Abstract: An vector modulator using a time delay and a phase shifter is disclosed, the vector modulator including a time delay (110) varying a phase of an input signal by time-delaying the input signal; a first coupler (120) converting the signal outputted in changed phase through the time delay to an I channel signal and a Q channel signal each having a 90° phase difference and outputting the I/Q channel signals; a first phase shifter (130) varying the phase of the I channel signal outputted from the first coupler within a predetermined phase range and outputting the phase-variable I channel signal; a second phase shifter (140) varying the Q channel signal outputted from the first coupler within a predetermined phase range and outputting the phase-variable Q channel signal; and a second coupler (150) coupling phase-variable I/Q channel signals and outputting the coupled signals.

Abstract: A method of manufacture of a shielded stacked integrated circuit packaging system includes: forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Abstract: The present disclosure relates to an antenna system, and more particularly, to an RFID antenna system capable of improving a tag recognition rate of a shelf antenna system by generating energy of electromagnetic waves on a shelf, and a method for controlling the same. An antenna system according to an embodiment includes a first antenna configured to operate in response to a first control signal, a second antenna configured to operate in response to a second control signal and receive information from an RFID tag, and a reader unit configured to generate the first or second control signal and obtain the RFID tag information received through the second antenna.

Abstract: Disclosed is a vector modulator. The vector modulator can control the amplitude and phase of an input signal, by not using amplitude variable attenuators but using phase shifters. Further, the vector modulator has a simple configuration and enables an input signal to be exactly modulated. Furthermore, the vector modulator can modulate the phase of an input signal throughout all areas in the polar coordinate system.

Abstract: An vector modulator using a time delay and a phase shifter is disclosed, the vector modulator including a time delay (110) varying a phase of an input signal by time-delaying the input signal; a first coupler (120) converting the signal outputted in changed phase through the time delay to an I channel signal and a Q channel signal each having a 90° phase difference and outputting the I/Q channel signals; a first phase shifter (130) varying the phase of the I channel signal outputted from the first coupler within a predetermined phase range and outputting the phase-variable I channel signal; a second phase shifter (140) varying the Q channel signal outputted from the first coupler within a predetermined phase range and outputting the phase-variable Q channel signal; and a second coupler (150) coupling phase-variable I/Q channel signals and outputting the coupled signals.

Abstract: An apparatus and method connect an Access Point (AP) in a portable terminal. More particularly, an apparatus and method designate a group of searched peripheral APs, and attempt an access to an AP corresponding to a group selected by a user in a portable terminal. The apparatus includes a group set unit and an AP search unit. The group set unit sets items of peripheral APs to a group according to user's selection. After searching the peripheral APs at the time of AP connection, the AP search unit classifies an AP belonging to a selected item and connects to the classified AP.

Abstract: An apparatus and method update data in a portable terminal. The apparatus comprises a data update unit and a controller. The data unit is configured to manage information associated with the portable terminal and a request for an address book update transmitted from the portable terminal. The controller is configured to receive changed address book information from an update server that manages an address book of another portable terminal in response to the request transmitted by the data update unit.

Abstract: A semiconductor wafer scale package system is provided including providing a semiconductor substrate having a through-hole via with a conductive coating, forming a filled via by filling the through-hole via with a conductive material, coupling a package substrate to the filled via, and singulating a chip scale package from the semiconductor substrate and the package substrate.

Abstract: A method of manufacture of a shielded stacked integrated circuit packaging system includes: forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Abstract: Disclosed is a gate system arranged on two gate frames and detects a tag passing between the two gate frames, the gate system including at least two gate frames that are vertically arranged facing with each other; at least two antenna units that are arranged on the at least two gate frames, respectively; and a reader that is arranged on each of the at least two gate frames and enables the at least two antenna units to emit electromagnetic wave to an article passing between the at least two gate frames using a predetermined frequency signal, and obtains information stored in a tag using a signal that the at least two antenna units receives from the at least two antenna units.

Abstract: A method of manufacture of a shielded stacked integrated circuit packaging system includes forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Abstract: Disclosed is an RF transceiver in which transmission and reception are simultaneously performed, wherein a magnitude of a transmission leakage signal mixed into a receiving signal is measured, the maximum and minimum scopes on I/Q vector phase-plane in which an offset vector exists is set using the measured magnitude of the transmission leakage signal, the offset vector offsetting the transmission leakage signal as much as possible, a detection area in which the offset vector exists is determined in the set scope, and the offset vector is detected.

Abstract: Disclosed is an RFID-based reader configured to allow a UHF band RFID reader unit to recognize an RFID tag in a short distance, and to minimize an erroneous recognition, the reader including a gate frame discretely installed at both sides of an entrance and exit, a parabolic surface type reflective plate perpendicularly installed inside of the gate frame, an array antenna arranged on the reflective plate for receiving a tag information transmitted from an RFID tag, and an RFID reader unit for controlling an operation of the array antenna and converting the tag information received from the array antenna to a tag data.

Abstract: A method of manufacture of an integrated circuit package system includes forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

Abstract: An integrated circuit package system is provided including forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.

Abstract: A method of manufacture of a shielded stacked integrated circuit packaging system includes forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Abstract: A shielded stacked integrated circuit package system is provided including forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

Abstract: An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.