Abstract: A display device includes a first conductive layer disposed on a substrate, a passivation layer disposed on the first conductive layer, a second conductive layer disposed on the passivation layer, a via layer disposed on the second conductive layer, a third conductive layer disposed on the via layer, the third conductive layer including a first electrode, a second electrode, a connection pattern, the first electrode, the second electrode, and the connection pattern being spaced apart from each other, and a light emitting element, a first end and a second end of the light emitting element being disposed on the first electrode and the second electrode, respectively, wherein the connection pattern electrically connects the first conductive layer and the second conductive layer through a first contact hole penetrating the via layer and the passivation layer.

Abstract: A display device includes: a substrate; a first conductive layer on the substrate and comprising a first signal line; an insulating layer pattern on the first conductive layer; a semiconductor pattern on the insulating layer pattern; a gate insulating layer on the semiconductor pattern; and a second conductive layer comprising a gate electrode on the gate insulting layer and a first source/drain electrode and a second source/drain electrode, each on at least a part of the semiconductor pattern, wherein the insulating layer pattern and the semiconductor pattern have a same planar shape, the semiconductor pattern comprises a channel region overlapping the gate electrode, a first source/drain region on a first side of the channel region and a second source/drain region on a second side of the channel region, and the first source/drain electrode electrically connects the first source/drain region and the first signal line.

Abstract: A display device according to an embodiment includes a light blocking layer disposed on a substrate; an oxygen supply layer disposed on and contacting the light blocking layer; a semiconductor layer disposed on the oxygen supply layer; and a light emitting diode electrically connected with the semiconductor layer. The semiconductor layer includes an oxide semiconductor, and the oxygen supply layer includes a metal oxide that includes at least one of indium, zinc, gallium, and tin.

Abstract: A method of manufacturing a multilayer metal plate by electroplating includes a first forming operation of forming one of a first metal layer and a second metal layer on a substrate by electroplating, wherein the second metal layer is less recrystallized than the first metal layer, the second metal layer is comprised of nanometer-size grains, and the second metal layer has a higher level of tensile strength than the first metal layer; and a second forming operation of forming, by electroplating, a third metal layer not formed in the first forming operation on a surface of one of the first metal layer and the second metal layer formed in the first forming operation.

Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.

Abstract: A hopper and method for transferring raw material, which can prevent segregation due to the impact caused by falling of the raw material powder when different types of raw material powders are transferred. The hopper for a raw material powder according to one embodiment of the present disclosure includes: a hopper body having an inner space in which the raw material powder is stored and including an outlet which is formed through the lower end thereof and through which the raw material powder is discharged; a transfer pipe to which the raw material powder discharged through the outlet is transferred and which has a region, through which the raw material powder is transferred, divided into a plurality of regions; and a slide gate unit disposed between the outlet and the transfer pipe to open or close the transfer pipe while adjusting a degree of opening of the transfer pipe.

Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Abstract: The present disclosure relates to an iron-based mixed powder having excellent uniformity, fluidity and moldability by applying polyamide as a binder, and a method for manufacturing the same. The iron-based mixed powder according to an embodiment of the present disclosure is composed of a mixture of a raw material of mixed powder in which iron-based powder and additive powder are mixed, and polyamide as a binder, wherein 0.03 to 1.50 parts by weight of the binder is mixed based on 100 parts by weight of the raw material of the mixed powder.

Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Abstract: A hopper and method for transferring raw material, which can prevent segregation due to the impact caused by falling of the raw material powder when different types of raw material powders are transferred. The hopper for a raw material powder according to one embodiment of the present disclosure includes: a hopper body having an inner space in which the raw material powder is stored and including an outlet which is formed through the lower end thereof and through which the raw material powder is discharged; a transfer pipe to which the raw material powder discharged through the outlet is transferred and which has a region, through which the raw material powder is transferred, divided into a plurality of regions; and a slide gate unit disposed between the outlet and the transfer pipe to open or close the transfer pipe while adjusting a degree of opening of the transfer pipe.

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.

Abstract: A coil component may include a core element, a coil conductor embedded in a surface of the core element, and a cover element bonded to the surface of the core element in which the coil conductor is embedded. Since the core element and the cover element are integrally formed, common failures, such as delamination or cracks, may be suppressed, and thereby product reliability may be improved.

Abstract: A chip electronic component includes a body including a coil portion disposed therein and a magnetic metallic powder, and a stress buffer layer disposed on a surface of the body. A Young's modulus of the stress buffer layer is less than that of the body.

Abstract: A common mode filter includes a lower cover layer including a first magnetic particle, a filter layer disposed on an upper surface of the lower cover layer, and including a coil portion including a plurality of coils and a coil peripheral portion including a second magnetic particle, and an upper cover layer disposed on an upper surface of the filter layer and including the first magnetic particle.

Abstract: There is provided a camera module including: a lens housing in which a lens is disposed; a glass cover formed of a transparent material and covering the lens housing; and a coil conductive part formed between an outer surface of the lens and an inner surface of the glass cover.