventors: Ji-Hoon JEONG, Jung-Min OH, Kun-Tack LEE, Hyo-San LEE
  • Publication number: 20160315019
    Abstract: A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 27, 2016
    Inventors: Jung-Min OH, Mi-Hyun PARK, Hyo-San LEE, Ji-Hoon JEONG, Yong-Sun KO, In-Gi KIM, Na-Rim KIM, Sang-Tae KIM, Seong-Min KIM, Kyong-Ho LEE