Abstract: A display device includes pixel electrodes disposed on a substrate, light-emitting diode elements disposed on the pixel electrodes, an insulating film disposed on at least a side of each of the pixel electrodes and disposed on at least a side of each of the light-emitting diode elements, partition walls disposed on the insulating film, and a common electrode disposed on the partition walls and the light-emitting diode elements.

Abstract: In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.

Abstract: A display device includes a display panel including a first area and a second area spaced apart from the first area in a plan view. The display panel includes a first base layer including a first pixel, a second base layer facing the first base layer and including a second pixel, a first signal line electrically connected to the first pixel of the first area, a second signal line electrically connected to the second pixel of the second area, and a connection line electrically connecting the first signal line and the second signal line.

Abstract: A display device, includes: a substrate including a plurality of pixel areas each having an emission area; and a pixel provided in each of the pixel areas, wherein the pixel comprises: at least one light emitting element on a first surface of the substrate; a first insulating layer on the light emitting element; at least one transistor on the first insulating layer and electrically connected to the light emitting element; a second insulating layer on the transistor; a common electrode on the second insulating layer; and a pixel electrode on a third insulating layer of the common electrode and electrically connected to the transistor, wherein the light emitting element comprises a semiconductor structure on the substrate, and first and second electrodes on the semiconductor structure to be spaced apart from each other.

Abstract: A display device includes pixels each of which includes a first pixel electrode; a first connection electrode disposed on the first pixel electrode; a second connection electrode spaced apart from the first pixel electrode; a second pixel electrode disposed on the second connection electrode; first light emitting elements disposed between the first pixel electrode and the first connection electrode; and second light emitting elements disposed between the second connection electrode and the second pixel electrode. The first connection electrode is electrically connected to the second connection electrode.

Abstract: A display device and a method of manufacturing the display device are proposed. The method may include disposing light emitting elements on a first transfer film; stretching the first transfer film so that the plurality of light emitting elements are spaced apart from each other; transferring the light emitting elements onto a thin film transistor array substrate; and removing the transfer film from the light emitting elements.

Abstract: A display device and a method of fabricating the same are disclosed, the display device includes a first metal layer on a substrate; light emitting elements emitting light of a first color, each of the light emitting elements having a first end contacting the first metal layer; an insulating layer disposed on the first metal layer and including holes exposing a second end of each of the light emitting elements facing the first metal layer; and a light conversion layer disposed in at least one of the holes and overlapping the light emitting elements. The light conversion layer converts the light of the first color emitted from the light emitting elements into light of a second color.

Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Abstract: An organic light emitting diode (“OLED”) display device includes a substrate having a display region including a plurality of sub-pixel regions. A peripheral region at least partially surrounds the display region. A sub-pixel structure is disposed in each of the plurality of sub-pixel regions on the substrate. A circuit structure is disposed within the substrate in the sub-pixel region, and is located adjacent to the peripheral region.

Abstract: Disclosed are display panels and methods of fabricating the same. The display panel includes a base substrate having a pixel area and a peripheral area adjacent to the pixel area, a light emitting element on the base substrate to generate a first light and overlapping the pixel area, a light control layer on the light emitting element to convert the first light into a white light, and a color filter layer on the light control layer and includes a first color filter that allows penetration of the first light, a second color filter that allows penetration of a second light different from the first light, and a third color filter that allows penetration of a third light different from the first light and the second light.

Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Abstract: A display device includes: a semiconductor layer including source (SR), drain (DR), and channel (CR) regions; a first insulating layer (FIL) on the semiconductor layer; a gate line on the FIL and overlapping the CR; a second insulating layer (SIL) on the gate line; a first contact hole (FCH) in the FIL and the SIL, and exposing the SR; a data line on the SIL and contacting the SR; a third insulating layer (TIL) on the data line; a second contact hole (SCH) in the first to third insulating layers and exposing the DR; a drain electrode on the TIL and contacting the DR; a color filter on the TIL and not overlapping the SCH; a pixel electrode (PE) on the color filter and contacting the drain electrode; and an organic layer on the TIL and the PE. Upper surfaces of the organic layer and the PE are substantially coplanar.

Abstract: A display device and a method of manufacturing the same are provided. The display device includes a first electrode disposed on a substrate, an adhesive auxiliary layer disposed on the first electrode and including a self-assembled monolayer, a light emitting element disposed on the adhesive auxiliary layer, and a contact electrode disposed between the adhesive auxiliary layer and the light emitting element. The light emitting element includes a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer, and an intermediate layer disposed between the first semiconductor layer and the second semiconductor layer.

Abstract: Provided is a display device including a base layer, a pixel circuit disposed on the base layer, a pixel electrode electrically connected to the pixel circuit, a middle layer disposed on the pixel electrode and including a polymer resin layer and a conductive layer, a plurality of light emitting diodes disposed on the conductive layer and electrically connected to the pixel electrode, and a common electrode configured to cover the plurality of light emitting diodes and electrically connected to the plurality of light emitting diodes. Each of the plurality of light emitting diodes includes a first electrode, a light generating layer, and a second electrode sequentially stacked in a thickness direction of the base layer.

Abstract: A display device and a manufacturing method of a display device are provided. A display device includes a base substrate; an electrode on the base substrate, a light emitting element on the base substrate and electrically connected to the electrode, and a solution layer between the base substrate and the light emitting element, the solution layer including a light blocking material.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: An organic light emitting diode (“OLED”) display device includes a substrate having a display region including a plurality of sub-pixel regions. A peripheral region at least partially surrounds the display region. A sub-pixel structure is disposed in each of the plurality of sub-pixel regions on the substrate. A circuit structure is disposed within the substrate in the sub-pixel region, and is located adjacent to the peripheral region.

Abstract: A light emitting device includes a first electrode, an insulating layer, a second electrode, and a bar-type light emitting diode (LED). The insulating layer includes a plurality of protruding parts protruding from the first electrode and at least one hole between the protruding parts. The second electrode on the insulating layer. The bar-type LED is in the at least one hole. The bar-type LED has a first end and a second end in the length direction. One of the first or second ends is connected to the first electrode and the other of the first or second ends is connected to the second electrode.

Abstract: A display device includes: a semiconductor layer including source (SR), drain (DR), and channel (CR) regions; a first insulating layer (FIL) on the semiconductor layer; a gate line on the FIL and overlapping the CR; a second insulating layer (SIL) on the gate line; a first contact hole (FCH) in the FIL and the SIL, and exposing the SR; a data line on the SIL and contacting the SR; a third insulating layer (TIL) on the data line; a second contact hole (SCH) in the first to third insulating layers and exposing the DR; a drain electrode on the TIL and contacting the DR; a color filter on the TIL and not overlapping the SCH; a pixel electrode (PE) on the color filter and contacting the drain electrode; and an organic layer on the TIL and the PE. Upper surfaces of the organic layer and the PE are substantially coplanar.