Patents by Inventor Hyung-jae Shin
Hyung-jae Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090154734Abstract: A method for fabricating a micro speaker is provided, including forming a package wafer and a device wafer by batch processing, bonding the package wafer and the device wafer to each other, and forming a diaphragm by isotropic-etching a back surface of the device wafer using a xenon difluoride (XeF2). As a result, a micro-electronic-mechanic system (MEMS) technology-based piezoelectric micro speaker having a wide frequency response range is realized, by batch processing, thereby providing simplified structure and processing and reducing fabricating cost.Type: ApplicationFiled: August 6, 2008Publication date: June 18, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byung-gil JEONG, Hyung-jae SHIN, Seok-whan CHUNG, Dong-kyun KIM
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Patent number: 7548144Abstract: A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.Type: GrantFiled: October 18, 2005Date of Patent: June 16, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Che-heung Kim, Hyung-jae Shin, Soon-cheol Kweon, Kyu-sik Kim, Sang-hun Lee
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Patent number: 7420135Abstract: A micro electro-mechanical system (MEMS) switch and a method for manufacturing the same are provided. The MEMS switch includes a substrate; signal lines formed on the substrate; main electrodes spaced apart by a distance and formed over the substrate; an actuating beam installed above the main electrodes at a certain height; a support unit to support the actuating beam; and sub-electrodes formed above the actuating beam at a distance from the actuating beam and facing the corresponding main electrodes. The method includes depositing and patterning a metal layer on a substrate; depositing and patterning a sacrificial layer to form actuator beam support holes and first sub-electrode contact holes; depositing and patterning an actuating beam layer on the sacrificial layer, thereby forming spacers; depositing and patterning second sub-electrode contact holes from another sacrificial layer; depositing and patterning a sub-electrode layer on the sacrificial layer; and removing the two sacrificial layers.Type: GrantFiled: January 3, 2006Date of Patent: September 2, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-hun Lee, Soon-cheol Kweon, Che-heung Kim, Hyung-jae Shin
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Patent number: 7342710Abstract: A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines.Type: GrantFiled: May 30, 2007Date of Patent: March 11, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Che-heung Kim, Hyung-jae Shin, Soon-cheol Kweon, Kyu-sik Kim, Sang-hun Lee
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Publication number: 20070227863Abstract: A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines.Type: ApplicationFiled: May 30, 2007Publication date: October 4, 2007Inventors: Che-heung Kim, Hyung-jae Shin, Soon-cheol Kweon, Kyu-sik Kim, Sang-hun Lee
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Patent number: 7251069Abstract: A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines.Type: GrantFiled: October 26, 2005Date of Patent: July 31, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Che-heung Kim, Hyung-jae Shin, Soon-cheol Kweon, Kyu-sik Kim, Sang-hun Lee
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Publication number: 20060181377Abstract: A switch pad for switching signal flow and a micro-switch having the same. The switch pad comprises a body formed so that as approaching opposite end portions from a central portion of the body, the body is more remotely spaced from a horizontal plane containing a top surface of the electrostatic driving unit. With the body of the switch pad formed in this manner, the switch pad can be more stably driven.Type: ApplicationFiled: February 2, 2006Publication date: August 17, 2006Inventors: Soon-cheol Kweon, Hyung-jae Shin, Che-heung Kim, Sang-hun Lee, Mark Da Silva, Siebe Bouwstra
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Publication number: 20060180409Abstract: A spring structure for supporting a floating member and a micro-structure having the same. The spring structure includes: at least one support post unit fixed to a substrate; and at least one spring unit having a first spring connected to the support post unit and extending in a predetermined direction from the support post unit, a second spring member connected to a floating member and extending in the same direction as the first spring unit from the floating member, and a connection member arranged normal to the first and second spring members and interconnecting the tip ends of the first and second spring members. Because the first spring member and the second spring member are arranged to be expanded or contracted along with the floating member when the temperature changes, the first and second spring members are not subject to stress caused due to the difference in thermal expansion coefficient.Type: ApplicationFiled: December 23, 2005Publication date: August 17, 2006Inventors: Soon-cheol Kweon, Hyung-jae Shin, Sang-hun Lee, Min-seog Choi, Che-heung Kim, Young-tack Houng
