Abstract: A light emitting device includes a first electrode, an insulating layer, a second electrode, and a bar-type light emitting diode (LED). The insulating layer includes a plurality of protruding parts protruding from the first electrode and at least one hole between the protruding parts. The second electrode on the insulating layer. The bar-type LED is in the at least one hole. The bar-type LED has a first end and a second end in the length direction. One of the first or second ends is connected to the first electrode and the other of the first or second ends is connected to the second electrode.

Abstract: A transistor display panel includes a substrate, a gate line disposed on the substrate, a data line disposed on the substrate, and a transistor disposed on the substrate. The transistor includes a first electrode, a second electrode overlapping the first electrode, a semiconductor layer disposed between the first electrode and the second electrode, and a gate electrode. The semiconductor layer is disposed in an overlapping region where the gate line and the data line overlap each other.

Abstract: A light emitting device includes a first electrode, an insulating layer, a second electrode, and a bar-type light emitting diode (LED). The insulating layer includes a plurality of protruding parts protruding from the first electrode and at least one hole between the protruding parts. The second electrode on the insulating layer. The bar-type LED is in the at least one hole. The bar-type LED has a first end and a second end in the length direction. One of the first or second ends is connected to the first electrode and the other of the first or second ends is connected to the second electrode.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A transistor display panel includes a substrate, a gate line disposed on the substrate, a data line disposed on the substrate, and a transistor disposed on the substrate. The transistor includes a first electrode, a second electrode overlapping the first electrode, a semiconductor layer disposed between the first electrode and the second electrode, and a gate electrode. The semiconductor layer is disposed in an overlapping region where the gate line and the data line overlap each other.

Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Abstract: In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.

Abstract: A light emitting device includes a first electrode, an insulating layer, a second electrode, and a bar-type light emitting diode (LED). The insulating layer includes a plurality of protruding parts protruding from the first electrode and at least one hole between the protruding parts. The second electrode on the insulating layer. The bar-type LED is in the at least one hole. The bar-type LED has a first end and a second end in the length direction. One of the first or second ends is connected to the first electrode and the other of the first or second ends is connected to the second electrode.

Abstract: An electronic package structure includes a substrate having a plurality of conductive leads. A discharge hole is disposed to extend through the substrate. An electronic chip is electrically connected to the plurality of conductive leads. A case is connected to the substrate and defines a cavity between the substrate and an upper of the case. The discharge hole and the electronic chip are disposed within the cavity, and the discharge hole is open to the outside in the electronic package structure. The discharge hole is configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the electronic package structure.

Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.

Abstract: A display device having a substrate including a first display area, a second display area, a non-display area disposed adjacent to the first and second display areas, a plurality of first pixels disposed in the first display area, a plurality of second pixels disposed in the second display area, a first groove disposed in the non-display area and recessed downward from an upper surface of the substrate, a first flexible film disposed in the first groove, and a plurality of pad electrodes disposed on the first flexible film in the non-display area between the first and second display areas and connecting the first pixels are connected to the second pixels in a row.

Abstract: In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

Abstract: In one embodiment, a semiconductor device includes a single layer substrate having an insulation layer and conductive patterns on a first surface of the insulation layer. A semiconductor die is attached on a first surface of the single layer substrate and electrically connected to the conductive patterns. Conductive bumps are also on the first surface of the single layer substrate and electrically connected to the semiconductor die through the conductive patterns. An encapsulant overlaps at least portions of the first surface of the single layer substrate. The conductive bumps are at least partially exposed in the encapsulant.

Abstract: In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.

Abstract: A display apparatus includes a first display substrate, a second display substrate which faces the first display substrate and is coupled to the first display substrate, first and second spacers disposed on one of the first and second display substrates, and a transparent electrode disposed between the one of the first and second display substrates and the first spacer.

Abstract: In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

Abstract: A display device is provided. The display device includes a substrate including a pixel region, a thin film transistor formed on the substrate, a light blocking member formed at a boundary of the pixel region, and a pixel electrode formed in the pixel region, the pixel electrode connected to the thin film transistor. The display device also includes a common electrode formed on the light blocking member, the common electrode spaced apart from the pixel electrode with a microcavity interposed between the common electrode and the pixel electrode, and a roof layer comprising a color filter formed on the common electrode. The display device further includes an opening formed in the common electrode and the roof layer to expose a portion of the microcavity, a liquid crystal filling the microcavity, and an overcoat formed on the roof layer to cover the opening and seal the microcavity for each pixel region.

Abstract: In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.

Abstract: A method to manufacture a display device, includes: forming, on a substrate of the display device, a sacrificial layer including a material, the material including at least one of amorphous carbon, a metal, and an inorganic material; forming a layer covering the sacrificial layer; forming an injection hole exposing the sacrificial layer; removing, via the injection hole, the sacrificial layer to form a microcavity; and disposing liquid crystal in the microcavity.