Abstract: Disclosed are a solder attachment jig and a method of manufacturing a semiconductor device using the same. The solder ball attachment jig, which arranges a solder ball to be aligned with a conductive post of a semiconductor wafer, can include a body and a receiving hole, which is formed on the body to hold the solder ball. Internal walls of the receiving hole that face each other are symmetrically inclined. Using the solder ball attachment jig in accordance with an embodiment of the present invention, the alignment of the solder ball can be improved while reducing the cost and simplifying the processes.

Abstract: Provided is a semiconductor device including a wafer having an electrode pad; an insulation layer that is formed on the wafer and has an exposure hole exposing the electrode pad; a redistribution layer that is formed on the insulation layer and the exposure hole of the insulation layer and has one end connected to the electrode pad; a conductive post that is formed at the other end of the redistribution layer; an encapsulation layer that is formed on the redistribution layer and the insulation layer such that the upper end portion of the conductive post is exposed; and a solder bump that is formed on the exposed upper portion of the conducive post.

Abstract: A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased.

Abstract: A printed circuit board for a package includes a first insulation layer, on one side of which an electronic component having a plurality of electrical contacts is mounted; a plurality of first bond pads formed on the other side of the first insulation layer in predetermined intervals, which are electrically connected with the electrical contacts; a second insulation layer stacked on the other side of the first insulation layer, with those portions removed where the first bond pads are formed; and a second bond pad, which is formed on a surface of the second insulation layer in correspondence with positions between the plurality of the first bond pads, and which is electrically connected with the electrical contacts. The bond pads can be implemented in two layers, as opposed to the case of forming the bond pads in one layer, in a predetermined area of a printed circuit board.

Abstract: A track jump method for an optical recording/reproducing medium is provided. In the track jump method, once a track jump command is input, a track jump operation is held until a falling edge of a header mask signal is detected. The track jump starts at the falling edge of the header mask signal and ends before a rising edge of the header mask signal so that a TZC signal is not influenced by a header during the track jump. Therefore, the track jump can be exactly and stably performed. In particular, when the track jump command is input, a PLL of a wobble signal is inhibited, and a PLL-wobble signal is held to a previous value obtained before the track jump is performed, during the track jump, or a header mask signal is generated using a read channel signal which is not influenced by a wobble period, until a wobble signal becomes stable after a trackjump. During a normal servo, a header mask signal is generated using a PLL-wobble signal to mask a header area.

Abstract: A track jump method for an optical recording/reproducing medium is provided. In the track jump method, once a track jump command is input, a track jump operation is held until a falling edge of a header mask signal is detected. The track jump starts at the falling edge of the header mask signal and ends before a rising edge of the header mask signal so that a TZC signal is not influenced by a header during the track jump. Therefore, the track jump can be exactly and stably performed. In particular, when the track jump command is input, a PLL of a wobble signal is inhibited, and a PLL-wobble signal is held to a previous value obtained before the track jump is performed, during the track jump, or a header mask signal is generated using a read channel signal which is not influenced by a wobble period, until a wobble signal becomes stable after a track jump. During a normal servo, a header mask signal is generated using a PLL-wobble signal to mask a header area.

Abstract: The present invention relates to an apparatus and method for detecting non-recording regions of an optical recording medium for recording data or reproducing the recorded data by detecting header regions of the optical recording medium.

Abstract: Method for controlling track jump in an optical recording medium for writing/reading data on/from land/groove tracks having depths different from each other in a direction of a beam incident, including the steps of (1) adjusting an offset of a servo error signal generated by using an optical signal reflected at the optical recording medium consistent to the land track, (2) adjusting an offset of a servo error signal generated by using an optical signal reflected at the optical recording medium consistent to the groove track, (3) selecting the servo error signal having the offset adjusted consistent to the land/groove track in the step (1) or (2) in response to a land/groove switching signal, (4) receiving a track jump command, and determining the track jump command of being an ‘N’(‘N’ is an odd numeral) track jump command, and (5) if the track jump command is determined of being an ‘N’(‘N’ is an odd numeral) track jump command in the step (4), after switching th

Abstract: A circuit it for deciding classes resulting from 8.times.8 DCT or 2.times.4.times.8 DCT blocks includes a block forming circuit for converting a digital video signal into a predetermined block structure, a mode deciding section for detecting still/motion of the digital video signal block to generate a mode signal, a DCT section for selectively performing the 8.times.8 DCT or 2.times.4.times.8 DCT upon the block supplied from the block forming circuit according to the mode signal of the mode deciding section, a controlling section for controlling DCT data coefficients output according to the mode signal from mode deciding section, a scanning section for zig-zag scanning data in an 8.times.8 activity detecting pattern upon the output of the 8.times.8 DCT block from the DCT section and zig-zag scanning data in a 2.times.4.times.8 activity detecting pattern upon the output of the 2.times.4.times.