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Publication number: 20060144681Abstract: A micro electromechanical system (MEMS) switch and a method for manufacturing the same are provided. The MEMS switch includes a substrate; signal lines formed on the substrate; main electrodes spaced apart by a distance and formed over the substrate; an actuating beam installed above the main electrodes at a certain height; a support unit to support the actuating beam; and sub-electrodes formed above the actuating beam at a distance from the actuating beam and facing the corresponding main electrodes. The method includes depositing and patterning a metal layer on a substrate; depositing and patterning a sacrificial layer to form actuator beam support holes and first sub-electrode contact holes; depositing and patterning an actuating beam layer on the sacrificial layer, thereby forming spacers; depositing and patterning second sub-electrode contact holes from another sacrificial layer; depositing and patterning a sub-electrode layer on the sacrificial layer; and removing the two sacrificial layers.Type: ApplicationFiled: January 3, 2006Publication date: July 6, 2006Inventors: Sang-hun Lee, Soon-cheol Kweon, Che-heung Kim, Hyung-jae Shin
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Patent number: 7065867Abstract: A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method having a passivation layer includes depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame, depositing a first protection layer for preventing oxidation on the solder layer and forming a lid, preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device, and assembling the lid and the package base, heating, and sealing them. The protection layer is laminated on the solder layer that is formed by the lid, thereby preventing oxidation without using a flux. The low temperature hermetic sealing method having a passivation layer is suitable for sealing a device, such as the MEMS, which is sensitive to heat, water and other by-products.Type: GrantFiled: November 14, 2002Date of Patent: June 27, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Woon-bae Kim, Hyung-jae Shin, Chang-ho Cho, Seung-goo Kang
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Publication number: 20060132891Abstract: A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines.Type: ApplicationFiled: October 26, 2005Publication date: June 22, 2006Inventors: Che-heung Kim, Hyung-jae Shin, Soon-cheol Kweon, Kyu-sik Kim, Sang-hun Lee
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Publication number: 20060131147Abstract: A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.Type: ApplicationFiled: October 18, 2005Publication date: June 22, 2006Inventors: Che-heung Kim, Hyung-jae Shin, Soon-cheol Kweon, Kyu-sik Kim, Sang-hun Lee
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Patent number: 7049904Abstract: In a seesaw-type MEMS switch for radio frequency (RF) and a method for manufacturing the same, the seesaw-type MEMS switch for radio frequency (RF) includes a substrate, a transmission line formed on the substrate having a gap therein to provide a circuit open condition, an intermittent part formed a predetermined distance from the substrate, the intermittent part being operable to contact the transmission line on both sides of the gap by performing a seesaw movement about a seesaw movement axis, and a driving part to drive the seesaw movement of the intermittent part in response to a driving signal.Type: GrantFiled: June 3, 2004Date of Patent: May 23, 2006Assignee: Samsung Electronics Co., Ltd.Inventor: Hyung-jae Shin
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Publication number: 20060087716Abstract: A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.Type: ApplicationFiled: September 21, 2005Publication date: April 27, 2006Inventors: Soon-cheol Kweon, Hyung-jae Shin, Byung-hee Jeon, Seok-kwan Hong, Che-heung Kim, Sang-hun Lee
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Publication number: 20060012940Abstract: A MEMS RF-switch is provided for controlling switching on/off of transmission of AC signals. The MEMS RF-switch of the present invention includes: a first electrode coupled to one terminal of the power source; a semiconductor layer combined with an upper surface of the first electrode, and forming a potential barrier to become insulated when a bias signal is applied from the power source; and a second electrode disposed at a predetermined distance away from the semiconductor layer, and being coupled to the other terminal of the power source, wherein the second electrode contacts the semiconductor layer when a bias signal is applied from the power source. Therefore, although the bias signal may not be cut off, free electrons and holes are recombined in the semiconductor layer, whereby charge buildup and sticking can be prevented.Type: ApplicationFiled: July 13, 2005Publication date: January 19, 2006Inventors: Il-jong Song, Dong-ha Shim, Hyung-jae Shin, Soon-cheol Kweon, Che-heung Kim, Sang-hun Lee, Young-tack Hong
