Patents by Inventor Hyung Kun Kim
Hyung Kun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10276629Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.Type: GrantFiled: July 1, 2016Date of Patent: April 30, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong Kuk Lee, Yong Min Kwon, Hyung Kun Kim
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Patent number: 9997670Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.Type: GrantFiled: January 19, 2017Date of Patent: June 12, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ki Won Park, Yong Min Kwon, Hyung Kun Kim, Dong Kuk Lee, Dae Yeop Han
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Patent number: 9902902Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: GrantFiled: October 21, 2016Date of Patent: February 27, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun Joo Jang, Mi Yang Kim, Hyung Kun Kim, Shin Ae Jun, Yong Wan Jin, Seong Jae Choi
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Publication number: 20170365739Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.Type: ApplicationFiled: January 19, 2017Publication date: December 21, 2017Inventors: Ki Won PARK, Yong Min KWON, Hyung Kun KIM, Dong Kuk LEE, Dae Yeop HAN
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Patent number: 9691954Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillarType: GrantFiled: May 24, 2016Date of Patent: June 27, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-kuk Lee, Si-han Kim, Hyung-kun Kim, Yong-min Kwon, Geun-woo Ko
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Publication number: 20170069681Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.Type: ApplicationFiled: July 1, 2016Publication date: March 9, 2017Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong Kuk LEE, Yong Min KWON, Hyung Kun KIM
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Publication number: 20170037309Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: ApplicationFiled: October 21, 2016Publication date: February 9, 2017Inventors: Eun Joo JANG, Mi Yang KIM, Hyung Kun KIM, Shin Ae JUN, Yong Wan JIN, Seong Jae CHOI
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Publication number: 20170033268Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillarType: ApplicationFiled: May 24, 2016Publication date: February 2, 2017Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-kuk LEE, Si-han KIM, Hyung-kun KIM, Yong-min KWON, Geun-woo KO
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Publication number: 20160351755Abstract: In one embodiment, a light emitting device package includes a light emitting device including a substrate and a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, stacked on the substrate; a reflective conductive layer provided on the light emitting structure; and a first electrode and a second electrode overlying the reflective conductive layer separated from each other in a first region. The first electrode and the second electrode are electrically insulated from the reflective metal layer and penetrate through the reflective metal layer to be electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively.Type: ApplicationFiled: May 26, 2016Publication date: December 1, 2016Inventors: Dong Kuk LEE, Yong Min KWON, Hyung Kun KIM, Dae Yeop HAN
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Publication number: 20160329376Abstract: A light emitting diode (LED) package includes a package board having a first surface having a plurality of chip mounting regions and a second surface opposing the first surface, and including a plurality of first and second through electrodes disposed in the plurality of chip mounting regions, a plurality of LED chips disposed in the plurality of chip mounting regions of the first surface of the package board and each having one surface on which first and second electrodes are disposed, wherein the first and second electrodes are connected to the first and second through electrodes positioned in the chip mounting regions, and a connection electrode disposed on at least one of the first surface and the second surface of the package board, and connecting the first and second through electrodes.Type: ApplicationFiled: January 7, 2016Publication date: November 10, 2016Inventor: Hyung Kun Kim
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Patent number: 9475984Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: GrantFiled: February 14, 2014Date of Patent: October 25, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun Joo Jang, Mi Yang Kim, Hyung Kun Kim, Shin Ae Jun, Yong Wan Jin, Seong Jae Choi
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Publication number: 20160308089Abstract: Method of manufacturing a semiconductor light emitting device package are described. Semiconductor light emitting device packages includes may be formed by forming a plurality of light emitting diode chips having a structure in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially stacked on a wafer, forming a phosphor layer and an encapsulation layer on the first conductivity-type semiconductor layer, forming a texture on the encapsulation layer by removing a portion of the encapsulation layer from an upper surface thereof; and separating the plurality of light emitting diode chips from each other.Type: ApplicationFiled: January 11, 2016Publication date: October 20, 2016Inventors: Hyung Kun KIM, Si Han KIM, Yu Seung KIM, Jung Jin KIM
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Patent number: 9166120Abstract: There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.Type: GrantFiled: August 16, 2011Date of Patent: October 20, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Jung Hye Chae, Hyung Kun Kim, Se Hwan An
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Publication number: 20150295149Abstract: There are provided a light emitting diode (LED) package including a heat slug to have excellent heat dissipation efficiency and a manufacturing method thereof, the LED package including: a lead frame receiving power supplied thereto; an LED chip electrically connected to the lead frame; a heat slug provided with a mounting part having the LED chip mounted thereon and outwardly discharging heat generated by the LED chip; and a body part covering at least a portion of an outer circumferential surface of the heat slug, wherein at least a portion of a circumferential region of the body part has higher heat resistance than that of an internal region thereof.Type: ApplicationFiled: July 25, 2011Publication date: October 15, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak Hwan Kim, Hyung Kun Kim, Sung Kyong Oh
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Patent number: 9090817Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: GrantFiled: February 14, 2014Date of Patent: July 28, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun Joo Jang, Mi Yang Kim, Hyung Kun Kim, Shin Ae Jun, Yong Wan Jin, Seong Jae Choi
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Publication number: 20150060925Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.Type: ApplicationFiled: November 4, 2014Publication date: March 5, 2015Inventors: Hak Hwan KIM, Ho Sun PAEK, Hyung Kun KIM, Sung Kyong OH, Jong In YANG
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Patent number: 8901586Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.Type: GrantFiled: July 12, 2011Date of Patent: December 2, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Hak Hwan Kim, Ho Sun Paek, Hyung Kun Kim, Sung Kyong Oh, Jong In Yang
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Publication number: 20140197443Abstract: There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.Type: ApplicationFiled: August 16, 2011Publication date: July 17, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Jung Hye Chae, Hyung Kun Kim, Se Hwan An
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Publication number: 20140168965Abstract: An LED device according to an embodiment of the present invention may include a first LED light source unit including at least one first white LED and emitting white light of a first color temperature; a second LED light source unit including at least one second white LED and emitting white light of a second color temperature different from the first color temperature; and a variable resistor connected to at least one of the first LED light source unit and the second LED light source unit, being configured to control a current supplied to the at least one of the first LED light source unit and the second LED light source unit.Type: ApplicationFiled: August 16, 2011Publication date: June 19, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Mi Moon, Young Jin Lee, Jung Hye Chae, Hyung Kun Kim
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Publication number: 20140159075Abstract: A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.Type: ApplicationFiled: February 18, 2014Publication date: June 12, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Hyung-Kun KIM