Patents by Inventor Hyung Kun Kim
Hyung Kun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140158938Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: ApplicationFiled: February 14, 2014Publication date: June 12, 2014Applicant: SAMSUNG ELECTRONICS CO., LTDInventors: Eun Joo JANG, Mi Yang KIM, Hyung Kun KIM, Shin Ae JUN, Yong Wan JIN, Seong Jae CHOI
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Publication number: 20140158979Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: ApplicationFiled: February 14, 2014Publication date: June 12, 2014Applicant: SAMSUNG ELECTRONICS CO., LTDInventors: Eun Joo JANG, Mi Yang KIM, Hyung Kun KIM, Shin Ae JUN, Yong Wan JIN, Seong Jae CHOI
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Publication number: 20140160728Abstract: The present invention relates to a light emitting apparatus. According to one aspect of the present invention, the light emitting device comprises: a plurality of light emitting devices including a blue light emitting device emitting blue light and a UV light emitting device emitting ultraviolet light; and a wavelength conversion part arranged in the path of the light emitted from the plurality of light emitting devices, and provided with fluorescent substances to convert the wavelengths of the light emitted from the plurality of light emitting devices, wherein a fluorescent substance excited by and mixed with the blue light to obtain white light is arranged on a first area corresponding to the blue light emitting device, and at least a blue fluorescent substance is arranged on a second area corresponding to the UV light emitting device.Type: ApplicationFiled: August 17, 2011Publication date: June 12, 2014Applicant: Samsung Electronics Co., LtdInventors: Hyung Kun Kim, Suk Ho Chung, Ho Sun Paek, Jeong Wook Lee
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Patent number: 8748312Abstract: A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode substrate having at least one core on an upper surface thereof is formed such that the at least one core corresponds to the at least one through-hole. The electrode substrate is coupled to the substrate body by inserting the at least one core into the at least one through-hole. A portion of the coupled electrode substrate is removed except for the at least one core.Type: GrantFiled: December 20, 2012Date of Patent: June 10, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jong Wan Seo, Hyung Kun Kim
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Patent number: 8736181Abstract: There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.Type: GrantFiled: August 23, 2011Date of Patent: May 27, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Young Jin Lee, Hyung Kun Kim, Kyung Mi Moon
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Patent number: 8709840Abstract: A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.Type: GrantFiled: December 6, 2011Date of Patent: April 29, 2014Assignee: Samsung Electronics Co., Ltd.Inventor: Hyung-kun Kim
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Patent number: 8674379Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.Type: GrantFiled: July 3, 2013Date of Patent: March 18, 2014Assignee: Samsung Electronics Co., Ltd.Inventor: Hyung-kun Kim
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Patent number: 8664637Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: GrantFiled: July 29, 2011Date of Patent: March 4, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Eun Joo Jang, Mi Yang Kim, Hyung Kun Kim, Shin Ae Jun, Yong Wan Jin, Seong Jae Choi
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Patent number: 8658439Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.Type: GrantFiled: November 4, 2010Date of Patent: February 25, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Eun Joo Jang, Mi Yang Kim, Hyung Kun Kim, Shin Ae Jun, Yong Wan Jin, Seong Jae Choi
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Patent number: 8633643Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.Type: GrantFiled: November 30, 2010Date of Patent: January 21, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Young Jin Lee, Hyung Kun Kim
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Publication number: 20130320293Abstract: A semiconductor light emitting device package includes a base unit including a main body having electrical insulation properties and at least one pair of first and second through electrodes formed in the main body in a thickness direction thereof and formed of a semiconductor material, and a light emitting structure disposed on the base unit and including first and second conductivity type semiconductor layers and an active layer interposed there between. The manufacturing process thereof may be simplified, whereby a reduction in manufacturing costs and time may be achieved.Type: ApplicationFiled: June 3, 2013Publication date: December 5, 2013Applicant: Samsung Electronics Co., LtdInventors: Jong Wan SEO, Hyung Kun KIM
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Publication number: 20130285085Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.Type: ApplicationFiled: July 3, 2013Publication date: October 31, 2013Inventor: Hyung-kun KIM
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Patent number: 8558268Abstract: Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.Type: GrantFiled: December 23, 2008Date of Patent: October 15, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Hyung Kun Kim, Ho Sun Paek, Suk Ho Jung, Jeong Wook Lee
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Patent number: 8502240Abstract: Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.Type: GrantFiled: December 14, 2011Date of Patent: August 6, 2013Assignee: Samsung Electronics Co., Ltd.Inventor: Hyung-kun Kim
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Patent number: 8344399Abstract: There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.Type: GrantFiled: December 3, 2009Date of Patent: January 1, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Hak Hwan Kim, Sung Kyong Oh, Soo Jin Jung, Hyung Kun Kim
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Publication number: 20120305970Abstract: There is provided a light emitting device package including a substrate having a cavity therein; alight emitting device mounted on a bottom surface of the cavity; a first wavelength conversion part including a first phosphor for a wavelength conversion of light emitted from the light emitting device and covering the light emitting device within the cavity; and a second wavelength conversion part including a second phosphor allowing for emission of light having a wavelength different to that of the first phosphor and formed as a sheet on the first wavelength conversion part.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Inventor: Hyung Kun KIM
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Publication number: 20120307480Abstract: A light emitting diode (LED) module and a lighting apparatus using the same are disclosed. The LED module includes a circuit board to which at least one LED emitting light of a first wavelength range is mounted, a first wavelength conversion plate to convert the light of the first wavelength range, generated from the at least one LED, to light of a second wavelength range, and a plate control module connected with the first wavelength conversion plate by a first region to selectively dispose the first wavelength conversion plate on the at least one LED by rotatably moving the first wavelength conversion plate.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Inventor: Hyung Kun KIM
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Patent number: 8278671Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.Type: GrantFiled: February 24, 2012Date of Patent: October 2, 2012Assignee: Samsung LED Co., Ltd.Inventors: Suk Ho Jung, Hyung Kun Kim, Hak Hwan Kim, Young Jin Lee, Ho Sun Paek
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Publication number: 20120211780Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.Type: ApplicationFiled: February 24, 2012Publication date: August 23, 2012Applicant: Samsung LED Co., Ltd.Inventors: Suk Ho Jung, Hyung Kun Kim, Hak Hwan Kim, Young Jin Lee, Ho Sun Paek
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Patent number: 8247980Abstract: There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n?1) number (here, n is a positive integer satisfying n?2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n?1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches.Type: GrantFiled: October 31, 2008Date of Patent: August 21, 2012Assignee: Samsung LED Co., Ltd.Inventors: Young Jin Lee, Joong Kon Son, Hyung Kun Kim, Jung Ja Yang, Grigory Onushkin