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Patent number: 6969639Abstract: A device that is hermetically sealed at a wafer level or a method of hermetically sealing a device, which is sensitive to high temperatures or affected by heating cycles. Semiconductor devices are formed on a wafer. A lid wafer is formed. Adhesives are formed in a predetermined position over the wafer and/or the lid wafer. The wafer and the lid wafer are sealed by the adhesives at the wafer level. The sealing may be performed at a low temperature using a solder to protect the devices sensitive to heat. The sealed devices are diced into individual chips. In the wafer level hermetic sealing method, a sawing operation is performed after the devices are sealed. Therefore, the overall processing time is reduced, devices are protected from the effects of moisture or particles, and devices having a moving structure, such as MEMS devices, are more easily handled.Type: GrantFiled: October 31, 2001Date of Patent: November 29, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-ho Cho, Hyung-jae Shin, Woon-bae Kim
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Publication number: 20050161757Abstract: A device that is hermetically sealed at a wafer level or a method of hermetically sealing a device, which is sensitive to high temperatures or affected by heating cycles. Semiconductor devices are formed on a wafer. A lid wafer is formed. Adhesives are formed in a predetermined position over the wafer and/or the lid wafer. The wafer and the lid wafer are sealed by the adhesives at the wafer level. The sealing may be performed at a low temperature using a solder to protect the devices sensitive to heat. The sealed devices are diced into individual chips. In the wafer level hermetic sealing method, a sawing operation is performed after the devices are sealed. Therefore, the overall processing time is reduced, devices are protected from the effects of moisture or particles, and devices having a moving structure, such as MEMS devices, are more easily handled.Type: ApplicationFiled: March 24, 2005Publication date: July 28, 2005Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang-ho Cho, Hyung-Jae Shin, Woon-bae Kim
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Patent number: 6906845Abstract: The micro-mechanical structure includes an anti-stiction layer formed by plasma enhanced chemical vapor deposition and plasma etching. The anti-stiction layer is selectively formed on only the area of a substrate other than the top of a movable structure and a part of an electrode that is subsequently bonded to a wire.Type: GrantFiled: October 23, 2003Date of Patent: June 14, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-ho Cho, Hyung-jae Shin, Woon-bae Kim
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Patent number: 6880936Abstract: A micro mirror device having a micro mirror that can slant with regard a plurality of rotation axes, and a projector employing such a micro mirror device, are provided. This micro mirror device includes a substrate; a plurality of address electrodes formed on the substrate, and a bias electrode for making the micro mirrors slant with regard to a plurality of rotation axes, together with the address electrodes; and a holding plate including a central portion for supporting a second post that supports the micro mirrors and at least one spring hinges transforming elastically when the micro mirrors slant with regard to the rotation axes, the holding plate held by first posts of predetermined numbers which are formed on the bias electrode.Type: GrantFiled: September 30, 2002Date of Patent: April 19, 2005Assignee: Samsung Electronics Co., Ltd.Inventor: Hyung-jae Shin
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Patent number: 6864876Abstract: A micro-mirror device for an image display apparatus which can change the travel path of incident light by pivoting a mirror, which corresponds to a pixel and can increase optical efficiency by pivoting the mirror in the direction of the sides of the mirror. The micro-mirror device for an image display apparatus includes a substrate, a landing pad provided on the substrate, and a pair of base electrodes provided on opposite sides of the landing pad. A pair of first posts protrude from the upper surface of the landing pad, and are isolated from each other by a predetermined interval. A girder, supported by the pair of first posts, pivots toward the sides of the base electrodes due to an electrostatic attraction. A second post protrudes from the upper surface of the girder. A mirror, which is supported by the second post, reflects incident light, and receives power via the landing pad.Type: GrantFiled: November 30, 2000Date of Patent: March 8, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-woo Shin, Soon-cheol Kweon, Hyung-jae Shin