Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Abstract: A display device includes pixels each of which includes a first pixel electrode; a first connection electrode disposed on the first pixel electrode; a second connection electrode spaced apart from the first pixel electrode; a second pixel electrode disposed on the second connection electrode; first light emitting elements disposed between the first pixel electrode and the first connection electrode; and second light emitting elements disposed between the second connection electrode and the second pixel electrode. The first connection electrode is electrically connected to the second connection electrode.

Abstract: The display device includes a substrate, a thin-film transistor on the substrate and including a first electrode, a second electrode and a semiconductor layer, a first insulating layer on the thin-film transistor, an organic layer on the first insulating layer, at least one light-emitting element on the organic layer, a pixel electrode on the organic layer and in contact with a side surface of the at least one light-emitting element, a planarization layer on the side surface of the at least one light-emitting element and a common electrode on the at least one light-emitting element and the planarization layer.

Abstract: Provided is a display device including a base layer, a pixel circuit disposed on the base layer, a pixel electrode electrically connected to the pixel circuit, a middle layer disposed on the pixel electrode and including a polymer resin layer and a conductive layer, a plurality of light emitting diodes disposed on the conductive layer and electrically connected to the pixel electrode, and a common electrode configured to cover the plurality of light emitting diodes and electrically connected to the plurality of light emitting diodes. Each of the plurality of light emitting diodes includes a first electrode, a light generating layer, and a second electrode sequentially stacked in a thickness direction of the base layer.

Abstract: A display device includes: a substrate; a first pixel electrode on the substrate; a second pixel electrode on the substrate and spaced apart from the first pixel electrode; a first light emitting element on the first pixel electrode and configured to emit first light; a first connection electrode on the second pixel electrode; a first partition wall between a side surface of the first light emitting element and a side surface of the first connection electrode; a second light emitting element on the first connection electrode and configured to emit second light; and a common electrode on an upper surface of the first light emitting element and an upper surface of the second light emitting element.

Abstract: A display device and a method of fabricating the same are disclosed, the display device includes a first metal layer on a substrate; light emitting elements emitting light of a first color, each of the light emitting elements having a first end contacting the first metal layer; an insulating layer disposed on the first metal layer and including holes exposing a second end of each of the light emitting elements facing the first metal layer; and a light conversion layer disposed in at least one of the holes and overlapping the light emitting elements. The light conversion layer converts the light of the first color emitted from the light emitting elements into light of a second color.

Abstract: A display device includes bank patterns disposed on a substrate, a light emitting element disposed between the bank patterns on the substrate, and a color wheel disposed on the light emitting element. The light emitting element and the bank patterns include a same material.

Abstract: Provided is a display device including a base layer, a pixel circuit disposed on the base layer, a pixel electrode electrically connected to the pixel circuit, a middle layer disposed on the pixel electrode and including a polymer resin layer and a conductive layer, a plurality of light emitting diodes disposed on the conductive layer and electrically connected to the pixel electrode, and a common electrode configured to cover the plurality of light emitting diodes and electrically connected to the plurality of light emitting diodes. Each of the plurality of light emitting diodes includes a first electrode, a light generating layer, and a second electrode sequentially stacked in a thickness direction of the base layer.

Abstract: A display device includes anode electrodes spaced apart from each other on a substrate, light emitting elements on the anode electrodes, mask layers on some of the light emitting elements, an insulating layer on the substrate and the anode electrodes and surrounding the light emitting elements, and a cathode electrode on the insulating layer and contacting some of the light emitting elements and the mask layers, the light emitting elements include first light emitting elements on a first anode electrode and emitting light of a first color, and second light emitting elements on the first anode electrode and emitting light of a second color, and third light emitting elements on the first anode electrode and emitting light of a third color, and the mask layer includes a first mask layer on the second light emitting elements, and a second mask layer on the third light emitting elements.

