Patents by Inventor Ian HU
Ian HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20210134696Abstract: A semiconductor device package includes a substrate, an electronic component disposed on the substrate, a supporting structure disposed on the substrate and surrounding the electronic component, and a heat spreading structure disposed on the supporting structure. A length of the supporting structure and a length of the heat spreading structure are greater than a length of the substrate.Type: ApplicationFiled: November 6, 2019Publication date: May 6, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ian HU, Meng-Kai SHIH, Chih-Pin HUNG
-
Patent number: 10985085Abstract: A thermal conductive device includes a first conductive plate, a second conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The second conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The first portion and the second portion of the first conductive plate are respectively connected to the first portion and the second portion of the second conductive plate to define a chamber. The plurality of wicks are disposed within the chamber. The fluid is disposed within the chamber.Type: GrantFiled: May 15, 2019Date of Patent: April 20, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ian Hu, Chih-Pin Hung, Meng-Kai Shih
-
Publication number: 20210082782Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: September 16, 2019Publication date: March 18, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Han WANG, Ian HU
-
Publication number: 20210013118Abstract: A semiconductor package structure includes a package substrate, at least one semiconductor die, a heat dissipating device, at least one electronic device and a heat transmitting structure. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The heat dissipating device is thermally connected to the first surface of the package substrate. The electronic device is electrically connected to the second surface of the package substrate. The electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate. The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device.Type: ApplicationFiled: July 10, 2019Publication date: January 14, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-En Chen, Ian Hu, Chih-Pin Hung
-
Patent number: 10861726Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.Type: GrantFiled: September 21, 2018Date of Patent: December 8, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun Hung Tsai, Hsuan Yu Chen, Ian Hu, Meng-Kai Shih, Shin-Luh Tarng
-
Publication number: 20200365485Abstract: A thermal conductive device includes a first conductive plate, a second conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The second conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The first portion and the second portion of the first conductive plate are respectively connected to the first portion and the second portion of the second conductive plate to define a chamber. The plurality of wicks are disposed within the chamber. The fluid is disposed within the chamber.Type: ApplicationFiled: May 15, 2019Publication date: November 19, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ian HU, Chih-Pin HUNG, Meng-Kai SHIH
-
Publication number: 20200275030Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.Type: ApplicationFiled: February 25, 2019Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Han WANG, Ian HU, Meng-Kai SHIH, Hsuan Yu CHEN
-
Publication number: 20200266123Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.Type: ApplicationFiled: December 17, 2019Publication date: August 20, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-En CHEN, Ian HU, Jung-Che TSAI
-
Publication number: 20200161206Abstract: A semiconductor package structure includes a semiconductor die, at least one wiring structure, a metal support, a passive element, a plurality of signal vias, and a plurality of thermal structures. The semiconductor die has an active surface. The at least one wiring structure is electrically connected to the active surface of the semiconductor die. The metal support is used for supporting the semiconductor die. The passive element is electrically connected to the semiconductor die. The signal vias are electrically connecting the passive element and the semiconductor die. The thermal structures are connected to the passive element, and the thermal structures are disposed on a periphery of the at least one wiring structure.Type: ApplicationFiled: November 20, 2018Publication date: May 21, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ian HU, Cheng-Yu TSAI
-
Publication number: 20200111728Abstract: A semiconductor package structure includes a vapor chamber, a plurality of electrical contacts, a semiconductor die and an encapsulant. The vapor chamber defines an enclosed chamber for accommodating a working liquid. The electrical contacts surround the vapor chamber. The semiconductor die is disposed on the vapor chamber, and electrically connected to the electrical contacts through a plurality of bonding wires. The encapsulant covers a portion of the vapor chamber, portions of the electrical contacts, the semiconductor die and the bonding wires.Type: ApplicationFiled: September 23, 2019Publication date: April 9, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-En CHEN, Ian HU, Hung-Hsien HUANG
-
Publication number: 20200098605Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.Type: ApplicationFiled: September 21, 2018Publication date: March 26, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun Hung TSAI, Hsuan Yu CHEN, Ian HU, Meng-Kai SHIH, Shin-Luh TARNG
