Abstract: A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be electrically connected to the light emitting device, the first and second electrodes applying a current or voltage to the light emitting device and emitting heat generated by the light emitting device.

Abstract: Provided is a red phosphor which is excellent in emission efficiency by a long wavelength UV excitation source and has a fine and uniform particle size. The red phosphor includes a compound represented by (Li(2-z)-xMx)(AO4)y:Euz,Smq and a flux wherein M is K, Mg, Na, Ca, Sr, or Ba, A is Mo or W, 0?x?2, 0.5?y?5, 0.01?z?1.5, and 0.001?q?1.0. Provided is also a method of preparing the red phosphor.

Abstract: A plating method for a printed circuit board includes: a first step of providing a substrate having a plurality of connection pads and circuit patterns connected to the connection pads; a second step of using some of the circuit patterns provided on a surface of the substrate as a power connection portion and connecting the power connection portion to an external power source; a third step of covering a surface of the substrate excepting the connection pads with a plating resistance resist to shield it; a fourth step of supplying power to the connection pad through the power connection portion and forming a gold-plated layer on the connection pad; and a fifth step of making the power connection portion and the external power source to be electrically short. With this method, a printed circuit board without a power supply line for gold-plating can be obtained.

Abstract: A method for manufacturing a flexible printed circuit board having high productivity by making a flexible sheet rigid so that a process for manufacturing the flexible printed circuit board can be carried out on a rigid printed circuit board manufacturing system, includes: a laminating step of sequentially laminating a releasing member and sheets on one or both sides of an adhesive member, and adhering outer margins of the sheets to the adhesive member; an outer shaping step of cutting along both ends of the sheets, and a hole forming step of making holes for forming a circuit; a printed circuit board manufacturing step which is performed in the rigid printed circuit board manufacturing system; and a board separating step of separating the sheets from the adhesive member, and completing the flexible printed circuit board.