Abstract: A display device includes a first pixel, a second pixel, and a third pixel, bank patterns disposed on a substrate, light-emitting elements disposed between the bank patterns, color conversion layers disposed on the light-emitting elements between the bank patterns, and protective layers disposed on the color conversion layers, wherein the protective layers in the first pixel, the second pixel, and the third pixel have different thicknesses.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A display device includes pixels that are arranged in a display area in a first direction and a second direction and that include first electrodes separated from each other and light emitting elements electrically connected to the first electrodes; second electrodes that are arranged separately from each other in the first direction and are electrically connected to the light emitting elements of the pixels arranged in the second direction; a first pad part including a first pad electrically connected to the first electrodes; and a second pad part including second pads electrically connected to different second electrodes among the second electrodes.

Abstract: A display includes a pixel electrode disposed on a substrate, a light emitting element disposed on the pixel electrode, a connection electrode disposed on a side surface of the light emitting element, and a common electrode disposed on the light emitting element. The light emitting element includes a first sub light emitting element, a second sub light emitting element disposed on the first sub light emitting element, and a third sub light emitting element disposed on the second sub light emitting element. The connection electrode is disposed on at least one side surface of the first sub light emitting element, the second sub light emitting element, and the third sub light emitting element.

Abstract: A display device includes a substrate, a first electrode disposed on the substrate, a bonding electrode disposed on the first electrode and electrically connected to the first electrode, a light emitting element disposed on the bonding electrode and including a first end contacting with the bonding electrode, and a second end disposed opposite to the first end in a longitudinal direction, a first insulating layer covering a side surface of the light emitting element and not covering the second end of the light emitting element such that the second end of the light emitting element is exposed, a second electrode covering the first insulating layer and the second end of the light emitting element, a first bank disposed on a portion of the second electrode, and a second bank disposed on the first bank, and the first bank and the second bank include metal.

Abstract: A display device includes a first electrode disposed on a substrate. A light blocking layer is disposed on the substrate, the light blocking layer includes a recessed portion recessed toward the first electrode. Holes exposing the first electrode are formed in the recessed portion of the light blocking layer. Light emitting elements are disposed in the holes, each of the light emitting elements including a first end electrically contacting the first electrode. A second electrode is disposed on the light blocking layer, the second electrode electrically contacts a second end of each of the light emitting elements. A light conversion pattern is disposed in the recessed portion of the light blocking layer.

Abstract: Disclosed are display panels and methods of fabricating the same. The display panel includes a base substrate having a pixel area and a peripheral area adjacent to the pixel area, a light emitting element on the base substrate to generate a first light and overlapping the pixel area, a light control layer on the light emitting element to convert the first light into a white light, and a color filter layer on the light control layer and includes a first color filter that allows penetration of the first light, a second color filter that allows penetration of a second light different from the first light, and a third color filter that allows penetration of a third light different from the first light and the second light.

Abstract: A display device and a manufacturing method of a display device are provided. A display device includes a base substrate; an electrode on the base substrate, a light emitting element on the base substrate and electrically connected to the electrode, and a solution layer between the base substrate and the light emitting element, the solution layer including a light blocking material.

Abstract: Provided is a display device including a base layer, a pixel circuit disposed on the base layer, a pixel electrode electrically connected to the pixel circuit, a middle layer disposed on the pixel electrode and including a polymer resin layer and a conductive layer, a plurality of light emitting diodes disposed on the conductive layer and electrically connected to the pixel electrode, and a common electrode configured to cover the plurality of light emitting diodes and electrically connected to the plurality of light emitting diodes. Each of the plurality of light emitting diodes includes a first electrode, a light generating layer, and a second electrode sequentially stacked in a thickness direction of the base layer.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A display device includes a backplane line disposed on a substrate, a protective layer overlapping the backplane line, a first electrode disposed on the protective layer, a light emitting element electrically connected to the first electrode, and a reflective pattern including a reflective material and disposed between the substrate and the first electrode, the reflective pattern overlaps the backplane line in a plan view.