-
Publication number: 20200091036Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, a vapor chamber and a heat dissipating device. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The vapor chamber is thermally connected to a first surface of the semiconductor die. The vapor chamber defines an enclosed chamber for accommodating a first working liquid. The heat dissipating device is thermally connected to the vapor chamber. The heat dissipating device defines a substantially enclosed space for accommodating a second working liquid.Type: ApplicationFiled: September 10, 2019Publication date: March 19, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-En CHEN, Ian HU, Jin-Feng YANG
-
Publication number: 20200083143Abstract: An electronic device includes a main substrate, a semiconductor package structure and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate, and includes a die mounting portion, a semiconductor die and a cover structure. The semiconductor die is disposed on the die mounting portion. The cover structure covers the semiconductor die. The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die.Type: ApplicationFiled: September 10, 2019Publication date: March 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jung-Che TSAI, Ian HU, Chih-Pin HUNG
-
Patent number: 10522508Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate, an interposer disposed on the substrate, a conductive pillar disposed on the substrate, a first semiconductor device disposed on the interposer and electrically connected to the conductive pillar, a second semiconductor device disposed on the interposer, and an encapsulant surrounding the conductive pillar. The first semiconductor device includes a first conductive pad electrically connected to the interposer. The second semiconductor device includes a second conductive pad electrically connected to the interposer.Type: GrantFiled: May 1, 2018Date of Patent: December 31, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ian Hu, Ming-Han Wang, Tsun-Lung Hsieh, Chih-Yi Huang, Chih-Pin Hung
-
Publication number: 20190341368Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate, an interposer disposed on the substrate, a conductive pillar disposed on the substrate, a first semiconductor device disposed on the interposer and electrically connected to the conductive pillar, a second semiconductor device disposed on the interposer, and an encapsulant surrounding the conductive pillar. The first semiconductor device includes a first conductive pad electrically connected to the interposer. The second semiconductor device includes a second conductive pad electrically connected to the interposer.Type: ApplicationFiled: May 1, 2018Publication date: November 7, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ian HU, Ming-Han WANG, Tsun-Lung Hsieh, Chih-Yi HUANG, Chih-Pin HUNG
-
Patent number: 10453802Abstract: A semiconductor package structure includes a substrate, at least one first semiconductor element, a heat dissipation structure and an insulation layer. The at least one first semiconductor element is attached to the substrate, and has a first surface and a second surface opposite to the first surface. The first surface of the at least one first semiconductor element faces the substrate. The heat dissipation structure is disposed on the second surface of the at least one first semiconductor element. The insulation layer is disposed on the heat dissipation structure, and defines a plurality of openings extending through the insulation layer and exposing a plurality of exposed portions of the heat dissipation structure.Type: GrantFiled: August 30, 2017Date of Patent: October 22, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Ian Hu
-
Patent number: 10410942Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.Type: GrantFiled: November 27, 2017Date of Patent: September 10, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tsan-Hsien Chen, Ian Hu, Jin-Feng Yang, Shih-Wei Chen, Hui-Chen Hsu
-
Publication number: 20190164859Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.Type: ApplicationFiled: November 27, 2017Publication date: May 30, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tsan-Hsien CHEN, Ian HU, Jin-Feng YANG, Shih-Wei CHEN, Hui-Chen HSU
-
Publication number: 20190080975Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.Type: ApplicationFiled: September 11, 2017Publication date: March 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Hsuan LEE, Sung-Mao LI, Ming-Han WANG, Ian HU
-
Publication number: 20190067207Abstract: A semiconductor package structure includes a substrate, at least one first semiconductor element, a heat dissipation structure and an insulation layer. The at least one first semiconductor element is attached to the substrate, and has a first surface and a second surface opposite to the first surface. The first surface of the at least one first semiconductor element faces the substrate. The heat dissipation structure is disposed on the second surface of the at least one first semiconductor element. The insulation layer is disposed on the heat dissipation structure, and defines a plurality of openings extending through the insulation layer and exposing a plurality of exposed portions of the heat dissipation structure.Type: ApplicationFiled: August 30, 2017Publication date: February 28, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ian HU