Abstract: A semiconductor device may include a fuse pattern and an interconnection pattern formed on a surface of a semiconductor substrate. An interlayer dielectric layer may be disposed on the surface of the semiconductor substrate including the fuse pattern and the interconnection pattern. A bonding pad may be formed over the interconnection pattern and connected to the interconnection pattern through the interlayer dielectric layer. A visible indicator may be formed in the interlayer dielectric layer near the bonding pad. The visible indicator may indicate a bonding region and a probing region of the bonding pad.

Abstract: An apparatus may include a sort circuit for receiving first and second baseband signals, where the sort circuit shifting frequencies of the first and second baseband signals. The apparatus may also include a removal circuit for receiving the shifted first and second baseband signals and for combining the shifted first and second baseband signals to provide a frequency-modulated signal, and a symbol timing restoration circuit for measuring a timing error in related symbols of the frequency-modulated signal, for generating an address selection signal that is proportional to the timing error, in response to a carrier restoration signal, and for indicating restoration of the carrier.